公开(公告)号：US10697082B1

公开(公告)日：2020-06-30

申请号：US16538070

申请日：2019-08-12

申请人： CHANG CHUN PETROCHEMICAL CO., LTD.

发明人： Huei-Fang Huang ,  Kuei-Sen Cheng ,  Jui-Chang Chou

IPC分类号： B21C37/00 ,  C25D13/04 ,  C25D3/22 ,  C25D3/30 ,  H05K1/18 ,  C25D3/12 ,  H05K3/02

摘要： The present disclosure relates to an improved, surface-treated copper foil that is resistant to rusting and discoloration. More specifically, the surface-treated copper foil is chromium-free and includes: (a) a copper foil; optionally, (b) a barrier layer on one or both sides of the copper foil, the barrier layer comprising Ni, Zn, Co, Mn, Sn or a mixture thereof; and (c) an organic layer coupled to the one or both sides of the copper foil or one or both barrier layer(s), wherein the sum total of the N, S, and Si elements of the organic layer is more than 5 normalized atomic %.

公开(公告)号：US09955588B1

公开(公告)日：2018-04-24

申请号：US15361983

申请日：2016-11-28

申请人： Chang Chun Petrochemical Co., Ltd.

发明人： Yao-Sheng Lai ,  Kuei-Sen Cheng ,  Jui-Chang Chou

IPC分类号： H05K1/00 ,  H05K3/46 ,  H01L23/498 ,  H01L21/48 ,  H05K3/02 ,  H05K1/09 ,  H05K3/30 ,  H05K3/22

CPC分类号： H05K3/4644 ,  H01L21/4857 ,  H01L23/49822 ,  H05K1/09 ,  H05K3/022 ,  H05K3/22 ,  H05K3/303 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0338 ,  H05K2201/0355 ,  H05K2203/107

摘要： The present disclosure relates to a multilayer carrier foil, a core structure formed using the multilayer carrier foil, printed circuit boards, and electronic devices. The multilayer carrier foil comprises: (a) a copper carrier layer having a release side and a laminate side, the laminate side of carrier layer optionally having nodules; (b) a chromium release layer applied to the copper carrier layer; (c) an intermediate copper layer applied to the chromium release layer; (d) an anti-migration layer applied to the intermediate copper layer of (c); and (e) an ultra-thin copper layer applied to the anti-migration layer of (d). The disclosure further relates to methods of making the multi-layer carrier foil, the core structure, and printed circuit boards.

公开(公告)号：US20150267313A1

公开(公告)日：2015-09-24

申请号：US14486107

申请日：2014-09-15

申请人： Chang Chun Petrochemical Co., Ltd.

发明人： Jui-Chang Chou ,  Kuei-Sen Cheng ,  Yao-Sheng Lai ,  Hsi-Hsing Lo ,  Yueh-Min Liu

IPC分类号： C25D7/06 ,  C25D3/38

CPC分类号： C25D1/04 ,  C25D3/38 ,  Y10T428/12431

摘要： An electrodeposited copper foil having a texture coefficient of a plane (200) from 50 to 80%, based on the sum of the texture coefficients of a plane (111), the plane (200), a plane (220) and a plane (200) of the electrodeposited copper foil is provided. The electrodeposited copper foil is particularly suitable for use in the applications in printed circuit boards and lithium ion secondary batteries.

摘要翻译： 基于平面（111），平面（200），平面（220）和平面（220）的纹理系数之和，具有50至80％的平面（200）的纹理系数的电沉积铜箔， 200）的电沉积铜箔。 电沉积铜箔特别适用于印刷电路板和锂离子二次电池的应用。