利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

46 条记录 (耗时 0.018 秒)

    Light emitting diode package
    1.
    发明授权
    Light emitting diode package 失效
    发光二极管封装

    公开(公告)号：US07910948B2

    公开(公告)日：2011-03-22

    申请号：US12483560

    申请日：2009-06-12

    申请人： Sun-Hong Kim ,  Jin-Won Lee ,  Kyoung-Il Park

    发明人： Sun-Hong Kim ,  Jin-Won Lee ,  Kyoung-Il Park

    IPC分类号： H01L23/495

    CPC分类号： H01L33/62 ,  H01L23/49537 ,  H01L33/486 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A light emitting diode package is provided including: a lead frame that includes an electrode pad and an electrode lead that are integrally formed to each other; and a housing, wherein the electrode pad is exposed in a first direction through a window formed by inner walls of the housing, and the electrode lead is exposed in a second direction through a through-hole, wherein the housing includes a step jaw prepared by sinking the housing inner walls.

    摘要翻译： 提供了一种发光二极管封装，包括：引线框架，其包括彼此一体形成的电极焊盘和电极引线; 以及壳体，其中所述电极焊盘通过由所述壳体的内壁形成的窗口沿第一方向暴露，并且所述电极引线通过通孔在第二方向上暴露，其中所述壳体包括由 沉没房屋内墙。

    Side view type light emitting diode package
    5.
    发明申请
    Side view type light emitting diode package 审中-公开
    侧视型发光二极管封装

    公开(公告)号：US20090189175A1

    公开(公告)日：2009-07-30

    申请号：US12078117

    申请日：2008-03-27

    申请人： Ik-Seong Park ,  Sun-Hong Kim ,  Jin-Won Lee ,  Kyoung-Il Park

    发明人： Ik-Seong Park ,  Sun-Hong Kim ,  Jin-Won Lee ,  Kyoung-Il Park

    IPC分类号： H01L33/00

    CPC分类号： H01L33/486 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Disclosed is a side view light emitting diode (LED) package whose light emitting surface has been relatively expanded. The LED package includes a housing and a lead frame extended externally through the housing and bent in a direction of the recessed space. The housing includes a reflecting housing having a cavity and a supporting housing.

    摘要翻译： 公开了一种其发光表面相对膨胀的侧视发光二极管（LED）封装。 LED封装包括壳体和引线框架，引线框架从外部延伸穿过壳体并在凹陷空间的方向上弯曲。 壳体包括具有空腔和支撑壳体的反射壳体。

    LIGHT EMITTING DIODE PACKAGE
    6.
    发明申请
    LIGHT EMITTING DIODE PACKAGE 失效
    发光二极管封装

    公开(公告)号：US20090309122A1

    公开(公告)日：2009-12-17

    申请号：US12483560

    申请日：2009-06-12

    申请人： Sun-Hong Kim ,  Jin-Won Lee ,  Kyoung-Il Park

    发明人： Sun-Hong Kim ,  Jin-Won Lee ,  Kyoung-Il Park

    IPC分类号： H01L23/495

    CPC分类号： H01L33/62 ,  H01L23/49537 ,  H01L33/486 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A light emitting diode package is provided including: a lead frame that includes an electrode pad and an electrode lead that are integrally formed to each other; and a housing, wherein the electrode pad is exposed in a first direction through a window formed by inner walls of the housing, and the electrode lead is exposed in a second direction through a through-hole, wherein the housing includes a step jaw prepared by sinking the housing inner walls.

    摘要翻译： 提供了一种发光二极管封装，包括：引线框架，其包括彼此一体形成的电极焊盘和电极引线; 以及壳体，其中所述电极焊盘通过由所述壳体的内壁形成的窗口沿第一方向暴露，并且所述电极引线通过通孔在第二方向上暴露，其中所述壳体包括由 沉没房屋内墙。

    Light emitting diode package
    8.
    发明申请
    Light emitting diode package 审中-公开
    发光二极管封装

    公开(公告)号：US20090189171A1

    公开(公告)日：2009-07-30

    申请号：US12078106

    申请日：2008-03-27

    申请人： Jin-Won Lee ,  Kyoung-Il Park ,  Sun-Hong Kim

    发明人： Jin-Won Lee ,  Kyoung-Il Park ,  Sun-Hong Kim

    IPC分类号： H01L33/00

    CPC分类号： H01L33/486 ,  H01L33/62 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/00014 ,  H01L2924/00

    摘要： An LED package includes a housing, a substrate, a pad frame and an LED chip. The housing includes a plastic material, and has a recess with an opening at a top of the housing. The substrate includes substantially the same material with the housing. The pad frame includes conductive material, and is inserted on the substrate, and is fixed between the housing and the substrate. The LED chip is mounted on the pad frame and is disposed at a center of the recess. The housing is protruded and extended to a lower portion of the LED chip. Thicknesses of the housing's sidewalls facing to each other through the recess are substantially the same with each other.

    摘要翻译： LED封装包括壳体，衬底，衬垫框架和LED芯片。 壳体包括塑料材料，并且具有在壳体的顶部具有开口的凹部。 衬底包括与壳体基本相同的材料。 垫框架包括导电材料，并且被插入到基板上，并且固定在壳体和基板之间。 LED芯片安装在垫框架上并且设置在凹部的中心。 壳体突出并延伸到LED芯片的下部。 通过凹槽彼此面对的壳体的侧壁的厚度基本上彼此相同。

    Side view light emitting diode package
    9.
    发明授权
    Side view light emitting diode package 有权
    侧视发光二极管封装

    公开(公告)号：US08013357B2

    公开(公告)日：2011-09-06

    申请号：US12495854

    申请日：2009-07-01

    申请人： Kyoung-Il Park ,  Jin-Won Lee ,  Sun-Hong Kim ,  Min-Sik Kim ,  Ji-Na Lee

    发明人： Kyoung-Il Park ,  Jin-Won Lee ,  Sun-Hong Kim ,  Min-Sik Kim ,  Ji-Na Lee

    IPC分类号： H01L33/62 ,  H01L33/64

    CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L33/642 ,  H01L33/647 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Provided is a side view light emitting diode package including a housing that includes a front side part and a rear side part integrally formed with the front side part, the front side part having a light emission part; and a lead frame that is located between the front side part and the rear side part, wherein the lead frame includes a first lead connected to a first electrode of a Light Emitting Diode (LED) chip and a second lead connected to a second electrode of the LED chip, wherein the front side part includes a first groove, a second groove, and a third groove, wherein the first lead and the second lead are extended through the first groove and the second groove, respectively, and a heat dissipation part is extended from the first lead through the third groove to an outside of the LED package.

    摘要翻译： 提供一种侧视发光二极管封装，其包括壳体，该壳体包括前侧部分和与前侧部分一体形成的后侧部分，前侧部分具有发光部分; 以及位于前侧部分和后侧部分之间的引线框架，其中引线框架包括连接到发光二极管（LED）芯片的第一电极的第一引线和连接到第二电极的第二引线 所述LED芯片，其中所述前侧部分包括第一凹槽，第二凹槽和第三凹槽，其中所述第一引线和所述第二引线分别延伸穿过所述第一凹槽和所述第二凹槽，并且散热部分 从第一引线延伸通过第三凹槽延伸到LED封装的外部。

    Light emitting diode package
    10.
    发明授权
    Light emitting diode package 失效
    发光二极管封装

    公开(公告)号：US07652306B2

    公开(公告)日：2010-01-26

    申请号：US12078107

    申请日：2008-03-27

    申请人： Jin-Won Lee ,  Kyoung-Il Park ,  Sun-Hong Kim

    发明人： Jin-Won Lee ,  Kyoung-Il Park ,  Sun-Hong Kim

    IPC分类号： H01L33/00

    CPC分类号： H01L33/486 ,  H01L25/167 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A light-emitting diode (“LED”) package is disclosed. The LED package includes a substrate, a pad frame, an LED chip and a housing. The pad frame includes a conductive lead divided by insulation materials on the substrate. The LED chip is mounted on the conductive lead. The housing surrounds the LED chip and the conductive lead, and has opening recess exposing the LED chip and a part of the conductive lead. The conductive lead includes a protrusion extended in both directions substantially perpendicular to a longitudinal direction of the housing.

    摘要翻译： 公开了发光二极管（“LED”）封装。 LED封装包括衬底，衬垫框架，LED芯片和壳体。 衬垫框架包括由衬底上的绝缘材料划分的导电引线。 LED芯片安装在导电引线上。 壳体围绕LED芯片和导电引线，并且具有暴露LED芯片和导电引线的一部分的开口凹部。 导电引线包括在与壳体的纵向方向基本垂直的两个方向上延伸的突起。