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公开(公告)号：US20240324148A1
公开(公告)日：2024-09-26
申请号：US18732869
申请日：2024-06-04
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： John P. Franz , Tahir Cader , Matthew Richard Slaby
CPC classification number: H05K7/20836 , G05B15/02 , H05K7/20772 , H05K7/20781 , G01L13/00
Abstract: Example implementations relate to a chassis cooling resource. In some examples, a chassis cooling resource includes a controller, comprising instructions to detect a failure corresponding to a first cooling system of a first chassis coupled to a server rack, and alter settings of a second cooling system of a second chassis coupled the server rack to provide additional cooling resources to the first cooling system in response to the detected failure.
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公开(公告)号：US20240251528A1
公开(公告)日：2024-07-25
申请号：US18627195
申请日：2024-04-04
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Ernesto Ferrer Medina , Harvey J. Lunsman , Tahir Cader , John Franz
CPC classification number: H05K7/20509 , G06F1/20 , H05K1/0203
Abstract: A circuit board cooling apparatus is disclosed having a heat spreader device to be thermally coupled with a surface of the circuit board to be cooled. Also, a conforming heat transfer device is disclosed that is thermally and physically coupled with the heat spreader device to conform to a surface contour of the heat spreader device on a first side of the heat transfer device. The cooling apparatus also includes a heat transport device physically attached and thermally coupled with a second side of the heat transfer device.
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公开(公告)号：US11877422B2
公开(公告)日：2024-01-16
申请号：US17399940
申请日：2021-08-11
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： John Franz , Ernesto Ferrer , Tahir Cader
CPC classification number: H05K7/20272 , F28F9/0224 , F28F9/0248 , H05K1/0203 , H05K7/20218 , H05K7/20254 , H05K2201/10159
Abstract: A memory cooler includes a unitary thermal transfer device and a pair of endcaps. The unitary thermal transfer device includes heat transfer tubes, a first end block, a second end block, an inlet chamber, an outlet chamber, an inlet, and an outlet. The first and second end blocks are structurally integrated with each of the heat transfer tubes. The inlet and outlet chambers are partially defined by either the first end block or the second end block. Each of the inlet and outlet chambers are fluidly coupled with the respective liquid flow channel of the at least one heat transfer tube. The respective flow channels to which the inlet and outlet chambers are coupled may be the same or different to define either a direct or a serpentine flow path. Each endcap is affixed to a respective one of the first end block and the second end block to define, in conjunction with the first end block and second end block, the inlet chamber and the outlet chamber.
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44.发明公开公开(公告)号：US20230180432A1
公开(公告)日：2023-06-08
申请号：US17541477
申请日：2021-12-03
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Harvey J. Lunsman , Tahir Cader
CPC classification number: H05K7/20272 , H05K1/0203
Abstract: Example implementations relate to a cooling module of a circuit assembly having a frame and an electronic circuit module including first and second chipsets, and a method of assembling the cooling module. The cooling module includes first and second cooling components. The first cooling component is connectable to the frame to establish a first thermal interface between the first cooling component and the first chipset. The first cooling component is positioned within a recess portion of the second cooling component, and each connector of a pair of second fluid connectors in the second cooling component is movably connected to a respective connector of a pair of first fluid connectors in the first cooling component to establish a fluid-flow path between the first and second cooling components. The second cooling component is connectable to the frame to establish a second thermal interface between the second cooling component and the second chipset.
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公开(公告)号：US20230047496A1
公开(公告)日：2023-02-16
申请号：US17399940
申请日：2021-08-11
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP.
Inventor： John Franz , Ernesto Ferrer , Tahir Cader
Abstract: A memory cooler includes a unitary thermal transfer device and a pair of endcaps. The unitary thermal transfer device includes heat transfer tubes, a first end block, a second end block, an inlet chamber, an outlet chamber, an inlet, and an outlet. The first and second end blocks are structurally integrated with each of the heat transfer tubes. The inlet and outlet chambers are partially defined by either the first end block or the second end block. Each of the inlet and outlet chambers are fluidly coupled with the respective liquid flow channel of the at least one heat transfer tube. The respective flow channels to which the inlet and outlet chambers are coupled may be the same or different to define either a direct or a serpentine flow path. Each endcap is affixed to a respective one of the first end block and the second end block to define, in conjunction with the first end block and second end block, the inlet chamber and the outlet chamber.
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Patent Agency Ranking
公开(公告)号：US11199192B1
公开(公告)日：2021-12-14
申请号：US16943069
申请日：2020-07-30
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： John Franz , Tahir Cader , Ernesto Ferrer Medina
Abstract: Example implementations relate to a method and system for pumping fluid with a pump assembly to cool waste-heat producing system of an apparatus. The pump assembly includes a first housing, a rotor assembly, a stator assembly, a second housing, an outlet connection port coupled to the second housing, and a guide vane insert. The first housing includes a first bore and first inlet guide vanes (IGVs) coupled to inlet of the first bore. The rotor assembly including an impeller, is disposed in the first bore. The stator assembly including a coil, is mounted around a portion of the first housing. The second housing has a second bore fluidically coupled to the first bore, and first outlet guide vanes (OGVs) coupled at an entrance of the second bore. The guide vane insert including second OGVs, is disposed within the outlet connection port and fluidically coupled to outlet of the second bore.
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公开(公告)号：US11157050B1
公开(公告)日：2021-10-26
申请号：US16860926
申请日：2020-04-28
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Harvey J. Lunsman , Ernesto Ferrer Medina , Tahir Cader , Steven Dean
Abstract: Example implementations relate to a method and system for cooling a compute node tray including a board, a plurality of first and second devices, a cooling assembly, and a support structure assembly. The cooling assembly includes a supply section, a return section, and an intermediate section coupled to the supply and return sections. The supply section includes a first conduit extending along a perimeter of the board and forming a thermal contact with the first devices. The intermediate section includes a plurality of cold plates and a plurality of second conduits forming the thermal contact with the second devices. The second conduits extends parallel to one another. The return section includes a third conduit extending parallel to a portion of the first conduit. The support structure encompasses the board and forms the thermal contact with a portion of the board, a plurality of third devices, and the cooling assembly.
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公开(公告)号：US20210133369A1
公开(公告)日：2021-05-06
申请号：US16673243
申请日：2019-11-04
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Tahir Cader , Mehmet Kivanc Ozonat
IPC: G06F30/20
Abstract: In exemplary aspects of managing, monitoring and maintaining computing systems and devices such as edge data centers (EDCs), probabilistic models such as dynamic Bayesian networks (DBNs) are generated. The DBNs can define individual and collective systems such as EDCs. The DBNs are built by generating or estimating the model structure and model parameters. The model can be deployed, for instance, to identify actual or potentially anomalous behavior within the individual or collective systems defined by the model. The model can also be deployed to predict anomalous behavior. Based on the results of the model, corrective measures can be taken to remedy the anomalies, and/or to optimize the impact therefrom.
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公开(公告)号：US20210092869A1
公开(公告)日：2021-03-25
申请号：US16580605
申请日：2019-09-24
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Harvey Lunsman , Tahir Cader
Abstract: Methods and systems for creating cold plates are disclosed. For example, in one example method for manufacturing a cold plate made of a thermally-conductive plastic includes performing a first injection-molding process using the thermally-conductive plastic to produce a first unitary body, the first unitary body including one or more elongated sections forming a unitary body, performing a second injection-molding process using the thermally-conductive plastic to produce a second unitary body, the second unitary body incorporating the first unitary body so as to cover a majority of the first unitary body and form a respective coolant pipe body corresponding to each elongated section, and performing a machining process on the second unitary body so as to create a conduit in each respective coolant pipe body suitable for a fluid to pass through to create respective coolant pipes.
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公开(公告)号：US20200161214A1
公开(公告)日：2020-05-21
申请号：US16192576
申请日：2018-11-15
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： John Franz , Harvey J. Lunsman , Tahir Cader
IPC: H01L23/473 , G06F1/20
Abstract: Systems and devices for cooling servers are provided. In one aspect, a cooling device includes a first axial pump including a body having an impeller, the first axial pump coupled to a first pump housing, the first axial pump housing coupled to a chassis, a rack, a row of racks, or one or more racks of the row of racks that are housing one or more servers. The cooling device also includes an inlet pipe coupled to an inlet of the first pump housing, the inlet pipe supplying cooling fluid to the first axial pump. The cooling device also includes an outlet pipe having an outlet coupled to the first pump housing, the outlet pipe receiving the cooling fluid from the first axial pump.
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