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公开(公告)号:US20230031084A1
公开(公告)日:2023-02-02
申请号:US17963973
申请日:2022-10-11
摘要: Techniques to test infrared detectors are disclosed. In one example, a focal plane array for an imaging system includes a plurality of infrared detectors arranged in a plurality of rows and columns where each of the infrared detectors is configured to provide an output signal in response to externally received thermal radiation associated with a scene. A plurality of offset circuits of the imaging system may be electrically coupled to the focal plane array and configured to selectively superimpose fixed-pattern noise on the output signals to provide modified output signals. A readout integrated circuit of the imaging system may be configured to provide the modified output signals for processing to test an integrity of the infrared detectors. Modified output signals that are outside an expected output range based on the thermal radiation and known offset may be determined defective. Related methods, devices, and systems are also provided.
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公开(公告)号:US20230026139A1
公开(公告)日:2023-01-26
申请号:US17868975
申请日:2022-07-20
申请人: ABB Schweiz AG
发明人: Joerg Ostrowski , Stephan Wildermuth , Ralf Gitzel , Patrik Reto Kaufmann , Joerg Gebhardt , Kai Koenig , Boguslaw Samul
IPC分类号: G01J5/80
摘要: A system and method includes at least one temperature sensor, a processing unit, and an output unit. The temperature sensor acquires a temperature measurement at a first location of an operational device, which first location is in thermal contact with a second location of the operational device. The processing unit selects a simulated temperature distribution of the first location of a simulated device from a plurality of simulated temperature distributions of the first location and compares the temperature measurement with simulated temperature distributions of the first location, and determines whether a hot spot exists or is developing at the second location. The determination comprises utilization of a correlation between the simulated temperature distribution of the first location and the second location for the selected simulated temperature distribution of the first location of the simulated device.
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公开(公告)号:US11457205B2
公开(公告)日:2022-09-27
申请号:US17109770
申请日:2020-12-02
申请人: Axis AB
发明人: Thomas Winzell , Jesper Bengtsson , Mats Bylander
摘要: Methods and apparatus, including computer program products, for detecting malfunction in a thermal camera. A first average response value is determined for a first shutter image captured by an image sensor in the thermal camera. A second average response value is determined of a second shutter image captured by the image sensor in the thermal camera. The first average response value and the second average response value are compared. In response to determining that the first average response value and the second average response value differ by more than a predetermined value, an indication of a malfunction of the thermal camera is provided.
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公开(公告)号:US11378458B2
公开(公告)日:2022-07-05
申请号:US15984176
申请日:2018-05-18
申请人: Teledyne FLIR, LLC
IPC分类号: G01J5/00 , G01J5/02 , H02S50/00 , G01J5/061 , G06V20/13 , G01J5/06 , H04N5/235 , H04N5/243 , H04N5/33 , B64C39/02 , G03B15/00 , G08G5/00 , H02S50/15 , H04N7/18 , G01J5/80 , H02J4/00 , H04W84/18
摘要: Flight based infrared imaging systems and related techniques, and in particular UAS based thermal imaging systems, are provided to improve the monitoring capabilities of such systems over conventional infrared monitoring systems. An infrared imaging system is configured to compensate for various environmental effects (e.g., position and/or strength of the sun, atmospheric effects) to provide high resolution and accuracy radiometric measurements of targets imaged by the infrared imaging system. An infrared imaging system is alternatively configured to monitor regulatory limitations on operation of the infrared imaging system and adjust and/or disable operation of the infrared imaging systems accordingly.
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公开(公告)号:US20220187133A1
公开(公告)日:2022-06-16
申请号:US17424845
申请日:2020-01-21
发明人: Min Zhou , Amirreza Keyhani , Rong Yang
IPC分类号: G01J5/08 , G01J5/80 , G01J5/0875 , G01J5/04 , G02B27/14 , G06T7/80 , H04N17/00 , H04N5/225 , H04N5/04
摘要: An embodiment provides a system for measuring temperature and deformation fields of at least a portion of a sample, comprising a visible light camera, an infrared camera, and a beam splitter. The visible light camera is at a first location with respect to the sample and can take a visible light image of at least a portion of the sample at a first time. The infrared camera is at a second location with respect to the sample and can take an infrared image of the at least a portion of the sample at the first time. The beam splitter can receive a beam of light, comprising infrared and visible light, traveling in a direction normal to the at least a portion of the sample and direct the infrared light to the infrared camera and the visible light to the visible light camera.
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公开(公告)号:US11614367B2
公开(公告)日:2023-03-28
申请号:US16974132
申请日:2020-10-13
申请人: Fredrick S. Solheim
发明人: Fredrick S. Solheim
摘要: Apparatus and methods are disclosed utilizing selected infrared waveband observations to determine selected profiles of interest. A correlative system is constructed and installed at a processor. Thermal and refractivity profiles and structure in a waveband of interest are extracted from observed infrared spectrum single waveband observations received for processing at the processor by the correlative system. The output provides the selected profiles of interest in the waveband of interest. The apparatus includes an infrared receiver and means for measuring angular displacement of received emissions relative to a horizon. The processor converts received emission into equivalent Planck blackbody temperatures across the observations and correlates structure and vertical distribution of the temperatures to provide thermodynamic and refractivity profiles of interest.
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公开(公告)号:US20230043515A1
公开(公告)日:2023-02-09
申请号:US16401169
申请日:2019-05-02
申请人: ELATRONIC AG
发明人: Heinrich Weder , Reto Keller , Werner Meier
摘要: Remote temperature measurement of cookware through a ceramic glass plate using an infrared sensor, taking into account the emissivity of the cookware which is continuously evaluated, and taking into account the temperature of the ceramic glass plate.
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公开(公告)号:US11561322B2
公开(公告)日:2023-01-24
申请号:US16396396
申请日:2019-04-26
发明人: Tobias Grosse-Puppendahl , James Scott , Rinku Sreedhar , John Franciscus Marie Helmes , Hanchuan Li
摘要: A method of detecting presence and location uses sensor data received from a plurality of thermopiles, each thermopile having a different field of view. In response to detecting a change in the sensor data, stored background values for each field of view are accessed and then the location of a body (e.g. a human or animal)is determined based on differences between the sensor data and sensor values predicted using a forward model and the stored background values for each field of view. Having determined the location, the stored background values are updated based on differences between the sensor data and the predicted sensor values for a body at the determined location.
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公开(公告)号:US20220404204A1
公开(公告)日:2022-12-22
申请号:US17721695
申请日:2022-04-15
发明人: Riley Hanus , Samuel Graham, Jr.
IPC分类号: G01J5/00 , G01N21/17 , H01L21/02 , G01J5/80 , G01N21/55 , G01J5/08 , C23C14/06 , C09D5/26 , C09D7/65
摘要: Disclosed herein are thermoreflectance enhancement coatings and methods of making and use thereof.
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公开(公告)号:US20220383460A1
公开(公告)日:2022-12-01
申请号:US17741984
申请日:2022-05-11
发明人: Gianluca Dorini
摘要: A method for correcting thermal image distortion in a thermal camera in an apparatus for the layer-by-layer manufacture of three-dimensional objects, the thermal camera comprising a plurality of sensor pixels arranged along a first direction; the method comprising the steps of: (a) causing a temperature reference to be at a first steady state temperature; (b) moving the temperature reference at the first steady state temperature through a plurality of positions along the first direction through the field of view of the thermal camera; (c) recording a plurality of thermal images with the thermal camera while moving the temperature reference during step (b), each thermal image corresponding to one of the plurality of positions and comprising the detected temperature of the temperature reference as detected by at least one pixel of the plurality of sensor pixels; (d) identifying the at least one pixel that detected the temperature of the temperature reference within a respective thermal image at the corresponding one of the plurality of positions; (e) constructing a thermal map from the identified pixels representing the detected temperature of the temperature reference at the plurality of positions; (f) generating a correction matrix for the identified pixels based on comparison between the thermal map and the first steady state temperature; and (g) applying the correction matrix to subsequent measurements of the thermal camera. A controller and an apparatus for the layer-by-layer manufacture of three-dimensional objects comprising the controller to carry out the method are also provided.
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