公开(公告)号：US07982225B2

公开(公告)日：2011-07-19

申请号：US11964836

申请日：2007-12-27

申请人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

发明人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

IPC分类号： H01L33/00 ,  F28F7/00

CPC分类号： F21K9/00 ,  F21V29/51 ,  F21V29/75 ,  F21V29/763 ,  F21Y2115/10 ,  F28D15/0233 ,  F28F3/02 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device for removing heat from LED chips includes a heat sink and a plurality of substrates. The heat sink comprises a base plate. A plurality of fins extends upwardly from the base plate. The substrates each have a unidirectional heat transfer and are attached to a bottom face of the heat sink. Each of the substrates defines a first wall on which The LED chips are mounted and a second wall coupled to the heat sink. The substrates only transfer heat from the first wall to the second wall and restrict the heat transfer in a reverse direction. When the LED chips generate heat, the heat is transferred to the fins of the heat sink via the unidirectional substrates to lower temperature of the LED chips.

摘要翻译： 用于从LED芯片除去热量的散热装置包括散热器和多个基板。 散热器包括基板。 多个翅片从基板向上延伸。 基板各自具有单向热传递并且附接到散热器的底面。 每个基板限定了其上安装有LED芯片的第一壁和耦合到散热器的第二壁。 基板仅将热量从第一壁传递到第二壁并限制相反方向的热传递。 当LED芯片产生热量时，热量通过单向基板传递到散热器的散热片，降低LED芯片的温度。

公开(公告)号：US07753662B2

公开(公告)日：2010-07-13

申请号：US11309748

申请日：2006-09-21

申请人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

发明人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

IPC分类号： F04B17/00 ,  H05K5/00

CPC分类号： F04D13/0606

摘要： A miniature liquid cooling device includes a casing (10) defining a first chamber (102), a second chamber (104) and a third chamber (106) communicating with the first chamber. The first and the third chambers cooperatively form a work channel for liquid. An impeller (21) is rotatably mounted in the first chamber to circulate the liquid. A filter (17) is mounted in the second chamber and defines a plurality of orifices (1704). When the impeller rotates, first the liquid firstly enters the second chamber via an inlet. (122), and then the liquid flows through the filter within the second chamber, whereby air bubbles in the liquid leave the liquid and escape from the filter via the orifices. The escaped air bubbles enter the second chamber. The deaerated liquid flows into the work channel and finally is driven to low out of the liquid cooling device via an outlet (124).

摘要翻译： 微型液体冷却装置包括限定第一室（102）的壳体（10），与第一室连通的第二室（104）和第三室（106）。 第一和第三室协同地形成液体的工作通道。 叶轮（21）可旋转地安装在第一室中以使液体循环。 过滤器（17）安装在第二室中并限定多个孔（1704）。 当叶轮旋转时，首先液体首先通过入口进入第二室。 （122），然后液体在第二室内流过过滤器，由此液体中的气泡离开液体并经由孔从过滤器逸出。 逸出的气泡进入第二个室。 脱气液体流入工作通道，最后通过出口（124）被驱动到液体冷却装置的低温。

公开(公告)号：US07753108B2

公开(公告)日：2010-07-13

申请号：US11565910

申请日：2006-12-01

申请人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

发明人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

IPC分类号： F28F7/02

CPC分类号： G06F1/20 ,  F28F3/12 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cooling plate of a liquid cooling includes a chamber hermetically defined therein, an outlet, and an inlet. The outlet and the inlet communicate with the chamber for circulating liquid through the chamber. One of the outlet and the inlet is located in the other one of the outlet and the inlet.

摘要翻译： 液体冷却的冷却板包括气密地限定在其中的室，出口和入口。 出口和入口与室连通，以使液体循环通过室。 出口和入口之一位于出口和入口的另一个中。

公开(公告)号：US20100155019A1

公开(公告)日：2010-06-24

申请号：US12463379

申请日：2009-05-09

申请人： Zhi-Yong Zhou ,  Qiao-Li Ding ,  Hai-Bing Cao

发明人： Zhi-Yong Zhou ,  Qiao-Li Ding ,  Hai-Bing Cao

IPC分类号： F24F3/12 ,  F28F3/00

CPC分类号： F28D15/043 ,  F28F1/24 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： The disclosure relates to an evaporator and a loop heat pipe employing it. The evaporator includes a shell having an evaporation chamber and a compensation chamber defined therein, a partition being received in the shell and partitioning the evaporation chamber and the compensation chamber, and a wick structure being adhered to an inner wall of the shell corresponding to the evaporation chamber and extending through the partition and into the compensation chamber. The loop heat pipe includes the evaporator mentioned above, a pipe connecting two opposite ends of the evaporator to form a closed loop and a working medium contained in the closed loop.

摘要翻译： 本发明涉及一种采用该蒸发器和回路热管的回路热管。 蒸发器包括壳体，其具有限定在其中的蒸发室和补偿室，分隔件容纳在壳体中并且分隔蒸发室和补偿室，并且芯结构粘附到壳体的相应于蒸发的内壁 并且延伸穿过隔板并进入补偿室。 环路热管包括上述蒸发器，连接蒸发器的两个相对端的管道，以形成闭环和包含在闭环中的工作介质。

公开(公告)号：US20090267474A1

公开(公告)日：2009-10-29

申请号：US12134162

申请日：2008-06-05

申请人： Zhi-Yong Zhou ,  Qiao-Li Ding

发明人： Zhi-Yong Zhou ,  Qiao-Li Ding

IPC分类号： H01J1/02 ,  F21V21/00 ,  F21V29/00

CPC分类号： F21V29/763 ,  F21K9/00 ,  Y10S362/80

摘要： An LED lamp includes a heat dissipation device and a plurality of LED modules. The heat dissipation device includes a heat conductive member and a fin unit. The LED modules are attached to a top surface of a first plate of the heat conductive member. The heat conductive member comprises a plurality of posts embedded in the top surface of the first plate. Peripheries of the first and second plates are in a hermetical conjunction with each other to form a chamber containing phase-changeable working fluid therein. The first plate has a plurality of receiving recessions which are depressed downwardly from the top surface thereof and respectively receive the posts. Screws are used to extend through the LED modules to threadedly engage in the posts thereby to intimately mount the LED modules on the top surface of the first plate of the heat conductive member.

摘要翻译： LED灯包括散热装置和多个LED模块。 散热装置包括导热构件和翅片单元。 LED模块附接到导热构件的第一板的顶表面。 导热构件包括嵌入在第一板的顶表面中的多个柱。 第一和第二板的周边彼此密封结合以形成其中包含相变工作流体的室。 第一板具有从其顶表面向下压下并分别接收柱的多个接收凹部。 螺丝用于延伸通过LED模块以螺纹地接合在柱中，从而将LED模块紧密地安装在导热构件的第一板的顶表面上。

公开(公告)号：US07540636B2

公开(公告)日：2009-06-02

申请号：US11617117

申请日：2006-12-28

申请人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

发明人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

IPC分类号： B60Q1/06

CPC分类号： F21V29/51 ,  F21V29/004 ,  F21V29/763 ,  F21Y2115/10 ,  H01L2924/0002 ,  Y10S362/80 ,  H01L2924/00

摘要： An LED module includes a housing component, a frame holding an LED thereon and covered by the housing component, a fastener located in and secured to the housing component, a heat spreader located in the fastener and secured to the fastener and a heat transfer member having a heat-dissipating unit remote from the LED and a heat pipe thermally connecting with the heat spreader, the LED and the heat-dissipating unit. The housing component tightly presses the frame on the fastener to make a close contact between the heat pipe and the frame. The heat pipe transfers heat from the LED to the heat spreader and the heat-dissipating unit. The heat spreader and the heat-dissipating unit each have a large heat-dissipating surface, whereby the heat generated by the LED can be quickly dissipated by the heat spreader and the heat-dissipating unit.

摘要翻译： LED模块包括壳体部件，在其上保持LED并被壳体部件覆盖的框架，位于壳体部件中并固定到壳体部件上的紧固件，位于紧固件中并固定到紧固件的散热器和传热部件，传热部件具有 远离LED的散热单元和与散热器，LED和散热单元热连接的热管。 外壳部件将紧固件上的框架紧紧地按压在热管和框架之间的紧密接触。 热管将热量从LED传递到散热器和散热单元。 散热器和散热单元各自具有大的散热表面，由此由散热器和散热单元可以快速地消散由LED产生的热量。

公开(公告)号：US07375964B2

公开(公告)日：2008-05-20

申请号：US11309226

申请日：2006-07-13

申请人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

发明人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

IPC分类号： H05K7/20

CPC分类号： H01L23/3672 ,  H01L2924/0002 ,  H01L2924/00

摘要： A memory module assembly includes a pair of heat-dissipation plates (10), a printed circuit board (20) sandwiched between the heat-dissipation plates (10), and four clamps (30) for securing the heat-dissipation plates (10) onto opposite sides of the printed circuit board (20). Each clamp includes a connecting portion (32) and a pair of elastic pressing portions (34) extending from opposite free ends of the connecting portion. Each pressing portion has a pair of hooks (342) extending from opposite lateral sides thereof and an engaging portion extending (344) from a free end thereof and clamping on an end of the heat-dissipation plate. The hooks are inserted into openings (18) defined in the heat-dissipation plates and engage with inner surfaces of the heat-dissipation plates.

摘要翻译： 存储模块组件包括一对散热板（10），夹在散热板（10）之间的印刷电路板（20）和用于固定散热板（10）的四个夹具（30） 在印刷电路板（20）的相对侧上。 每个夹具包括连接部分（32）和从连接部分的相对的自由端延伸的一对弹性按压部分（34）。 每个按压部分具有从其相对侧面延伸的一对钩（342）和从其自由端延伸（344）并且夹持在散热板的端部上的接合部。 将钩插入到限定在散热板中的开口（18）中，并与散热板的内表面接合。

公开(公告)号：US07349220B2

公开(公告)日：2008-03-25

申请号：US11308849

申请日：2006-05-15

申请人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

发明人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

IPC分类号： H05K7/20

CPC分类号： H01L23/4093 ,  H01L23/3672 ,  H01L2924/0002 ,  H01L2924/00

摘要： A memory module assembly includes a printed circuit board (10) having a heat-generating electronic component (50) thereon, a pair of heat-dissipating plates (20) attached on the printed circuit board, and a pair of clamps (30) clamping the heat-dissipating plates and the printed circuit board therebetween. Each heat-dissipating plate includes a pair of supporters (28) and a handle (24) rotatably engaging with the supporters. The heat-dissipating plates are installed on the opposite sides of the printed circuit board by exerting a force to the handles to make them move toward each other wherein the force overcomes the spring force of the clamps.

摘要翻译： 存储模块组件包括其上具有发热电子部件（50）的印刷电路板（10），安装在印刷电路板上的一对散热板（20）和夹紧（30）的一对夹具 散热板和印刷电路板之间。 每个散热板包括一对支撑件（28）和与支撑件可旋转地接合的手柄（24）。 散热板通过向手柄施加力使它们彼此移动而安装在印刷电路板的相对侧上，其中力克服了夹具的弹簧力。

公开(公告)号：US20080062694A1

公开(公告)日：2008-03-13

申请号：US11309661

申请日：2006-09-07

申请人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

发明人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

IPC分类号： F21V29/00

CPC分类号： F21V29/56 ,  F21V29/70 ,  F21Y2115/10 ,  F28D1/0478 ,  F28D1/05366 ,  F28D15/00 ,  F28D2021/0029

摘要： A heat dissipation device for a light emitting diode (LED) module includes a liquid cooling system. The liquid cooling system includes a heat-absorbing member, which includes an inlet, an outlet and at least one pipe extending between the inlet and the outlet. The inlet and the outlet are provided for permitting liquid to flow through the at least one pipe, which is in thermal contact with at least one LED of the LED module.

摘要翻译： 用于发光二极管（LED）模块的散热装置包括液体冷却系统。 液体冷却系统包括吸热构件，其包括入口，出口和在入口和出口之间延伸的至少一个管。 入口和出口设置成允许液体流过与LED模块的至少一个LED热接触的至少一个管道。

公开(公告)号：US20070263361A1

公开(公告)日：2007-11-15

申请号：US11308849

申请日：2006-05-15

申请人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

发明人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

IPC分类号： H05K7/20

CPC分类号： H01L23/4093 ,  H01L23/3672 ,  H01L2924/0002 ,  H01L2924/00

摘要： A memory module assembly includes a printed circuit board (10) having a heat-generating electronic component (50) thereon, a pair of heat-dissipating plates (20) attached on the printed circuit board, and a pair of clamps (30) clamping the heat-dissipating plates and the printed circuit board therebetween. Each heat-dissipating plate includes a pair of supporters (28) and a handle (24) rotatably engaging with the supporters. The heat-dissipating plates are installed on the opposite sides of the printed circuit board by exerting a force to the handles to make them move toward each other wherein the force overcomes the spring force of the clamps.

摘要翻译： 存储模块组件包括其上具有发热电子部件（50）的印刷电路板（10），安装在印刷电路板上的一对散热板（20）和夹紧（30）的一对夹具 散热板和印刷电路板之间。 每个散热板包括一对支撑件（28）和与支撑件可旋转地接合的手柄（24）。 散热板通过向手柄施加力使它们彼此移动而安装在印刷电路板的相对侧上，其中力克服了夹具的弹簧力。