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公开(公告)号：US11997789B2
公开(公告)日：2024-05-28
申请号：US17971821
申请日：2022-10-24
Applicant: Translarity, Inc.
Inventor： Dominik Schmidt , Prasanna Rao Chitturi , Jed Hsu
CPC classification number: H05K1/116 , G01R1/0441 , H05K1/0266 , H05K1/111 , H05K3/0029 , H05K3/0032 , H05K3/045 , H05K3/423 , H05K3/244 , H05K3/368 , H05K2201/094 , H05K2201/09609 , H05K2201/09672 , H05K2203/025 , H05K2203/0353 , H05K2203/072 , H05K2203/0723 , H05K2203/0766 , H05K2203/095
Abstract: A single-layer redistribution plate functioning as a space translator between a device under testing (“DUT”) and a testing PCB may comprise a hard ceramic plate. A DUT side of the plate may have pads configured to interface with a device under testing. Both sides of the plate may comprise traces, vias, and pads to fan out the DUT pad pattern so that the plate side opposite the DUT side has spatially translated pads configured to interface with the pads on a testing PCB. Fabricating a redistribution plate may comprise calibrating and aligning, laser milling vias, laser milling trenches and pads, copper plating, grinding and polishing, removing residual copper, and coating the copper surfaces.
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公开(公告)号：US20240074035A1
公开(公告)日：2024-02-29
申请号：US18029023
申请日：2021-09-28
Applicant: KYOCERA Corporation
Inventor： Yoshiki KAWAZU , Taito KIMURA
CPC classification number: H05K1/0219 , H01P3/081 , H05K2201/09227 , H05K2201/09609 , H05K2201/09672 , H05K2201/0969
Abstract: A wiring base includes a base, a signal conductor, and a ground conductor including a first ground conductor. The base includes a first surface, a first region, and a second region. The first region is located near an outer side of the first surface. An external board is mounted in the first region. The second region is other than the first region. The signal conductor extends through a region including the first region of the first surface in a first direction away from the outer side. The first ground conductor is located in the base at a distance from the signal conductor of less than ¼ of a wavelength of a high-frequency signal. The high-frequency signal is transmitted through the signal conductor. The first ground conductor includes a first grid portion at a first location overlapping the first region and at least a portion of the signal conductor.
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公开(公告)号：US11889617B1
公开(公告)日：2024-01-30
申请号：US17901208
申请日：2022-09-01
Applicant: Baidu USA LLC
Inventor： Zhenwei Yu , Yun Ji
CPC classification number: H05K1/0237 , H05K1/116 , H05K3/42 , H05K2201/09627 , H05K2201/09672
Abstract: A printed circuit board includes first and second surfaces, first and second layers, and first and second vias. The first via extends from a first layer to the second surface and includes a first portion that is on a conductive path between the first layer and the second layer and a second portion that is not on the conductive path. A length of the first portion of the first via is greater than that of the second portion of the first via. The second via extends from the second surface to the second layer. The second via includes a first portion that is on the conductive path between the first layer and the second layer and a second portion that is not on the conductive path. A length of the first portion of the second via is greater than that of the second portion of the second via.
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公开(公告)号：US11751323B2
公开(公告)日：2023-09-05
申请号：US17443742
申请日：2021-07-27
Applicant: DELL PRODUCTS, LP
Inventor： Sandor Farkas , Bhyrav Mutnury
CPC classification number: H05K1/0245 , H05K1/115 , H05K3/4644 , H05K1/18 , H05K2201/09636 , H05K2201/09672
Abstract: A printed circuit board (PCB) is provided for transmitting a differential signal. The PCB includes first and second conductive signal layers. The first conductive signal layer includes a first positive trace of the differential signal and a first negative trace of the differential signal. The second conductive signal layer includes a second positive trace of the differential signal and a second negative trace of the differential signal. The first positive trace is adjacent to the first negative trace, and the second positive trace is adjacent to the second negative trace and directly below the first negative trace.
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公开(公告)号：US20230262888A1
公开(公告)日：2023-08-17
申请号：US18303648
申请日：2023-04-20
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hiromichi TANAKA
CPC classification number: H05K1/0298 , H05K3/4664 , H05K2201/0338 , H05K2201/0347 , H05K2201/09672
Abstract: A multilayer structure having a main surface includes: a first conductor extending in parallel with the main surface; a second conductor extending in parallel with the main surface and disposed at a different position from the first conductor with respect to a thickness direction of the multilayer structure; and a third conductor having a shape extending in at least any direction as seen in a direction perpendicular to the main surface. In a range higher than a lower end of the third conductor and lower than an upper end of the third conductor in the thickness direction of the multilayer structure, at least a part of the first conductor is included and at least a part of the second conductor is included.
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Patent Agency Ranking
6.发明授权公开(公告)号：US11678434B2
公开(公告)日：2023-06-13
申请号：US17286939
申请日：2019-11-14
Applicant: Continental Automotive France , Continental Automotive GmbH
Inventor： Daniel Guerra , Philippe Lehue
IPC: H05K1/02
CPC classification number: H05K1/0268 , H05K2201/0776 , H05K2201/09627 , H05K2201/09663 , H05K2201/09672
Abstract: A multilayer printed circuit having a control circuit including n vias that are connected in series between a first and a second electrical terminal so that an applied electric current passes at least partially through each one of the n vias. The control circuit includes track portions in each one of the layers, each one of the n vias connecting a track portion of one layer to a track portion of another layer. The control circuit includes a measurement device for measuring a potential difference across its terminals, storage for storing a threshold value and a comparator for comparing the potential difference with the threshold value so as to validate the printed circuit when the potential difference is lower than the threshold value.
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公开(公告)号：US20190208618A1
公开(公告)日：2019-07-04
申请号：US16234829
申请日：2018-12-28
Inventor： JIWEI WEN , CHENXIA FENG , LIANG CHEN , LIJUAN QU
CPC classification number: H05K1/0216 , H05K1/115 , H05K3/0047 , H05K3/043 , H05K2201/09227 , H05K2201/09609 , H05K2201/09636 , H05K2201/09672 , H05K2203/0207
Abstract: The present invention provides a high speed signal fan-out method for BGA and a PCB using the same. The method comprises: providing a printed circuit board (PCB), providing a plurality of vias and signal traces of the vias on the PCB; and providing back-drilled holes for routing of other signal traces at positions corresponding to the vias. The vias are arranged into a plurality of straight lines from an edge to the center of the PCB. The plurality of straight lines each is horizontal or vertical. The signal traces of the vias in a straight line are arranged from high to low or from low to high with respect to routing positions of the vias, and the back-drilled holes of the plurality of vias are arranged in descending or ascending order corresponding to the depths of the back-drilled holes.
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公开(公告)号：US20180151287A1
公开(公告)日：2018-05-31
申请号：US15878440
申请日：2018-01-24
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kuniaki YOSUI , Kazufumi AISU
IPC: H01F27/28 , H01F41/04 , H01F27/245 , H01F41/02
CPC classification number: H01F27/2804 , H01F17/0013 , H01F27/245 , H01F27/292 , H01F41/0233 , H01F41/041 , H01F2017/0073 , H01F2027/2809 , H05K1/0237 , H05K1/165 , H05K2201/09672
Abstract: A multilayer substrate includes an element assembly including insulating layers stacked along a layer stacking axis including a first direction and a second direction, and a coil disposed at the element assembly. The coil includes a spiral of two or more turns when viewed from the layer stacking axis and extending along the layer the first direction while spiraling from outside inward. A portion of the coil defining an outermost turn of the spiral is defined as a first coil portion, an inner portion of the coil that is the nth nearest from the first coil portion is defined as an n+1th coil portion, and a space between the nth coil portion and the n+1th coil portion is defined as an nth space, where n is a natural number.
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公开(公告)号：US09930770B2
公开(公告)日：2018-03-27
申请号：US15296434
申请日：2016-10-18
Applicant: Samsung Display Co., Ltd.
Inventor： Kwan-Ho Kim , Ick-Kyu Jang , Ji-Man Myeong
CPC classification number: H05K1/0219 , G09G3/3696 , G09G2330/06 , H05K1/0218 , H05K1/0237 , H05K1/0298 , H05K2201/0715 , H05K2201/09236 , H05K2201/09336 , H05K2201/09672 , Y10T29/49124 , Y10T29/49126 , Y10T29/49144 , Y10T29/49156
Abstract: A printed circuit board (“PCB”) includes a first pattern structure, a second pattern structure, a third pattern structure, and a fourth pattern structure. The first pattern structure includes a first ground pattern. The second pattern structure includes a first line pattern overlapping the first ground pattern and a second ground pattern electrically insulated from the first line pattern. The third pattern structure includes a third ground pattern overlapping the first line pattern and a second line pattern overlapping the second ground pattern. The fourth pattern structure includes a fourth ground pattern overlapping the second line pattern. Therefore, the PCB may decrease noise.
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公开(公告)号：US09913364B2
公开(公告)日：2018-03-06
申请号：US15461618
申请日：2017-03-17
Applicant: JAHWA electronics Co., Ltd.
Inventor： Chun Choi , Soon Koo Shim , Young Bin Chong , Nam Jin Choi , Won Gook Lee , Min Goo Lee , Kyung Hoon Jo
CPC classification number: H05K1/0216 , B06B1/0207 , B06B1/045 , H02K11/02 , H02K33/16 , H02K2211/03 , H05K1/09 , H05K1/112 , H05K1/165 , H05K2201/09263 , H05K2201/09481 , H05K2201/09672
Abstract: A printed circuit board includes a pad to receive an electric signal from a controller, a plurality of signal lines connected to the pad to transmit the electric signal received at the pad, and a signal transmission unit connected to the signal lines to transmit the electric signal to a coil. The plurality of signal lines are configured to face each other in at least a partial region and/or disposed in a zigzag form in at least a partial region. If the printed circuit board and a vibration actuator including the printed circuit board are used, it is possible to change a high frequency interference region according to a pattern by changing a pattern of the printed circuit board, and to improve receiving efficiency of an antenna by reducing high frequency noise.
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