公开(公告)号：US09761416B2

公开(公告)日：2017-09-12

申请号：US14200077

申请日：2014-03-07

Applicant: Applied Materials, Inc.

Inventor： Andrew Nguyen ,  Bradley Howard ,  Shahid Rauf ,  Ajit Balakrishna ,  Tom K. Cho ,  Kenneth S. Collins ,  Anand Kumar ,  Michael D. Willwerth ,  Yogananda Sarode Vishwanath

IPC: B01D45/00 ,  H01J37/32 ,  B01D45/08 ,  B32B1/02 ,  B29C65/00

CPC classification number: H01J37/32495 ,  B01D45/08 ,  B29C66/71 ,  B32B1/02 ,  H01J37/32449 ,  H01J37/32477 ,  H01J37/32871 ,  Y10T428/13

Abstract: Embodiments of the present disclosure generally provide various apparatus and methods for reducing particles in a semiconductor processing chamber. One embodiment of present disclosure provides a vacuum screen assembly disposed over a vacuum port to prevent particles generated by the vacuum pump from entering substrate processing regions. Another embodiment of the present disclosure provides a perforated chamber liner around a processing region of the substrate. Another embodiment of the present disclosure provides a gas distributing chamber liner for distributing a cleaning gas around the substrate support under the substrate supporting surface.