公开(公告)号：US11346539B1

公开(公告)日：2022-05-31

申请号：US17178804

申请日：2021-02-18

Applicant: Google LLC

Inventor： Ihab A. Ali ,  Duen Hsing Hsieh

IPC: F21V29/70 ,  F21V33/00 ,  F21V29/87 ,  H05B45/18 ,  F21V23/02 ,  F21Y115/10

Abstract: This document describes techniques directed to active thermal-control of a floodlight and associated floodlights. As described, an example floodlight includes a first heat-transfer subsystem that uses a fully enclosed heat sink to transfer heat from an array of LEDs to a first housing component of the floodlight. The floodlight further includes a second heat-transfer subsystem to transfer heat from one or more PSUs to a second housing component of the floodlight. Described techniques include using thermistors located throughout the floodlight to actively monitor a temperature profile within the floodlight and, if one or more operating-temperature thresholds are violated, reducing power consumption within the floodlight.

公开(公告)号：US20220159877A1

公开(公告)日：2022-05-19

申请号：US17649529

申请日：2022-01-31

Applicant: Google LLC

Inventor： Arun Prakash Raghupathy ,  Ihab A. Ali ,  Jacobi Colton Grillo

IPC: H05K7/20 ,  H04N7/18

Abstract: This document describes a thermal-control system that is integrated into a video-recording doorbell. The thermal-control system includes a combination of heat spreaders and materials with high thermal conductivity. The thermal-control system may spread and dissipate energy from a thermal-loading condition effectuated upon the video-recording doorbell to concurrently maintain temperatures of multiple thermal zones on or within the video-recording doorbell at or below prescribed temperature thresholds.

公开(公告)号：US11317538B2

公开(公告)日：2022-04-26

申请号：US16943929

申请日：2020-07-30

Applicant: Google LLC

Inventor： Ihab A. Ali ,  Duen Hsing Hsieh

IPC: H05K7/20

Abstract: This document describes a reinforced graphite heat-spreader for a surface of a housing component of an electronic device. The reinforced graphite heat-spreader includes a heat-spreader material stack having a layer of graphite material to spread heat. The reinforced graphite heat-spreader also includes an interface material stack that joins the heat-spreader material stack to the housing surface of an electronic device. The interface material stack, which may be formed using embossing techniques, includes protuberances that may be formed from an adhesive material.

公开(公告)号：US20210392795A1

公开(公告)日：2021-12-16

申请号：US16899148

申请日：2020-06-11

Applicant: Google LLC

Inventor： Emil Rahim ,  Chintan Trehan ,  Ihab A. Ali ,  Wilson Tang

IPC: H05K7/20 ,  G01R31/28 ,  H05K1/02 ,  G06F3/16

Abstract: The present disclosure describes thermal mitigation for an electronic speaker device and associated systems and methods. The thermal mitigation includes monitoring several thermal zones to determine or estimate thermal conditions in corresponding parts of the electronic speaker device. The thermal zones may include a System-on-Chip (SoC) integrated circuit (IC) component, audio components including power-dissipating IC components, and a temperature of an exterior surface of a housing component of the electronic speaker device. To mitigate thermal runaway, different throttling schemes may be triggered based on the thermal zones exceeding certain thermal limits. The throttling schemes may include reducing the amount of power supplied to the SoC, reducing audio power of the audio components to a lower wattage, or manipulating SoC cores such as by disabling one or more of the cores or adjusting utilization of the SoC cores.