公开(公告)号：US07037735B2

公开(公告)日：2006-05-02

申请号：US10170378

申请日：2002-06-14

申请人： Minori Noguchi ,  Yoshimasa Ohshima ,  Hidetoshi Nishiyama ,  Shunichi Matsumoto ,  Yukio Kembo ,  Ryouji Matsunaga ,  Keiji Sakai ,  Takanori Ninomiya ,  Tetsuya Watanabe ,  Hisato Nakamura ,  Takahiro Jingu ,  Yoshio Morishige ,  Shuichi Chikamatsu

发明人： Minori Noguchi ,  Yoshimasa Ohshima ,  Hidetoshi Nishiyama ,  Shunichi Matsumoto ,  Yukio Kembo ,  Ryouji Matsunaga ,  Keiji Sakai ,  Takanori Ninomiya ,  Tetsuya Watanabe ,  Hisato Nakamura ,  Takahiro Jingu ,  Yoshio Morishige ,  Shuichi Chikamatsu

IPC分类号： H01L21/66 ,  G01R31/26

CPC分类号： B82Y15/00 ,  G01N21/94 ,  G01N21/95623 ,  G01N21/95684 ,  G01N2021/8822 ,  G01R31/308 ,  H01J37/00 ,  H01J2237/022 ,  H01J2237/0225 ,  H01L21/67253 ,  H01L21/67288 ,  H01L21/681 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： A defect inspection method includes radiating an illumination slit-shaped beam having lights substantially parallel to a longitudinal direction to a substrate having circuit patterns in a direction inclined at a predetermined gradient relative to the direction of a line normal to the substrate and inclined at a predetermined gradient on a surface with respect to a group of main straight lines of the circuit patterns with its longitudinal direction oriented almost perpendicularly to a direction of a movement of the substrate. Scattered light reflected by a defect such as a foreign particle existing on the illuminated substrate is received and converted into a detection signal by using an image sensor, and defect judging is effected of an extracted a signal indicating a defect such as a foreign particle on the basis of the detection signal output.

公开(公告)号：US07940383B2

公开(公告)日：2011-05-10

申请号：US12630307

申请日：2009-12-03

申请人： Minori Noguchi ,  Yoshimasa Ohshima ,  Hidetoshi Nishiyama ,  Shunichi Matsumoto ,  Yukio Kembo ,  Ryouji Matsunaga ,  Keiji Sakai ,  Takanori Ninomiya ,  Tetsuyai Watanabe ,  Hisato Nakamura ,  Takahiro Jingu ,  Yoshio Morishige ,  Shuichi Chikamatsu

发明人： Minori Noguchi ,  Yoshimasa Ohshima ,  Hidetoshi Nishiyama ,  Shunichi Matsumoto ,  Yukio Kembo ,  Ryouji Matsunaga ,  Keiji Sakai ,  Takanori Ninomiya ,  Tetsuyai Watanabe ,  Hisato Nakamura ,  Takahiro Jingu ,  Yoshio Morishige ,  Shuichi Chikamatsu

IPC分类号： G01N21/00

CPC分类号： B82Y15/00 ,  G01N21/94 ,  G01N21/95623 ,  G01N21/95684 ,  G01N2021/8822 ,  G01R31/308 ,  H01J37/00 ,  H01J2237/022 ,  H01J2237/0225 ,  H01L21/67253 ,  H01L21/67288 ,  H01L21/681 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method for detecting defects on an object includes an illumination optical unit which obliquely projects a laser focused onto a line on a surface of the object and white-color, a table unit which mounts the specimen and which is movable, a detection optical unit which detects with an image sensor an image of light formed by light reflected from the object and passed through a filter which blocks diffraction light resulting from patterns formed on the object, a signal processor which processes a signal outputted from the image sensor of the detection optical unit to extract defects of the object, and a display unit which displays information of defects extracted by the signal processor. The filter is adjustable.

摘要翻译： 一种用于检测物体上的缺陷的方法包括：照射光学单元，其将聚焦在物体的表面上的线的激光倾斜投影到白色;安装样本并且可移动的台单元;检测光学单元， 利用图像传感器检测由物体反射的光形成的光的图像，并通过阻挡由形成在物体上的图案产生的衍射光的滤光器，处理从检测光学单元的图像传感器输出的信号的信号处理器 以提取对象的缺陷;以及显示单元，显示由信号处理器提取的缺陷的信息。 过滤器可调。

公开(公告)号：US07443496B2

公开(公告)日：2008-10-28

申请号：US11681996

申请日：2007-03-05

申请人： Minori Noguchi ,  Yoshimasa Ohshima ,  Hidetoshi Nishiyama ,  Shunichi Matsumoto ,  Yukio Kembo ,  Ryouji Matsunaga ,  Keiji Sakai ,  Takanori Ninomiya ,  Tetsuya Watanabe ,  Hisato Nakamura ,  Takahiro Jingu ,  Yoshio Morishige ,  Shuichi Chikamatsu

发明人： Minori Noguchi ,  Yoshimasa Ohshima ,  Hidetoshi Nishiyama ,  Shunichi Matsumoto ,  Yukio Kembo ,  Ryouji Matsunaga ,  Keiji Sakai ,  Takanori Ninomiya ,  Tetsuya Watanabe ,  Hisato Nakamura ,  Takahiro Jingu ,  Yoshio Morishige ,  Shuichi Chikamatsu

IPC分类号： G01N21/00

CPC分类号： B82Y15/00 ,  G01N21/94 ,  G01N21/95623 ,  G01N21/95684 ,  G01N2021/8822 ,  G01R31/308 ,  H01J37/00 ,  H01J2237/022 ,  H01J2237/0225 ,  H01L21/67253 ,  H01L21/67288 ,  H01L21/681 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： A defect inspection apparatus includes an illumination optical unit for obliquely illuminating an object with a slit-like shaped laser, a first detection optical unit for detecting a first image formed by light reflected from the object by the illumination of the slit-like shaped laser and reflected in a first direction substantially normal to a surface of the object, a second detection optical unit for detecting a second image formed by light reflected from the object by the illumination of the slit-like shaped laser and reflected in a second direction inclined to the normal direction to the surface of the object, an image signal processing unit which processes a signal outputted from the first detection optical unit and a signal outputted from the second detection optical unit, and an output unit which outputs information processed by the image signal processing unit.

摘要翻译： 缺陷检查装置包括：用狭缝状激光器对物体进行倾斜照明的照明光学单元;第一检测光学单元，用于检测由所述狭缝状激光的照射而从物体反射的光形成的第一图像;以及 反射在基本上垂直于物体的表面的第一方向上;第二检测光学单元，用于检测由通过照射狭缝状激光而从物体反射的光形成的第二图像，并以与第二方向倾斜的第二方向反射 对象物的表面的正常方向，处理从第一检测光学单元输出的信号和从第二检测光学单元输出的信号的图像信号处理单元，以及输出单元，其输出由图像信号处理单元处理的信息 。

公开(公告)号：US06411377B1

公开(公告)日：2002-06-25

申请号：US09362135

申请日：1999-07-28

申请人： Minori Noguchi ,  Yoshimasa Ohshima ,  Hidetoshi Nishiyama ,  Shunichi Matsumoto ,  Yukio Kembo ,  Ryouji Matsunaga ,  Keiji Sakai ,  Takanori Ninomiya ,  Tetsuya Watanabe ,  Hisato Nakamura ,  Takahiro Jingu ,  Yoshio Morishige ,  Shuichi Chikamatsu

发明人： Minori Noguchi ,  Yoshimasa Ohshima ,  Hidetoshi Nishiyama ,  Shunichi Matsumoto ,  Yukio Kembo ,  Ryouji Matsunaga ,  Keiji Sakai ,  Takanori Ninomiya ,  Tetsuya Watanabe ,  Hisato Nakamura ,  Takahiro Jingu ,  Yoshio Morishige ,  Shuichi Chikamatsu

IPC分类号： G01N2101

CPC分类号： B82Y15/00 ,  G01N21/94 ,  G01N21/95623 ,  G01N21/95684 ,  G01N2021/8822 ,  G01R31/308 ,  H01J37/00 ,  H01J2237/022 ,  H01J2237/0225 ,  H01L21/67253 ,  H01L21/67288 ,  H01L21/681 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention provides a defect inspecting apparatus and a defect inspection method for inspecting an object of inspection for a defect such as a foreign particle existing on the object wherein, by using a high-efficiency illumination optical system for radiating an illumination beam to the object of inspection from a direction to reduce the intensity of a scattered light generated by a pattern on the object of inspection, it is possible to decrease the intensity of the scattered light from the pattern which causes a variation of a signal and, in addition, by using a means for setting a detection threshold value based on a variation of a signal computed for each area in a chip on the object of inspection, the detection threshold value can be made small and, thus, the sensitivity as well as the throughput can be raised.

摘要翻译： 本发明提供了一种缺陷检查装置和缺陷检查方法，用于检查物体上存在的异物等缺陷的检查对象，其中，通过使用用于向对象照射照明光束的高效率照明光学系统 从减少由检查对象上的图案产生的散射光的强度的方向进行检查的情况下，可以降低来自图案的散射光的强度，导致信号的变化，另外，由 使用基于针对检查对象中的芯片中的每个区域计算的信号的变化来设置检测阈值的装置，可以使检测阈值较小，因此灵敏度以及吞吐量可以是 上调。

公开(公告)号：US06998630B2

公开(公告)日：2006-02-14

申请号：US10933977

申请日：2004-09-03

申请人： Hidetoshi Nishiyama ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Akira Hamamatsu ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Takahiro Jingu

发明人： Hidetoshi Nishiyama ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Akira Hamamatsu ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Takahiro Jingu

IPC分类号： G01N21/88

CPC分类号： G01N21/4738 ,  G01N21/8806 ,  G01N21/93 ,  G01N21/94 ,  G01N21/9501 ,  G01N2015/1486 ,  G01N2015/1493

摘要： Conventionally, a particle/defect inspection apparatus outputs a total number of detected particles/defects as the result of detection. For taking countermeasures to failures in manufacturing processes, the particles/defects detected by the inspection apparatus are analyzed. Since the inspection apparatus outputs a large number of detected particles/defects, an immense time is required for analyzing the detected particles/defects, resulting in a delay in taking countermeasures to a failure in the manufacturing processes. In the present invention, an apparatus for optically inspecting particles or defects relates a particle or defect size to a cause of failure in an inspection result. A data processing circuit points out a cause of failure from the statistics on the inspection result, and displays information on the inspection result. A failure analysis is conducted by setting a threshold for identifying a failure in each of regions on a semiconductor device or the like to statistically evaluate detected particles.

公开(公告)号：US20050024633A1

公开(公告)日：2005-02-03

申请号：US10933977

申请日：2004-09-03

申请人： Hidetoshi Nishiyama ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Akira Hamamatsu ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Takahiro Jingu

发明人： Hidetoshi Nishiyama ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Akira Hamamatsu ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Takahiro Jingu

IPC分类号： G01N21/88 ,  G01N21/94

CPC分类号： G01N21/4738 ,  G01N21/8806 ,  G01N21/93 ,  G01N21/94 ,  G01N21/9501 ,  G01N2015/1486 ,  G01N2015/1493

摘要： Conventionally, a particle/defect inspection apparatus outputs a total number of detected particles/defects as the result of detection. For taking countermeasures to failures in manufacturing processes, the particles/defects detected by the inspection apparatus are analyzed. Since the inspection apparatus outputs a large number of detected particles/defects, an immense time is required for analyzing the detected particles/defects, resulting in a delay in taking countermeasures to a failure in the manufacturing processes. In the present invention, an apparatus for optically inspecting particles or defects relates a particle or defect size to a cause of failure in an inspection result. A data processing circuit points out a cause of failure from the statistics on the inspection result, and displays information on the inspection result. A failure analysis is conducted by setting a threshold for identifying a failure in each of regions on a semiconductor device or the like to statistically evaluate detected particles.

摘要翻译： 通常，作为检测结果，粒子/缺陷检查装置输出检测出的粒子/缺陷的总数。 对于制造过程中的故障采取对策，分析检查装置检测到的颗粒/缺陷。 由于检查装置输出大量检测到的粒子/缺陷，所以需要巨大的时间来分析检测到的粒子/缺陷，从而导致制造过程中的失败的对策的延迟。 在本发明中，用于光学检查颗粒或缺陷的装置在检查结果中将颗粒或缺陷尺寸与故障原因相关联。 数据处理电路从检查结果统计中指出故障原因，并显示检查结果信息。 通过设定用于识别半导体装置等上的各区域的故障的阈值来进行故障分析，以统计学评价检测出的粒子。

公开(公告)号：US20120062890A1

公开(公告)日：2012-03-15

申请号：US13298079

申请日：2011-11-16

申请人： Hidetoshi Nishiyama ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Akira Hamamatsu ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Takahiro Jingu

发明人： Hidetoshi Nishiyama ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Akira Hamamatsu ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Takahiro Jingu

IPC分类号： G01N15/02

CPC分类号： G01N21/4738 ,  G01N21/8806 ,  G01N21/93 ,  G01N21/94 ,  G01N21/9501 ,  G01N2015/1486 ,  G01N2015/1493

摘要： Conventionally, a particle/defect inspection apparatus outputs a total number of detected particles/defects as the result of detection. For taking countermeasures to failures in manufacturing processes, the particles/defects detected by the inspection apparatus are analyzed. Since the inspection apparatus outputs a large number of detected particles/defects, an immense time is required for analyzing the detected particles/defects, resulting in a delay in taking countermeasures to a failure in the manufacturing processes. In the present invention, an apparatus for optically inspecting particles or defects relates a particle or defect size to a cause of failure in an inspection result. A data processing circuit points out a cause of failure from the statistics on the inspection result, and displays information on the inspection result. A failure analysis is conducted by setting a threshold for identifying a failure in each of regions on a semiconductor device or the like to statistically evaluate detected particles.

摘要翻译： 通常，作为检测结果，粒子/缺陷检查装置输出检测出的粒子/缺陷的总数。 对于制造过程中的故障采取对策，分析检查装置检测到的颗粒/缺陷。 由于检查装置输出大量检测到的粒子/缺陷，所以需要巨大的时间来分析检测到的粒子/缺陷，从而导致制造过程中的失败的对策的延迟。 在本发明中，用于光学检查颗粒或缺陷的装置在检查结果中将颗粒或缺陷尺寸与故障原因相关联。 数据处理电路从检查结果统计中指出故障原因，并显示检查结果信息。 通过设定用于识别半导体装置等上的各区域的故障的阈值来进行故障分析，以统计学评价检测出的粒子。

公开(公告)号：US20060091332A1

公开(公告)日：2006-05-04

申请号：US11302847

申请日：2005-12-13

申请人： Hidetoshi Nishiyama ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Akira Hamamatsu ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Takahiro Jingu

发明人： Hidetoshi Nishiyama ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Akira Hamamatsu ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Takahiro Jingu

IPC分类号： G01N21/86

CPC分类号： G01N21/4738 ,  G01N21/8806 ,  G01N21/93 ,  G01N21/94 ,  G01N21/9501 ,  G01N2015/1486 ,  G01N2015/1493

摘要： Conventionally, a particle/defect inspection apparatus outputs a total number of detected particles/defects as the result of detection. For taking countermeasures to failures in manufacturing processes, the particles/defects detected by the inspection apparatus are analyzed. Since the inspection apparatus outputs a large number of detected particles/defects, an immense time is required for analyzing the detected particles/defects, resulting in a delay in taking countermeasures to a failure in the manufacturing processes. In the present invention, an apparatus for optically inspecting particles or defects relates a particle or defect size to a cause of failure in an inspection result. A data processing circuit points out a cause of failure from the statistics on the inspection result, and displays information on the inspection result. A failure analysis is conducted by setting a threshold for identifying a failure in each of regions on a semiconductor device or the like to statistically evaluate detected particles.

公开(公告)号：US06797975B2

公开(公告)日：2004-09-28

申请号：US09931997

申请日：2001-08-17

申请人： Hidetoshi Nishiyama ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Akira Hamamatsu ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Takahiro Jingu

发明人： Hidetoshi Nishiyama ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Akira Hamamatsu ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Takahiro Jingu

IPC分类号： G01N2188

CPC分类号： G01N21/4738 ,  G01N21/8806 ,  G01N21/93 ,  G01N21/94 ,  G01N21/9501 ,  G01N2015/1486 ,  G01N2015/1493

摘要： Conventionally, a particle/defect inspection apparatus outputs a total number of detected particles/defects as the result of detection. For taking countermeasures to failures in manufacturing processes, the particles/defects detected by the inspection apparatus are analyzed. Since the inspection apparatus outputs a large number of detected particles/defects, an immense time is required for analyzing the detected particles/defects, resulting in a delay in taking countermeasures to a failure in the manufacturing processes. In the present invention, an apparatus for optically inspecting particles or defects relates a particle or defect size to a cause of failure in an inspection result. A data processing circuit points out a cause of failure from the statistics on the inspection result, and displays information on the inspection result. A failure analysis is conducted by setting a threshold for identifying a failure in each of regions on a semiconductor device or the like to statistically evaluate detected particles.

摘要翻译： 通常，作为检测结果，粒子/缺陷检查装置输出检测出的粒子/缺陷的总数。 对于制造过程中的故障采取对策，分析检查装置检测到的颗粒/缺陷。 由于检查装置输出大量检测到的粒子/缺陷，所以需要巨大的时间来分析检测到的粒子/缺陷，从而导致制造过程中的失败的对策的延迟。 在本发明中，用于光学检查颗粒或缺陷的装置在检查结果中将颗粒或缺陷尺寸与故障原因相关联。 数据处理电路从检查结果统计中指出故障原因，并显示检查结果信息。 通过设定用于识别半导体装置等上的各区域的故障的阈值来进行故障分析，以统计学评价检测出的粒子。

公开(公告)号：US08072597B2

公开(公告)日：2011-12-06

申请号：US12138889

申请日：2008-06-13

申请人： Hidetoshi Nishiyama ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Akira Hamamatsu ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Takahiro Jingu

发明人： Hidetoshi Nishiyama ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Akira Hamamatsu ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Takahiro Jingu

IPC分类号： G01N15/02

CPC分类号： G01N21/4738 ,  G01N21/8806 ,  G01N21/93 ,  G01N21/94 ,  G01N21/9501 ,  G01N2015/1486 ,  G01N2015/1493

摘要： Conventionally, a particle/defect inspection apparatus outputs a total number of detected particles/defects as the result of detection. For taking countermeasures to failures in manufacturing processes, the particles/defects detected by the inspection apparatus are analyzed. Since the inspection apparatus outputs a large number of detected particles/defects, an immense time is required for analyzing the detected particles/defects, resulting in a delay in taking countermeasures to a failure in the manufacturing processes. In the present invention, an apparatus for optically inspecting particles or defects relates a particle or defect size to a cause of failure in an inspection result. A data processing circuit points out a cause of failure from the statistics on the inspection result, and displays information on the inspection result. A failure analysis is conducted by setting a threshold for identifying a failure in each of regions on a semiconductor device or the like to statistically evaluate detected particles.

摘要翻译： 通常，作为检测结果，粒子/缺陷检查装置输出检测出的粒子/缺陷的总数。 对于制造过程中的故障采取对策，分析检查装置检测到的颗粒/缺陷。 由于检查装置输出大量检测到的粒子/缺陷，所以需要巨大的时间来分析检测到的粒子/缺陷，从而导致制造过程中的失败的对策的延迟。 在本发明中，用于光学检查颗粒或缺陷的装置在检查结果中将颗粒或缺陷尺寸与故障原因相关联。 数据处理电路从检查结果统计中指出故障原因，并显示检查结果信息。 通过设定用于识别半导体装置等上的各区域的故障的阈值来进行故障分析，以统计学评价检测出的粒子。