摘要:
According to an aspect of the present invention, there is provided an X-ray CT scanner including: a gantry; a revolving body provided inside the gantry; an X-ray tube assembly provided in the revolving body; a heat radiator provided inside the revolving body so as to be connected to the X-ray tube assembly; a heat storage material provided in the heat radiator and capable of accumulating a heat generated by the X-ray tube assembly; and an X-ray detector provided inside the revolving body so as to oppose the X-ray tube assembly.
摘要:
A blade of a gas turbine includes a main body having a dovetail portion and a blade portion extending from the dovetail portion. A cooling air passage for flowing a cooling air is formed in the main body to cool the blade portion. The passage includes a cooling air inlet port open to the dovetail portion and an outlet port open to an extended tip of the blade portion. A first passage portion extends from the inlet port to the portion close to the extended tip along a leading edge of the blade portion. A final passage portion extends from the dovetail portion to the outlet port. The flow sectional area of the final passage portion is gradually decreased from the dovetail portion toward the outlet port. The final passage portion communicates with a number of film cooling holes which are open to the suction side surface of the blade portion.
摘要:
A semiconductor device is manufactured by covering a semiconductor substrate of a predetermined conductivity type with a polycrystal layer of a semiconductor material. Selected portions of the polycrystal layer are oxidized into an insulating material during heat treatment. Remaining portions of the polycrystal layer which are left unoxidized act as conductive portions. On manufacturing a bipolar transistor, ion implantation is carried out in a predetermined solid angle to introduce an impurity of an opposite conductivity selectively in a preselected one of the remaining portions. During the heat treatment, the impurity diffuses into the substrate only from the preselected portion to form a PN junction in the substrate. For fabricating an MOS transistor, an oxide film is preliminarily formed on the substrate selectively on an area on which a predetermined one of the remaining polycrystal layer portions is to be formed. Ion implantation is carried out to introduce an impurity of the opposite conductivity in the respective remaining layer portions. The oxide film prevents the impurity from diffusing to the substrate. The impurity diffuses into the substrate only from the respective remaining portions, except the predetermined portion.