Abstract:
A dual damascene process can be used to form an interconnect. A first dielectric layer is formed on a semiconductor substrate having a device layer formed thereon. A stop layer is formed on the first dielectric layer and a second dielectric layer is formed on the stop layer. A hard mask layer is formed and patterned on the second dielectric layer so that an opening is formed to expose the second dielectric layer therewithin. The second dielectric layer, the stop layer and a part of the first dielectric layer are etched within the opening by photolithography and etching, so that a contact window is formed. Using the hard mask layer as a hard mask, an etching is performed so that a metal trench penetrating through the second dielectric layer is formed, and the device layer within the contact window is exposed.
Abstract:
A method of fabricating an air-gap spacer of a metal-oxide-semiconductor device includes the following steps. First, a substrate having a gate oxide layer and a polysilicon layer successively formed is provided. The polysilicon layer and the gate oxide layer are patterned to form a gate electrode region. A silicon nitride layer and an oxide layer are successively formed on the surface of the substrate and the surface of the gate electrode region. The oxide layer and the silicon nitride layer are anisotropically etched to form a cross-sectional L-shaped silicon nitride layer and a first spacer at the sidewall of the gate electrode region. After the first spacer is removed, an ion implantation is performed to form an extended lightly doped region below the L-shaped silicon nitride layer in the substrate and a lightly doped region in the substrate surrounding the extended lightly doped region. A second spacer is formed at the sidewall of the L-shaped silicon nitride layer wherein the second spacer covers the L-shaped silicon nitride layer. An ion implantation process is performed to form source/drain regions, using the second spacer and the gate electrode region as masks. The L-shaped silicon nitride layer is removed to form an L-shaped air-gap region.
Abstract:
A method for forming a shallow trench isolation structure comprising the steps of sequentially forming a pad oxide layer and a mask layer over a substrate, then patterning the mask layer and the pad oxide layer. Next, an opening is formed in the mask layer, wherein the sidewall of the opening in the mask layer forms a sharp angle with the substrate layer below. Thereafter, the substrate is etched from the opening down to form a trench. In a subsequent step, insulating material is deposited into the trench forming an insulating layer rising to a level higher than the mask layer, and accompanying by the formation of a protuberance at the side of the insulating layer. Subsequently, the mask layer is removed, and then portions of the pad oxide layer is removed to form a spacer on the upper side of the insulating layer. Finally, the pad oxide layer above the substrate is removed to complete the formation of the shallow trench isolation structure. Due to the presence of a spacer, resistance against subsequent etching is increased at the junction between the trench insulating layer and the substrate layer. Thus, kink effect caused by the over-etching of the insulating layer is prevented.
Abstract:
A method of making a self-aligned silicide component having parasitic spacers formed on the sides of an upper surface of the component isolating regions, the bottom sides of the spacers and the exposed sides of the gate regions, which increases a distance from a metal silicide layer at a corner of an active region neighboring the component isolating region to the source/drain junction, to prevent undesired current leakages. The formation of parasitic spacers increases a distance from the metal silicide layer lying above the gate surface to the metal silicide layer lying above the source/drain surface so that an ability to withstand electrostatic damages is enhanced.
Abstract:
The present invention provides an air filter including a main body, a pressure fan, a filter mode and a fixing assembly. The main body has a containing room, an entrance hole and an exit hole. The pressure fan is disposed in the containing room. The filter mode includes a first filter layer, a second filter layer and a frame body. The first filter layer is disposed in the entrance hole, and the second filter layer is disposed in the frame body. As such, users can select to use only the first filter layer or both filter layers at one time. Moreover, users only need to let the frame body pivot to a position away from the entrance hole so that users can change the filter layers faster and easier.
Abstract:
A gripper applied in a transport mechanism for transporting a wafer is provided. The transport mechanism includes a bar. The gripper includes a fixing member fixed to the bar, and a carrying member. The fixing member includes two grooves adjacent to the bottom of the fixing member. Each groove includes an entrance and a retaining portion. The carrying member includes a notch and a first claw. The notch is located at the top of the carrying member and communicates two opposite sides of the carrying member. The notch includes two inner walls, each having a protrusion. The carrying member is assembled to the fixing member by sliding each protrusion along one of the grooves from the corresponding entrance and until abutting against the corresponding retaining portion. The first claw is located at a first sidewall of the carrying member. The edge of the wafer is supportable by the first claw.
Abstract:
A cutting apparatus of the present invention mainly includes a cylinder, a cutting assembly and a valve assembly. The valve assembly is connected to the cylinder so as to control action of the cylinder. The cutting assembly is connected to the cylinder, so that the cutting assembly can be driven to cutting plates or boards. The valve assembly has a first switch and a second switch. When both of the first switch and the second switch are turned on, the cutting assembly is driven to move for cutting. When one of the first switch and the second switch is turned off, the cutting assembly is driven to return its initial position.As such, the first switch is provided for ordinary operation. The second switch is taken as an emergency switch for particular situation so as to avoid accident.
Abstract:
A foldable dust collector of the present invention includes a supporting portion, a case and an air pump. The supporting portion is foldable. The case is disposed on the supporting portion. The case is pivotable with respect to the supporting portion. The air pump is disposed on the case. The air pump is used for drawing air into the case.Therefore, the foldable dust collector of the present invention can be transformed. A width of the foldable dust collector is changeable. As such, the foldable dust collector is easier to be stored or be transported. Moreover, the foldable dust collector can be used in a small space.
Abstract:
A locking mechanism for a glider rocker having a gliding chair seat mounted on a stationary base, including an operating assembly mounted on the gliding chair seat, a pair of bearing brackets mounted on the stationary base respectively, and a pair of mounting assemblies. Each mounting assembly includes a prop, a strut, a curved elongated member, a mounting bracket, and a restoring spring connected with the curved elongated member and the prop.