公开(公告)号：US12165485B2

公开(公告)日：2024-12-10

申请号：US17612861

申请日：2020-05-28

Applicant: Minimax Viking Patent Management Gmbh

Inventor： Hauke Dittmer ,  Dirk Siemer ,  Bernd Ziems

IPC: G01J5/00 ,  G01J5/02 ,  G01J5/04 ,  G01J5/0818 ,  G01J5/0875 ,  G02B6/10 ,  G02B6/36 ,  G02B6/42 ,  G08B17/12

Abstract: The present invention relates to a light guiding arrangement (1) for transmitting electromagnetic radiation, in particular ultraviolet and/or infrared radiation, and a spark and/or flame detector that uses same. The light guiding arrangement (1) comprises a housing (10) and a light guiding rod (20), wherein the housing (10) has a light entrance opening (12) and a light exit opening (14) situated opposite, wherein the light guiding rod (20) is arranged in the housing (10) between the light entrance opening (12) and the light exit opening (14), wherein the light guiding rod (20) is mounted resiliently on at least one side in the housing (10).

公开(公告)号：US20240385046A1

公开(公告)日：2024-11-21

申请号：US17913802

申请日：2020-10-12

Applicant: Joon Sub LEE

Inventor： Joon Sub LEE

IPC: G01J5/0875 ,  G01J5/00 ,  G01J5/48

Abstract: A window for far-infrared thermal imaging sensor assembly, according to the present invention, comprises: an incident surface on which far-infrared rays are incident; and an opposing surface facing a thermal imaging sensor, wherein the window for a far-infrared thermal imaging sensor assembly is bonded to an upper portion of the far-infrared thermal imaging sensor so as to transmit the far-infrared ray toward the far-infrared thermal imaging sensor, and the incidence surface is subjected to a refraction reduction treatment of the incident far-infrared rays compared to the refraction occurring on a flat surface of a same material.

公开(公告)号：US20240159592A1

公开(公告)日：2024-05-16

申请号：US18510897

申请日：2023-11-16

Applicant: Science Applicaions International Corporation

Inventor： David M. MORRIS ,  John P. TIMLER

IPC: G01J5/0875

CPC classification number: G01J5/0875

Abstract: Infrared transparent constructs (e.g., infrared transparent windows) may be shaped as a dome (e.g., for an infrared detector system) and/or other desired geometries, such as portions of IR seeker domes. Electrically conductive tracing(s) may be printed in desired shapes and forms, e.g., in the form of EMI shielding, an FSS grid, an anti-static component, electrical connectors, etc., and integrated into the interior of the construct structure. The electrically conductive tracing(s) may be printed between layers of independent infrared transparent window components that are then engaged together to form a window preform. Additionally or alternatively, the electrically conductive tracing(s) may be printed between printed layers of infrared transparent ceramic or plastic material built up to form the window preform. Once formed, the window preform may be sintered, e.g., in an ultrafast high temperature sintering process (and optionally further treated) to produce the final infrared transparent construct.

公开(公告)号：US20240110268A1

公开(公告)日：2024-04-04

申请号：US18519781

申请日：2023-11-27

Applicant: James William MASTEN, JR.

Inventor： James William MASTEN, JR.

IPC: C22F1/04 ,  F27D5/00 ,  F27D11/00 ,  G01J5/0875 ,  G01K1/14 ,  H05B3/00

CPC classification number: C22F1/04 ,  F27D5/00 ,  F27D11/00 ,  G01J5/0875 ,  G01K1/14 ,  H05B3/0061

Abstract: A system for heat treating a part includes an oven chamber, a first infrared (IR) emitter configured to deliver a first amount of IR energy to a first region of the part, a second IR emitter configured to deliver a second amount of IR energy different from the first amount of energy to a second region of the part, and a receiver with an outer surface configured to contact a second surface of the part and shield the second surface of the part from infrared radiation. The part can be heat treated by delivering different amounts of IR energy to the first and second regions of the part. The system can be used to heat treat different thicknesses of a part without overheating a thinner region, or to apply different heat treatments to the different regions.

公开(公告)号：US20230032079A1

公开(公告)日：2023-02-02

申请号：US17732530

申请日：2022-04-29

Applicant: PIXART IMAGING INC.

Inventor： Yen-Chang CHU ,  Po-Wei YU ,  Yen-Po CHEN ,  Chih-Ming SUN

IPC: G01J5/10 ,  G01J5/0875

Abstract: There is provided a thermometer structure including a circuit board, an infrared thermometer, a heat sink and a metal block. The infrared thermometer is arranged on the circuit board and electrically connected thereto. The heat sink is arranged on the circuit board and covers the infrared thermometer. The metal block is in contact with at least one of the circuit board and the heat sink to stabilize a local temperature of the thermometer structure.

公开(公告)号：US20220187133A1

公开(公告)日：2022-06-16

申请号：US17424845

申请日：2020-01-21

Applicant: Georgia Tech Research Corporation

Inventor： Min Zhou ,  Amirreza Keyhani ,  Rong Yang

IPC: G01J5/08 ,  G01J5/80 ,  G01J5/0875 ,  G01J5/04 ,  G02B27/14 ,  G06T7/80 ,  H04N17/00 ,  H04N5/225 ,  H04N5/04

Abstract: An embodiment provides a system for measuring temperature and deformation fields of at least a portion of a sample, comprising a visible light camera, an infrared camera, and a beam splitter. The visible light camera is at a first location with respect to the sample and can take a visible light image of at least a portion of the sample at a first time. The infrared camera is at a second location with respect to the sample and can take an infrared image of the at least a portion of the sample at the first time. The beam splitter can receive a beam of light, comprising infrared and visible light, traveling in a direction normal to the at least a portion of the sample and direct the infrared light to the infrared camera and the visible light to the visible light camera.