Abstract:
A method to form contacts in an integrated circuit device comprising to eliminate shorting between adjacent contacts due to dielectric layer voids is achieved. A substrate is provided. Narrowly spaced conductive lines are provided on the substrate. A dielectric layer is deposited overlying the conductive lines and the substrate. The dielectric layer is etched through to the top surface of the substrate in areas defined by lithographic mask to form contact openings between adjacent narrowly spaced conductive lines. An insulating layer is deposited overlying the dielectric layer and filling the contact openings wherein the insulating layer forms a lining layer inside the contact openings and fills any voids in the dielectric layer extending out of the contact openings. The insulating layer is etched through to expose the top surface of the substrate. A conductive layer is deposited overlying the dielectric layer and filling the contact openings. The conductive layer is etched as defined by lithographic mask. A passivation layer is deposited overlying the conductive layer and the dielectric layer. The integrated circuit device is completed.
Abstract:
A method to form contacts in an integrated circuit device comprising to eliminate shorting between adjacent contacts due to dielectric layer voids is achieved. A substrate is provided. Narrowly spaced conductive lines are provided on the substrate. A dielectric layer is deposited overlying the conductive lines and the substrate. The dielectric layer is etched through to the top surface of the substrate in areas defined by lithographic mask to form contact openings between adjacent narrowly spaced conductive lines. An insulating layer is deposited overlying the dielectric layer and filling the contact openings wherein the insulating layer forms a lining layer inside the contact openings and fills any voids in the dielectric layer extending out of the contact openings. The insulating layer is etched through to expose the top surface of the substrate. A conductive layer is deposited overlying the dielectric layer and filling the contact openings. The conductive layer is etched as defined by lithographic mask. A passivation layer is deposited overlying the conductive layer and the dielectric layer. The integrated circuit device is completed.
Abstract:
A method for forming protection layers completely around a metal fuse to protect the metal fuse 74A and metal lines 74B from moisture corrosion from fuse opening and micro-cracks in dielectric layers. The invention surrounds the fuse on all sides with two protection layers: a bottom protection layer 70 and a top protection layer 78. The top protection layer 78 is formed over the fuse metal, the sidewalls of the metal fuse and the bottom protection layer 70. The protection layers 70 78 of the invention form a moisture proof seal structure around the metal fuse 74A and protect the metal fuse 74A and metal lines 74B from moisture and contaminates.
Abstract:
A method can include receiving, at a controller for an internal combustion engine, the controller having one or more processors, an intake manifold absolute pressure (MAP) signal indicative of an air pressure in an intake manifold of the engine. The method can include processing, at the controller, the MAP signal in a crank angle domain to obtain distinct portions of the MAP signal corresponding to cylinders of the engine, respectively. The method can include calculating, at the controller, a valve stuck index value based on the distinct portions of the MAP signal. The method can also include detecting, at the controller, one or more stuck valves of the engine based on the valve stuck index value and one or more thresholds.
Abstract:
A technique can include receiving, at a controller for a vehicle, the controller including one or more processors, a signal indicative of a pressure in an intake manifold of an engine of the vehicle. The vehicle can include a supercharger configured to supply pressurized air to the intake manifold. The supercharger can be driven by a crankshaft of the engine via a belt. The technique can include estimating, at the controller, a frequency of the signal to obtain an estimated frequency. The technique can include determining, at the controller, whether the belt is slipping based on a comparison between the estimated frequency and a predetermined frequency. The technique can also include outputting, at the controller, a notification when the belt is determined to be slipping.
Abstract:
Embodiments are described in terms of selective methods of sealing separators and jellyroll electrode assemblies and cells made using such methods. More particularly, methods of selectively heat sealing separators to encapsulate one of two electrodes for nickel-zinc rechargeable cells having jellyroll assemblies are described. Selective heat sealing may be applied to both ends of a jellyroll electrode assembly in order to selectively seal one of two electrodes on each end of the jellyroll.
Abstract:
Targeted coagulation factors comprising a coagulation factor linked with at least one domain that specifically binds to a membrane protein on a blood cell is provided. The disclosed targeted coagulation factors increase the efficiency of coagulation factors and prolong their duration of action and thus, are an improvement for the treatment of hematological diseases such as hemophilia A.