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    Side view type light emitting diode package
    3.
    发明申请
    Side view type light emitting diode package 审中-公开
    侧视型发光二极管封装

    公开(公告)号：US20090189175A1

    公开(公告)日：2009-07-30

    申请号：US12078117

    申请日：2008-03-27

    申请人： Ik-Seong Park ,  Sun-Hong Kim ,  Jin-Won Lee ,  Kyoung-Il Park

    发明人： Ik-Seong Park ,  Sun-Hong Kim ,  Jin-Won Lee ,  Kyoung-Il Park

    IPC分类号： H01L33/00

    CPC分类号： H01L33/486 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Disclosed is a side view light emitting diode (LED) package whose light emitting surface has been relatively expanded. The LED package includes a housing and a lead frame extended externally through the housing and bent in a direction of the recessed space. The housing includes a reflecting housing having a cavity and a supporting housing.

    摘要翻译： 公开了一种其发光表面相对膨胀的侧视发光二极管（LED）封装。 LED封装包括壳体和引线框架，引线框架从外部延伸穿过壳体并在凹陷空间的方向上弯曲。 壳体包括具有空腔和支撑壳体的反射壳体。

    LIQUID CONTAINER
    6.
    发明申请
    LIQUID CONTAINER 审中-公开

    公开(公告)号：US20180369844A1

    公开(公告)日：2018-12-27

    申请号：US16013972

    申请日：2018-06-21

    申请人： Sun Hong Kim ,  Jeong A. Choi

    发明人： Sun Hong Kim ,  Jeong A. Choi

    IPC分类号： B05B11/00 ,  B05B11/04

    摘要： A liquid container comprises an upper part having an open bottom, a lower part having an open top, the lower part detachably coupled to the upper part under the upper part, and a cap detachably coupled to the lower part over or under the lower part, the cap having a flange formed along a lower outer circumference thereof, wherein a container opening/closing means coupling the upper part with the lower part, the container opening/closing means including a first opening/closing means or a second opening/closing means, wherein the first opening/closing means includes a bendable part attached to a lower side portion of the upper part and an upper side portion of the lower part, and wherein the second opening/closing means includes a hinge structure configured to open or close the upper part and the lower part with respect to each other.

    LIGHT EMITTING DIODE PACKAGE
    7.
    发明申请
    LIGHT EMITTING DIODE PACKAGE 失效
    发光二极管封装

    公开(公告)号：US20090309122A1

    公开(公告)日：2009-12-17

    申请号：US12483560

    申请日：2009-06-12

    申请人： Sun-Hong Kim ,  Jin-Won Lee ,  Kyoung-Il Park

    发明人： Sun-Hong Kim ,  Jin-Won Lee ,  Kyoung-Il Park

    IPC分类号： H01L23/495

    CPC分类号： H01L33/62 ,  H01L23/49537 ,  H01L33/486 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A light emitting diode package is provided including: a lead frame that includes an electrode pad and an electrode lead that are integrally formed to each other; and a housing, wherein the electrode pad is exposed in a first direction through a window formed by inner walls of the housing, and the electrode lead is exposed in a second direction through a through-hole, wherein the housing includes a step jaw prepared by sinking the housing inner walls.

    摘要翻译： 提供了一种发光二极管封装，包括：引线框架，其包括彼此一体形成的电极焊盘和电极引线; 以及壳体，其中所述电极焊盘通过由所述壳体的内壁形成的窗口沿第一方向暴露，并且所述电极引线通过通孔在第二方向上暴露，其中所述壳体包括由 沉没房屋内墙。

    Light emitting diode package
    9.
    发明申请
    Light emitting diode package 审中-公开
    发光二极管封装

    公开(公告)号：US20090189171A1

    公开(公告)日：2009-07-30

    申请号：US12078106

    申请日：2008-03-27

    申请人： Jin-Won Lee ,  Kyoung-Il Park ,  Sun-Hong Kim

    发明人： Jin-Won Lee ,  Kyoung-Il Park ,  Sun-Hong Kim

    IPC分类号： H01L33/00

    CPC分类号： H01L33/486 ,  H01L33/62 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/00014 ,  H01L2924/00

    摘要： An LED package includes a housing, a substrate, a pad frame and an LED chip. The housing includes a plastic material, and has a recess with an opening at a top of the housing. The substrate includes substantially the same material with the housing. The pad frame includes conductive material, and is inserted on the substrate, and is fixed between the housing and the substrate. The LED chip is mounted on the pad frame and is disposed at a center of the recess. The housing is protruded and extended to a lower portion of the LED chip. Thicknesses of the housing's sidewalls facing to each other through the recess are substantially the same with each other.

    摘要翻译： LED封装包括壳体，衬底，衬垫框架和LED芯片。 壳体包括塑料材料，并且具有在壳体的顶部具有开口的凹部。 衬底包括与壳体基本相同的材料。 垫框架包括导电材料，并且被插入到基板上，并且固定在壳体和基板之间。 LED芯片安装在垫框架上并且设置在凹部的中心。 壳体突出并延伸到LED芯片的下部。 通过凹槽彼此面对的壳体的侧壁的厚度基本上彼此相同。