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公开(公告)号：US11467704B2
公开(公告)日：2022-10-11
申请号：US17128413
申请日：2020-12-21
发明人： Do Hyoung Kwon , Ji Yeon Kim , Ki Deok Lee , Cheol Hun Lee
IPC分类号： G06F3/044 , G02F1/1333 , H01L51/52 , G02B5/30 , H01L27/32
摘要： A touch sensor according to an embodiment of the present invention includes a substrate layer, sensing electrodes disposed on the substrate layer, an insulating layer covering the sensing electrodes on the substrate layer, a bridge electrode electrically connecting neighboring sensing electrodes of the sensing electrodes on the insulating layer, and floating electrodes distributed around the bridge electrode on the insulating layer.
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公开(公告)号：US11467698B2
公开(公告)日：2022-10-11
申请号：US17047604
申请日：2019-04-16
发明人： Gwang Yong Tak , Junha Kim , Ji-Yeon Kim
IPC分类号： G06F3/044 , G02F1/1333 , H01L51/52 , G02F1/13363 , G02F1/1335
摘要： A touch sensor includes a substrate and first and second touch sensor electrode layers. The first touch sensor electrode layer is disposed on a first surface of the substrate, and includes a first pad formed on an opposing surface to a surface in contact with the substrate. The second touch sensor electrode layer is disposed on a second surface of the substrate, exposes at least a portion of the surface in contact with the substrate to an outside of the substrate, and includes a second pad formed on the portion exposed to the outside of the surface in contact with the substrate. The first pad and the second pad do not overlap in a stacking direction.
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43.发明申请公开(公告)号：US20220312594A1
公开(公告)日：2022-09-29
申请号：US17838374
申请日：2022-06-13
发明人： Dong Pil PARK , Byung Jin CHOI , Na Yeon KIM
摘要： A printed circuit board according to an embodiment of the present invention includes a core layer and a circuit wiring layer disposed on a top surface of the core layer. The core layer is spaced apart from the circuit wiring layer and includes through-holes formed around the circuit wiring layer. Flexibility of the printed circuit board may be enhanced by the through-hole to obtain bending stability.
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公开(公告)号：US11455065B2
公开(公告)日：2022-09-27
申请号：US17365159
申请日：2021-07-01
发明人： Yong Soo Park , Sung Woo Yu , Jae Hyun Lee , Keon Kim , Ju In Yoon
摘要： A touch sensor according to an embodiment of the present invention includes a base layer, a first electrode layer disposed on the base layer, and a second electrode layer disposed at an upper level of the first electrode layer. The first electrode layer includes a plurality of first sensing electrode rows extending in a first direction parallel to a top surface of the base layer, and first traces branched from each of the first sensing electrode rows and alternately distributed on both lateral portions of the base layer. The second electrode layer includes a plurality of second sensing electrode columns extending in a second direction that is parallel to the top surface of the base layer and intersects the first direction, and second traces branching from the second sensing electrode columns.
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公开(公告)号：US20220210923A1
公开(公告)日：2022-06-30
申请号：US17554144
申请日：2021-12-17
发明人： Ki Joon PARK , Sung Jin NOH , Jungu LEE
摘要： A circuit board includes a base layer, an electrode layer formed on the base layer, a passivation layer formed on the electrode layer while opening a part of the electrode layer, and a surface treatment layer formed on the open surface of the electrode layer. The surface treatment layer may contain 70 to 40% of copper and 30 to 60% of nickel.
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公开(公告)号：US20220210915A1
公开(公告)日：2022-06-30
申请号：US17554101
申请日：2021-12-17
发明人： Ki Joon Park , Sung Jin Noh , Jungu Lee
摘要： A circuit board includes a base layer, a seed layer formed on the base layer, and a first electrode layer formed on the seed layer. The seed layer is formed of a metal oxide with a thickness of 100 to 400 Å. he circuit board may further include an insulation layer formed on the first electrode layer and a second electrode layer formed on the insulation layer.
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公开(公告)号：US11366559B2
公开(公告)日：2022-06-21
申请号：US16994897
申请日：2020-08-17
发明人： Yun Seok Oh , Young Jun Lee , Yoon Ho Huh
摘要： An antenna laminate according to an embodiment of the present invention includes a first dielectric layer and an antenna electrode layer disposed above a first ground layer, and a second dielectric layer and a second ground layer disposed below the first ground layer. The first ground layer and the second ground layer may form a ground composite to improve signal characteristics of the antenna.
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公开(公告)号：US11360612B2
公开(公告)日：2022-06-14
申请号：US17109014
申请日：2020-12-01
发明人： Byung Hoon Song , Dong Ki Keum , Dae Chul Park , Sun Young Song , Hwansil Jang
摘要： Provided is a conductive pattern having at least one unit conductive pattern forming one touch pixel according to an aspect of the present invention. The at least one unit conductive pattern includes a plurality of nanostructures each having opposite ends. A ratio of nanostructures, both opposite ends of which are in contact with edges of the at least one unit conductive pattern to all nanostructures included in the at least one unit conductive pattern is 70% or more.
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公开(公告)号：US11342686B2
公开(公告)日：2022-05-24
申请号：US16929309
申请日：2020-07-15
发明人： Jong Min Kim , Dong Pil Park , Yoon Ho Huh , Won Bin Hong
摘要： A film antenna according to an embodiment of the present invention includes a dielectric layer, and a plurality of radiation patterns commonly arranged on an upper surface of the dielectric layer and forming a phased array. Directivity and gain property of a signal may be improved. The film antenna may be applied to a display device including a mobile communication device capable of transmitting and receiving in 3G or higher, for example, 5G of high-frequency band, to improve radiation properties and optical properties such as transmittance.
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公开(公告)号：US20220158328A1
公开(公告)日：2022-05-19
申请号：US17525016
申请日：2021-11-12
发明人： Na Yeon KIM , Young Ju KIM , Won Hee LEE
摘要： An antenna package according to an embodiment of the present disclosure includes an antenna device including an antenna unit, and a flexible circuit board electrically connected to the antenna unit. The flexible circuit board has a bending area. The flexible circuit board includes a core layer having a first surface and a second surface facing each other, a signal wiring disposed on the first surface of the core layer and electrically connected to the antenna unit, a ground line disposed on the first surface of the core layer to be spaced apart from the signal wiring, a ground layer disposed on the second surface of the core layer, and a via structure penetrating a portion of the core layer in a region excluding the bending area and connecting the ground line and the ground layer with each other.
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