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    DISPLACEMENT TYPE GENERATOR
    41.
    发明申请
    DISPLACEMENT TYPE GENERATOR 有权
    位移式发电机

    公开(公告)号：US20100156201A1

    公开(公告)日：2010-06-24

    申请号：US12416999

    申请日：2009-04-02

    Applicant: Mean-Jue Tung ,  Yu-Ting Huang

    Inventor： Mean-Jue Tung ,  Yu-Ting Huang

    IPC: H02K35/00

    CPC classification number: H02K35/02

    Abstract: A displacement type generator including a magnet set and a coil set is provided. The magnet set includes a magnet with unidirectional magnetization and a first multi-polar magnetic structure, wherein the first multi-polar magnetic structure is disposed on the magnet. The coil set includes a magnetic center pole, a coil and a second multi-polar magnetic structure. The coil is wound on the magnetic center pole. The second multi-polar magnetic structure is disposed on the magnetic center pole and is adjacent to the first multi-polar magnetic structure. As a relative movement is generated between the magnet set and the coil set, the magnetic flux changes and causes the coil to output an induced voltage.

    Abstract translation: 提供一种包括磁体组和线圈组的位移型发生器。 磁体组包括具有单向磁化的磁体和第一多极磁性结构，其中第一多极磁性结构设置在磁体上。 线圈组包括磁中心极，线圈和第二多极磁结构。 线圈缠绕在磁中心极上。 第二多极磁结构设置在磁中心极上并与第一多极磁结构相邻。 当在磁体组和线圈组之间产生相对运动时，磁通量发生变化并使线圈输出感应电压。

    METHOD FOR PROCESSING GREEN COFFEE BEAN
    44.
    发明申请
    METHOD FOR PROCESSING GREEN COFFEE BEAN 审中-公开

    公开(公告)号：US20200093153A1

    公开(公告)日：2020-03-26

    申请号：US16538888

    申请日：2019-08-13

    Applicant: YU-TING HUANG

    Inventor： YU-TING HUANG ,  CHENG-YI CHIEN

    IPC: A23F5/02

    Abstract: In the penetration step, a carbon dioxide fluid is contacted to a sample of coffee green bean inside a chamber at a temperature of 28-50° C. and a pressure of 950-3,500 psi for 3-30 minutes to allow the carbon dioxide fluid to penetrate into the sample of coffee green bean. In a pressure relief step, the pressure in the chamber is reduced to normal pressure in a time period of 2-15 minutes, allowing the carbon dioxide fluid penetrated into the sample of coffee green bean to break down cell wall of the sample of coffee green bean to obtain a sample of coffee green bean with broken cell wall.

    MULTIFUNCTIONAL TORCH LIGHT
    47.
    发明申请
    MULTIFUNCTIONAL TORCH LIGHT 审中-公开
    多功能转向灯

    公开(公告)号：US20150184816A1

    公开(公告)日：2015-07-02

    申请号：US14143645

    申请日：2013-12-30

    Applicant: Yu-Ting HUANG

    Inventor： Yu-Ting HUANG

    IPC: F21L4/04 ,  F21V23/04 ,  F21V17/12 ,  F21V17/02

    CPC classification number: F21L4/005 ,  F21V14/065 ,  F21V23/0421 ,  F21V33/0064 ,  F21V33/0076

    Abstract: A multifunctional torch light includes a tube body, a barrel, a lightening assembly, a moveable sleeve, a lens assembly, a battery assembly, and a switch. Therein, the tube body has a first end and a second end. The barrel is disposed on the first end. The lightening assembly is fixed on the barrel. The moveable sleeve is rotatably disposed on the periphery of the barrel. The lens assembly is disposed on one end of the moveable sleeve and able to move in accordance with the moveable sleeve. The battery assembly is disposed inside the tube body and electrically connected to the lightening assembly. The switch is disposed on the second end of the tube body for being electrically connected to the battery assembly. Therefore, by adjusting the distance between the moveable sleeve and the barrel, wide-range diffusive illumination and long-distance concentrative illumination are both achievable.

    Abstract translation: 多功能割炬灯包括管体，筒体，减光组件，可移动套筒，透镜组件，电池组件和开关。 其中，管体具有第一端和第二端。 枪管设置在第一端。 减光组件固定在枪管上。 可移动套筒可旋转地设置在枪管的周边上。 透镜组件设置在可移动套筒的一端并且能够根据可移动套筒移动。 电池组件设置在管体内部并电连接到减轻组件。 开关设置在管体的第二端，用于电连接到电池组件。 因此，通过调节可动套筒和筒体之间的距离，可以实现宽范围漫射照明和长距离集中照明。

    Chip package and method for forming the same
    48.
    发明授权
    Chip package and method for forming the same 有权
    芯片封装及其形成方法

    公开(公告)号：US08508028B2

    公开(公告)日：2013-08-13

    申请号：US13184443

    申请日：2011-07-15

    Applicant: Yu-Lung Huang ,  Yu-Ting Huang

    Inventor： Yu-Lung Huang ,  Yu-Ting Huang

    IPC: H01L23/06 ,  H01L23/48 ,  H01L23/04

    CPC classification number: H01L31/0203 ,  B81B7/0077 ,  H01L23/10 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2924/01005 ,  H01L2924/01021 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15788 ,  H01L2924/00

    Abstract: According to an embodiment, a chip package is provided, which includes: a substrate having a first surface and a second surface; a device region formed in the substrate; a passivation layer formed overlying the first surface of the substrate; at least a polymer planarization layer formed overlying the passivation layer; a package substrate disposed overlying the first surface of the substrate; and a spacer layer disposed between the package substrate and the passivation layer, wherein the spacer layer and the package substrate surround a cavity overlying the substrate, wherein the polymer planar layer does not extends to an outer edge of the spacer layer.

    Abstract translation: 根据实施例，提供一种芯片封装，其包括：具有第一表面和第二表面的基板; 形成在所述基板中的器件区域; 形成在衬底的第一表面上的钝化层; 至少形成在所述钝化层上的聚合物平坦化层; 封装基板，设置在所述基板的第一表面上方; 以及间隔层，其设置在所述封装衬底和所述钝化层之间，其中所述间隔层和所述封装衬底围绕覆盖所述衬底的空腔，其中所述聚合物平面层不延伸到所述间隔层的外边缘。

    CYLINDRICAL LOCK
    49.
    发明申请
    CYLINDRICAL LOCK 有权
    圆柱锁

    公开(公告)号：US20120017657A1

    公开(公告)日：2012-01-26

    申请号：US13186449

    申请日：2011-07-19

    Applicant: Po-Yang Chen ,  Tsung-Chung Huang ,  Jun-Lin Yang ,  Yu-Ting Huang ,  Chia-Min Sun

    Inventor： Po-Yang Chen ,  Tsung-Chung Huang ,  Jun-Lin Yang ,  Yu-Ting Huang ,  Chia-Min Sun

    IPC: E05B65/00

    CPC classification number: E05B55/005 ,  E05B13/101 ,  Y10T70/5155 ,  Y10T70/5416 ,  Y10T70/5819 ,  Y10T70/5823 ,  Y10T70/5827 ,  Y10T70/5832 ,  Y10T70/7706 ,  Y10T70/7712

    Abstract: A kind of cylindrical lock, this lock able to be installed on a door, includes: one transmission structure which can operate a drive base, this drive base gearing a latch mechanism; this latch mechanism having: one tubular shaped element, which can be coupled to a handle for actuation; a tube, which can be rotated and inserted into the tubular shaped element; one pushing part, having one side with at least one pushing section, this pushing section able to push the drive base at the appropriate time; a collar, which can be set on one end of the tubular shaped element, a meshing section formed on one end of the collar; an engaging element, partly installed in this pushing part, one meshing section formed on this engaging element, and this engaging element having at least one pushable section; one rotating part, having at least one pushing portion, each pushing portion at the appropriate time pushing the adjacent pushable section of the engaging element; one lock set, having a lock core linked to one transmission part; rotating this lock core to move from the beginning position at an angled position in a predetermined direction back to the beginning position, the transmission part of this lock set can push a moving part, causing this engaging element to do axial displacement, and causing the meshing section of the engaging element to be positioned and move between the incompatible meshing of the first position or compatible meshing of the second position, on the meshing section of this collar.

    Abstract translation: 一种圆柱形锁，该锁可安装在门上，包括：一个传动结构，可操作一驱动基座，该传动底座装有闩锁机构; 该闩锁机构具有：一个管状元件，其可联接到手柄用于致动; 管，其可以旋转并插入到管状元件中; 一个推动部分，其一侧具有至少一个推动部分，该推动部分能够在适当的时间推动驱动基座; 可以设置在管状元件的一端的轴环，形成在轴环的一端的啮合部分; 部分地安装在该按压部分中的接合元件，形成在该接合元件上的一个啮合部分，该接合元件具有至少一个可推动部分; 一个旋转部分，具有至少一个推动部分，每个推动部分在适当的时间推动接合元件的相邻可推动部分; 一个锁定装置，具有连接到一个传动部分的锁芯; 旋转该锁芯从预定方向的倾斜位置处的起始位置返回到开始位置，该锁定装置的传动部分可以推动移动部件，导致该接合元件做轴向位移，并使啮合 所述接合元件的所述定位部分在所述第一位置的不相容的啮合或所述第二位置的相容啮合之间在所述轴环的所述啮合部分上移动。

    CHIP PACKAGE AND METHOD FOR FORMING THE SAME
    50.
    发明申请
    CHIP PACKAGE AND METHOD FOR FORMING THE SAME 有权
    芯片包装及其形成方法

    公开(公告)号：US20120012988A1

    公开(公告)日：2012-01-19

    申请号：US13184443

    申请日：2011-07-15

    Applicant: Yu-Lung HUANG ,  Yu-Ting HUANG

    Inventor： Yu-Lung HUANG ,  Yu-Ting HUANG

    IPC: H01L23/58 ,  H01L21/78

    CPC classification number: H01L31/0203 ,  B81B7/0077 ,  H01L23/10 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2924/01005 ,  H01L2924/01021 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15788 ,  H01L2924/00

    Abstract: According to an embodiment, a chip package is provided, which includes: a substrate having a first surface and a second surface; a device region formed in the substrate; a passivation layer formed overlying the first surface of the substrate; at least a polymer planarization layer formed overlying the passivation layer; a package substrate disposed overlying the first surface of the substrate; and a spacer layer disposed between the package substrate and the passivation layer, wherein the spacer layer and the package substrate surround a cavity overlying the substrate, wherein the polymer planar layer does not extends to an outer edge of the spacer layer.

    Abstract translation: 根据实施例，提供一种芯片封装，其包括：具有第一表面和第二表面的基板; 形成在所述基板中的器件区域; 形成在衬底的第一表面上的钝化层; 至少形成在所述钝化层上的聚合物平坦化层; 封装基板，设置在所述基板的第一表面上方; 以及间隔层，其设置在所述封装衬底和所述钝化层之间，其中所述间隔层和所述封装衬底围绕覆盖所述衬底的空腔，其中所述聚合物平面层不延伸到所述间隔层的外边缘。

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