Abstract:
A fluid treatment device including a source of electrical voltage having a first and second terminal, a pulse generator connected to the first terminal and the second terminal and outputting a pulsed voltage wave signal between a third terminal and a fourth terminal, at least one coil positioned adjacent at least one fluid conduit, being electrically connected to the third and fourth terminals and at least one capacitor also being electrically connected to the third and fourth terminals to form a first circuit with an inductance L, a capacitance C and a resonant frequency. The pulse generator is arranged to generate a pulsed voltage wave with a frequency approximately equal to the resonant frequency. A further circuit element is arranged to cause the voltage pulse reaching the coil to repeatedly, alternate between a period of pulsed voltage at the frequency and a period of zero voltage, with each period extending for a time in a range of approximately 2 to 33 milliseconds.
Abstract:
Described is a space-conserving integrated fluid delivery system particularly useful for gas distribution in semiconductor processing equipment. The system includes integrated fluid flow network architecture, and may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded. Subsequent to diffusion bonding, a stainless steel diffusion bonded part may advantageously be treated to enhance corrosion resistance using a series of steps designed to bring more chromium to the surface of the steel.
Abstract:
A method and apparatus that solve the problem of accurate measurement of gas flow so that the delivery of gases in semiconductor processing may be performed with greater confidence and accuracy by performing real-time characterization of a lead-line for mass flow controller (MFC) flow verification are provided. In one embodiment a mass flow verifier (MFV) provides rate of rise information to a controller via a digital interface without correcting for lead-line influences. After receiving the rate of rise data from the tool host computer computes a gas mass correction factor in real-time based on at least one of the following: MFC temperature sensor data, lead-line temperature sensor data, lead-line pressure transducer data, and lead-line volume. The rate of rise data and gas mass correction factor are used to compute accurate mass flow. The accurate mass flow information may be used to calibrate the MFC.