公开(公告)号：US20240155818A1

公开(公告)日：2024-05-09

申请号：US18504485

申请日：2023-11-08

Applicant: Google LLC

Inventor： Emil Rahim ,  Chintan Trehan ,  Ihab A. Ali ,  Wilson Tang

IPC: H05K7/20 ,  G01R31/28 ,  G06F3/16 ,  H04R9/02 ,  H05K1/02

CPC classification number: H05K7/20945 ,  G01R31/2877 ,  G06F3/165 ,  H04R9/022 ,  H05K1/0203 ,  H04R1/02

Abstract: The present disclosure describes thermal mitigation for an electronic speaker device and associated systems and methods. The thermal mitigation includes monitoring several thermal zones to determine or estimate thermal conditions in corresponding parts of the electronic speaker device. The thermal zones may include a System-on-Chip (SoC) integrated circuit (IC) component, audio components including power-dissipating IC components, and a temperature of an exterior surface of a housing component of the electronic speaker device. To mitigate thermal runaway, different throttling schemes may be triggered based on the thermal zones exceeding certain thermal limits. The throttling schemes may include reducing the amount of power supplied to the SoC, reducing audio power of the audio components to a lower wattage, or manipulating SoC cores such as by disabling one or more of the cores or adjusting utilization of the SoC cores.

公开(公告)号：US11832426B2

公开(公告)日：2023-11-28

申请号：US16899148

申请日：2020-06-11

Applicant: Google LLC

Inventor： Emil Rahim ,  Chintan Trehan ,  Ihab A. Ali ,  Wilson Tang

IPC: H05K7/20 ,  G01R31/28 ,  G06F3/16 ,  H05K1/02 ,  H04R9/02 ,  H04R1/02 ,  H04R3/00

CPC classification number: H05K7/20945 ,  G01R31/2877 ,  G06F3/165 ,  H04R9/022 ,  H05K1/0203 ,  H04R1/02 ,  H04R3/007 ,  H05K2201/10151

Abstract: The present disclosure describes thermal mitigation for an electronic speaker device and associated systems and methods. The thermal mitigation includes monitoring several thermal zones to determine or estimate thermal conditions in corresponding parts of the electronic speaker device. The thermal zones may include a System-on-Chip (SoC) integrated circuit (IC) component, audio components including power-dissipating IC components, and a temperature of an exterior surface of a housing component of the electronic speaker device. To mitigate thermal runaway, different throttling schemes may be triggered based on the thermal zones exceeding certain thermal limits. The throttling schemes may include reducing the amount of power supplied to the SoC, reducing audio power of the audio components to a lower wattage, or manipulating SoC cores such as by disabling one or more of the cores or adjusting utilization of the SoC cores.

公开(公告)号：US20210392795A1

公开(公告)日：2021-12-16

申请号：US16899148

申请日：2020-06-11

Applicant: Google LLC

Inventor： Emil Rahim ,  Chintan Trehan ,  Ihab A. Ali ,  Wilson Tang

IPC: H05K7/20 ,  G01R31/28 ,  H05K1/02 ,  G06F3/16

Abstract: The present disclosure describes thermal mitigation for an electronic speaker device and associated systems and methods. The thermal mitigation includes monitoring several thermal zones to determine or estimate thermal conditions in corresponding parts of the electronic speaker device. The thermal zones may include a System-on-Chip (SoC) integrated circuit (IC) component, audio components including power-dissipating IC components, and a temperature of an exterior surface of a housing component of the electronic speaker device. To mitigate thermal runaway, different throttling schemes may be triggered based on the thermal zones exceeding certain thermal limits. The throttling schemes may include reducing the amount of power supplied to the SoC, reducing audio power of the audio components to a lower wattage, or manipulating SoC cores such as by disabling one or more of the cores or adjusting utilization of the SoC cores.