公开(公告)号：US20200185292A1

公开(公告)日：2020-06-11

申请号：US16358203

申请日：2019-03-19

Applicant: Google LLC

Inventor： Woon Seong Kwon ,  Ryohei Urata ,  Teckgyu Kang

IPC: H01L23/29 ,  H01L23/31 ,  H01L23/498 ,  H01L25/065 ,  H01L23/538 ,  H01L23/00 ,  H01L21/56

Abstract: Integrated circuit substrates having features for containing liquid adhesive, and methods for fabricating such substrates, are provided. A device can include a first substrate layer and a second substrate layer adhered to the first substrate layer such that a portion of the top surface of the first substrate layer is exposed to define a bottom of a cavity, and an edge of the second substrate layer adjacent to the exposed top surface of the first substrate layer defines an edge of the cavity. The device can include an integrated circuit die adhered to the exposed top surface of first substrate layer with a liquid adhesive. The first substrate layer can define a trench in the bottom of the cavity between a region of the integrated circuit die and the edge of the cavity such that the trench can receive bleed-out of the liquid adhesive from between the integrated circuit die and the top surface of the first substrate layer.

公开(公告)号：US20200162165A1

公开(公告)日：2020-05-21

申请号：US16358200

申请日：2019-03-19

Applicant: Google LLC

Inventor： Xiang Zhou ,  Lieven Verslegers ,  Hong Liu ,  Ryohei Urata

IPC: H04B10/516 ,  H04L25/03

Abstract: Systems and methods of transmitting direct detection optical signal are provided. A direct detection optical transmitter according to illustrative embodiments includes a Mach Zehnder Modulator (MZM) configured to modulate laser light based on an electrical drive signal to generate a modulated optical signal and a complementary-modulated optical signal. The optical transmitter includes an optical finite impulse response (FIR) filter configured to receive the complementary-modulated optical signal and generate a filtered optical signal. The optical transmitter includes a polarization rotator configured to receive the filtered optical signal and output a rotated optical signal. The optical transmitter includes an optical combiner configured to combine the modulated optical signal and the rotated optical signal. The optical transmitter includes an output port configured to output the combined optical signal.

公开(公告)号：US20190107673A1

公开(公告)日：2019-04-11

申请号：US16131594

申请日：2018-09-14

Applicant: Google LLC

Inventor： Lieven Verslegers ,  Mohammad Sotoodeh ,  Ryohei Urata

IPC: G02B6/126 ,  G02B6/122

Abstract: Silicon-on-insulator photonic integrated circuits (PICs) are provided. A PIC can include a silicon dioxide substrate surrounding a silicon waveguide. The silicon waveguide has a thickness between an upper side and a lower side and a width between lateral sides. The thickness and width can be set such that a first group index of a lowest-order TE mode of an optical signal is approximately equal to a second group index of a lowest-order TM mode of the optical signal.

公开(公告)号：US20180299628A1

公开(公告)日：2018-10-18

申请号：US15948435

申请日：2018-04-09

Applicant: Google LLC

Inventor： Hong Liu ,  Ryohei Urata ,  Woon Seong Kwon ,  Teckgyu Kang

IPC: G02B6/42 ,  H01L25/16 ,  H01L23/00 ,  H05K3/34 ,  H01L23/498 ,  H01L23/14 ,  H01L23/15 ,  H05K1/18

Abstract: Signal integrity in high-speed applications is dependent on both the underlying device performance and electronic packaging methods. The maturity of chip-on-board (COB) packaging technology using wire bonding makes it a cost beneficial option for the mass production of high-speed optical transceivers. However, wire bonding introduces parasitic inductance associated with the length of the bond wires that limits the scalability of the system for higher data throughput. A high-speed optical transceiver package according to a first proposed configuration minimizes packaging related parasitic inductance by vertically integrating components using flip-chip bonding. A high-speed optical transceiver package according to a second proposed configuration minimizes packaging related parasitic inductance with horizontal tiling of components using a chip carrier and flip-chip bonding.

公开(公告)号：US10084547B2

公开(公告)日：2018-09-25

申请号：US15914583

申请日：2018-03-07

Applicant: Google LLC

Inventor： Xiang Zhou ,  Ryohei Urata ,  Erji Mao ,  Hong Liu ,  Christopher Lyle Johnson

IPC: H04B10/00 ,  H04B10/69

Abstract: This disclosure provides systems, methods, and apparatus for mitigating the effects of interference signals on optical signals received at a direct-detection optical receivers. The optical receivers are capable of attenuating interference noise signals resulting from the interference between a transmitted optical signal transmitted from a transmitter to the optical receiver and one or more additional signals received at the optical receiver. The interference can be due to multi-path interference or due to in-band interference. The receivers include a tunable filter for filtering the received optical signal to remove the interference. A frequency offset module processes the received optical signal to determine a frequency offset indicative of the difference between the carrier frequencies of a modulated optical signal and an interference optical signal. The offset frequency and a bandwidth determined by the frequency offset module can be used to adjust the tunable filter to remove the interference signal from the received signal.