Backlight module and display device

    公开(公告)号:US11353648B2

    公开(公告)日:2022-06-07

    申请号:US16305264

    申请日:2018-02-11

    Abstract: Embodiments of the present disclosure provide a backlight module and a display device. The backlight module includes a backboard, the backboard includes a base plate and a plurality of side plates perpendicular to the base plate. The plurality of side plates are connected end to end around the base plate, and define an accommodating space having an opening with the base plate. The backlight module further includes a light guide plate (LGP) located in the accommodating space and a light source located at a light incident side of the LGP. The light source includes a substrate and a light emitting element disposed on the substrate, the substrate is parallel to and mounted on one side plate. One light emergent side of the light-emitting element (302) is opposite to the light incident side of the LGP.

    DISPLAY PANEL, PREPARATION METHOD THEREOF, AND DISPLAY DEVICE

    公开(公告)号:US20220068972A1

    公开(公告)日:2022-03-03

    申请号:US17201198

    申请日:2021-03-15

    Abstract: A display panel, a preparation method thereof, and a display device are disclosed. The display panel includes: a plurality of pixel units arranged in an array; a plurality of first signal lines extending in a first direction and arranged in a second direction; and a plurality of first connecting electrodes arranged in the second direction; where the first direction intersects with the second direction. The plurality of pixel units form m pixel rows arranged in sequence along the first direction and each extending along the second direction, where m is an integer greater than 1; and a projection of at least one pixel unit in an m-th pixel row on a plane perpendicular to the second direction and projections of the first connecting electrodes on the plane perpendicular to the second direction have an overlapped area.

    Chip bonding method and bonding device

    公开(公告)号:US11239198B2

    公开(公告)日:2022-02-01

    申请号:US16830834

    申请日:2020-03-26

    Abstract: A chip bonding method and a bonding device. The chip bonding method is used for bonding a chip to a display module, the display module includes a substrate and a functional layer on the substrate, the substrate includes a first substrate portion and a second substrate portion, the functional layer is on the first substrate portion, and an electrode is on an upper side of the second substrate portion. The chip bonding method includes: forming a light absorbing film layer on a side of the second substrate portion facing away from the electrode; coating a conductive adhesive film on the electrode, and placing the chip on the conductive adhesive film; and irradiating, by using a laser beam, a side of the second substrate portion facing away from the electrode.

    Backlight module and display device

    公开(公告)号:US11112650B2

    公开(公告)日:2021-09-07

    申请号:US16961100

    申请日:2019-11-25

    Abstract: Disclosed are a backlight module and a display device. The backlight module includes a substrate; a first circuit board and a second circuit board thereon, a gap portion is between the two circuit boards; a blocking member for blocking the gap portion; and an optical sheet on a side of the blocking member facing away from the substrate, wherein the blocking member includes a blocking portion, a space is provided between the blocking portion and the optical sheet, an orthographic projection of the blocking portion on the substrate covers that of the gap portion, and wherein the blocking portion includes a first inclined surface inclined with respect to the first circuit board and a second inclined surface inclined with respect to the second circuit board, and the two inclined surface converge in a direction toward a light exit side to reflect light incident thereon toward the light exit side.

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