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    Light emitting diode package
    41.
    发明授权
    Light emitting diode package 失效
    发光二极管封装

    公开(公告)号：US07652306B2

    公开(公告)日：2010-01-26

    申请号：US12078107

    申请日：2008-03-27

    Applicant: Jin-Won Lee ,  Kyoung-Il Park ,  Sun-Hong Kim

    Inventor： Jin-Won Lee ,  Kyoung-Il Park ,  Sun-Hong Kim

    IPC: H01L33/00

    CPC classification number: H01L33/486 ,  H01L25/167 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A light-emitting diode (“LED”) package is disclosed. The LED package includes a substrate, a pad frame, an LED chip and a housing. The pad frame includes a conductive lead divided by insulation materials on the substrate. The LED chip is mounted on the conductive lead. The housing surrounds the LED chip and the conductive lead, and has opening recess exposing the LED chip and a part of the conductive lead. The conductive lead includes a protrusion extended in both directions substantially perpendicular to a longitudinal direction of the housing.

    Abstract translation: 公开了发光二极管（“LED”）封装。 LED封装包括衬底，衬垫框架，LED芯片和壳体。 衬垫框架包括由衬底上的绝缘材料划分的导电引线。 LED芯片安装在导电引线上。 壳体围绕LED芯片和导电引线，并且具有暴露LED芯片和导电引线的一部分的开口凹部。 导电引线包括在与壳体的纵向方向基本垂直的两个方向上延伸的突起。

    Light emitting diode package
    43.
    发明申请
    Light emitting diode package 失效
    发光二极管封装

    公开(公告)号：US20090189174A1

    公开(公告)日：2009-07-30

    申请号：US12078107

    申请日：2008-03-27

    Applicant: Jin-Won Lee ,  Kyoung-Il Park ,  Sun-Hong Kim

    Inventor： Jin-Won Lee ,  Kyoung-Il Park ,  Sun-Hong Kim

    IPC: H01L33/00

    CPC classification number: H01L33/486 ,  H01L25/167 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A light-emitting diode (“LED”) package is disclosed. The LED package includes a substrate, a pad frame, an LED chip and a housing. The pad frame includes a conductive lead divided by insulation materials on the substrate. The LED chip is mounted on the conductive lead. The housing surrounds the LED chip and the conductive lead, and has opening recess exposing the LED chip and a part of the conductive lead. The conductive lead includes a protrusion extended in both directions substantially perpendicular to a longitudinal direction of the housing.

    Abstract translation: 公开了一种发光二极管（“LED”）封装。 LED封装包括衬底，衬垫框架，LED芯片和壳体。 衬垫框架包括由衬底上的绝缘材料划分的导电引线。 LED芯片安装在导电引线上。 壳体围绕LED芯片和导电引线，并且具有暴露LED芯片和导电引线的一部分的开口凹部。 导电引线包括在与壳体的纵向方向基本垂直的两个方向上延伸的突起。

    Resolver excitation signal generating apparatus
    46.
    发明授权
    Resolver excitation signal generating apparatus 失效
    分解激励信号发生装置

    公开(公告)号：US5304909A

    公开(公告)日：1994-04-19

    申请号：US824534

    申请日：1992-01-23

    Applicant: Sang-Hyun Jin ,  Sang-Gwon Lim ,  Jin-Won Lee

    Inventor： Sang-Hyun Jin ,  Sang-Gwon Lim ,  Jin-Won Lee

    IPC: G01D5/245 ,  G05B19/31 ,  H02P5/16

    CPC classification number: G05B19/31

    Abstract: The present invention relates to a resolver excitation signal generating apparatus for supplying a reference excitation signal to a resolver attached to a motor for driving a robot or a computer numerical control machine. When a sine-wave signal is transferred from a signal generator to the resolver, the signal is filtered by a low pass filter, amplified up to the rated voltage by means of a line driver and supplied to the resolver, thereby allowing the position of the motor to be controlled exactly.

    Abstract translation: 旋转变压器激励信号发生装置技术领域本发明涉及一种用于将参考激励信号提供给附接到用于驱动机器人的电机的旋转变压器或计算机数字控制机的分解器激励信号发生装置。 当正弦波信号从信号发生器传送到旋转变压器时，信号由低通滤波器滤波，借助于线驱动器放大到额定电压，并提供给旋转变压器，从而允许 电机要精确控制。

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