Abstract:
RFID driven display system components such as wireless displays (visual RFID tags) and multi-antenna wireless RFID readers that monitor/control the RFID driven displays in order to provide visual real-time information to display viewers and/or provide useful information to a central processing station that monitors the status of and/or updates the RFID driven displays, networks including one or more of the components, and methods for using the RFID driven display system components to monitor assets in applications such as inventory control and manufacturing.
Abstract:
A personal watercraft is disclosed, having a straddle-type seat disposed on a deck. The seat has a seat profile. A storage compartment is disposed rearwardly of the seat. A rear platform is pivotally connected to a rear portion of the watercraft. The rear platform is pivotable between a raised position and a lowered position. The rear platform permits access to the storage compartment when in the raised position, and sealingly closes the storage compartment when in the lowered position. The rear platform is lower than the seat profile when the rear platform is in the lowered position. A personal watercraft having left and right storage compartments and a rear channel defined therebetween, in which the rear platform extends laterally above the rear channel when in the lowered position is also disclosed. A personal watercraft with a rear platform having heel rests with angled portions is also disclosed.
Abstract:
A blister pack having at least one security tag formed from the metal layer of the blister pack. In one embodiment, the security tag is a detached portion of the metal layer that is entrenched in a corresponding channel in the plastic layer of the blister pack and which is then completed by electrically coupling a capacitor strap or chip strap to a gapped portion of the entrenched aluminum layer. Another embodiment also forms the security tag from the metal layer but the coil or antenna of the security tag is formed as part of the process of sealing the metal layer to the plastic layer. A capacitor strap or chip strap is then electrically coupled to a gapped portion of the coil or antenna.
Abstract:
A rotary chip attach process and manufacturing approach takes chips (e.g., integrated circuits (ICs)) from a wafer in a rotary process. A chip wafer with a positioning unit is placed over the top of a sprocketed wheel that picks the ICs directly from the wafer and moves them in a semi-continuous in-step motion to a web that will accept the ICs. The sprocketed wheel includes chips that are preferably the same type as used in a typical pick-and-place robotic system, with vacuum heads adapted to pierce the wafer flat membrane (if needed), grab and IC and place and IC as desired. This positioning system keeps the IC's placement in an accurate position on the web, which can be made to move continuously with a plurality of sprocketed wheel placement units in place.
Abstract:
A cigarette pack having at least one security tag formed from the metal layer of the cigarette pack liner. One version of the security tag utilizes a preformed coil that is electrically coupled to a portion of the metal layer to form a capacitor and thereby complete a coil/capacitor security tag. Another version of the security tag is forms the entire antenna from the metal layer and a radio frequency identification (RFID) integrated circuit is then coupled to the antenna. In both versions, the surrounding metal layer is severed from the location of either security tag to the edge of the liner.
Abstract:
A process for forming a portion of a package or envelope bearing printed indicia, a label bearing printed indicia or a sheet bearing printed indicia includes providing a substrate which constitutes a portion of the package, label or sheet to a printing apparatus, and utilizing the printing apparatus or an adjunct to the printing apparatus to form at least one electrically conductive component of an EAS and/or RFID tag on the substrate substantially contemporaneously with the printing of the indicia on the substrate. The forming of the electrically conductive component on the substrate is accomplished slightly prior to the printing of the indicia on the substrate, slightly after the printing of the indicia on the substrate and at the same time as the printing of the indicia on the substrate.