公开(公告)号：US08953317B2

公开(公告)日：2015-02-10

申请号：US13281669

申请日：2011-10-26

申请人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC分类号： H02B1/00 ,  H02B1/56 ,  H05K7/20 ,  F28F7/00 ,  F28D15/00 ,  H01L23/12 ,  H01L23/34 ,  H01B7/42 ,  F28D1/047 ,  F28D15/02

CPC分类号： F28D1/0477 ,  F28D15/0266 ,  F28D15/0275 ,  H05K7/203 ,  H05K7/20809

摘要： Cooling apparatuses and methods are provided for immersion-cooling one or more electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a fluid-tight compartment about the electronic component(s) and a dielectric fluid disposed within the fluid-tight compartment, with the electronic component(s) immersed within the dielectric fluid. A vapor-condenser and one or more wicking components are also provided. The vapor-condenser includes a plurality of thermally conductive condenser fins extending within the fluid-tight compartment, and the wicking component(s) is disposed within the fluid-tight compartment in physical contact with at least a portion of one or more thermally conductive condenser fins of the thermally conductive condenser fins extending within the compartment. The wicking component(s) facilitates drawing condensed fluid from a surface of the thermally conductive condenser fin(s) and thereby enhances heat transfer across the surface of the condenser fin(s).

摘要翻译： 提供冷却装置和方法用于浸入冷却一个或多个电子部件。 冷却装置包括壳体，其至少部分围绕电子部件围绕并形成流体密封的隔室，以及布置在流体密封隔室内的电介质流体，电子部件浸入介电流体内。 还提供蒸气冷凝器和一个或多个芯吸部件。 蒸汽冷凝器包括在流体密封室内延伸的多个导热冷凝器翅片，并且芯吸部件设置在流体密封室内，与至少一部分一个或多个导热冷凝器物理接触 在隔室内延伸的导热冷凝器翅片的翅片。 芯吸部件有助于从导热性冷凝器翅片的表面吸收冷凝流体，从而增强横跨冷凝器翅片的表面的热传递。

公开(公告)号：US08941994B2

公开(公告)日：2015-01-27

申请号：US13613753

申请日：2012-09-13

申请人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K7/20 ,  F28F3/00

CPC分类号： H05K7/20309 ,  B23P15/26 ,  F28D9/0025 ,  F28D15/02 ,  F28F3/046 ,  F28F3/12 ,  F28F9/02 ,  H05K7/203 ,  H05K7/20809 ,  Y10T29/4935 ,  Y10T29/49359 ,  Y10T29/49396

摘要： A vapor condenser is provided which includes a three-dimensional folded structure which defines, at least in part, a set of coolant-carrying channels and a set of vapor condensing channels, with the coolant-carrying channels being interleaved with and extending parallel to the vapor condensing channels. The folded structure includes a thermally conductive sheet with multiple folds in the sheet. One side of the sheet is a vapor condensing surface, and the opposite side of the sheet is a coolant-cooled surface, with at least a portion of the coolant-cooled surface defining the coolant-carrying channels, and being in contact with coolant within the coolant-carrying channels. The vapor condenser further includes, in one embodiment, a top plate, and first and second end manifolds which are coupled to opposite ends of the folded structure and in fluid communication with the coolant-carrying channels to facilitate flow of coolant through the coolant-carrying channels.

摘要翻译： 提供了一种蒸汽冷凝器，其包括三维折叠结构，其至少部分地限定一组冷却剂传送通道和一组蒸气冷凝通道，其中冷却剂传送通道与 蒸汽冷凝通道。 折叠结构包括在片材中具有多个折叠的导热片。 片材的一侧是蒸汽冷凝表面，并且片材的相对侧是冷却剂冷却的表面，冷却剂冷却表面的至少一部分限定了冷却剂传送通道，并与冷却剂内部的冷却剂接触 冷却液承载通道。 蒸气冷凝器在一个实施例中还包括顶板，以及第一和第二端部歧管，其连接到折叠结构的相对端并与冷却剂承载通道流体连通以便于冷却剂流过冷却剂携带 频道

公开(公告)号：US08760863B2

公开(公告)日：2014-06-24

申请号：US13285105

申请日：2011-10-31

申请人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC分类号： H05K5/00 ,  H05K7/20 ,  G06F1/20

CPC分类号： H05K7/20709 ,  H05K7/20781

摘要： A multi-rack assembly is provided which includes adjacent first and second electronics racks, each being at least partially air-cooled, and an air-to-liquid heat exchanger associated with the first rack for cooling at least a portion of air passing through the first rack. The heat exchanger, which is disposed at the air inlet or air outlet side of the first rack and is coupled in fluid communication with a coolant loop to receive coolant from the loop and exhaust coolant to the loop, transfers heat from air passing thereacross to coolant passing therethrough. The assembly also includes a cooling unit, associated with the first rack and cooling coolant in the coolant loop, and an airflow director associated with the second rack and facilitating ducting at least a portion of air passing through the second rack to also pass across the heat exchanger associated with the first rack.

摘要翻译： 提供了一种多机架组件，其包括相邻的第一和第二电子机架，每个电子机架至少部分地是空气冷却的，以及与第一机架相关联的空气与液体热交换器，用于冷却通过 第一个机架。 该热交换器设置在第一齿条的空气入口或空气出口侧，并且与冷却剂回路流体连通地连接以接收来自回路的冷却剂并将冷却剂排出到回路，将来自经过其的空气的热量传递给冷却剂 通过 组件还包括与第一齿条相关联的冷却单元和冷却剂回路中的冷却冷却剂，以及与第二齿条相关联的气流引导件，并且便于管道通过第二齿条的至少一部分空气也穿过热 交换机与第一个机架相关联。

公开(公告)号：US08619425B2

公开(公告)日：2013-12-31

申请号：US13281945

申请日：2011-10-26

申请人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC分类号： H05K7/20

CPC分类号： H05K7/203 ,  H05K7/20809

摘要： Cooling apparatuses and methods are provided for immersion-cooling one or more electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a fluid-tight compartment about the electronic component(s), and a boiling fluid mixture of first and second dielectric fluids within the fluid-tight compartment, with the electronic component(s) immersed within the mixture. A condensing fluid is also provided within the fluid-tight compartment, and is immiscible with the boiling fluid mixture. The condensing fluid has a lower specific gravity and a higher thermal conductivity than the boiling fluid mixture, and facilitates condensing of vaporized boiling fluid mixture. A cooling structure is provided within the compartment, and includes a condensing region and a sub-cooling region, with the condensing region being in contact with the condensing fluid, and the sub-cooling region being in contact with the boiling fluid mixture. The cooling structure facilitates heat removal from the fluid-tight compartment.

摘要翻译： 提供冷却装置和方法用于浸入冷却一个或多个电子部件。 冷却装置包括至少部分围绕电子部件周围并形成流体密封的隔室的壳体，以及流体密封室内的第一和第二介电流体的沸腾流体混合物，其中电子部件 浸在混合物中。 冷凝流体也设置在流体密封室内，并与沸腾的流体混合物不混溶。 冷凝液具有比沸腾流体混合物更低的比重和更高的热导率，并且有助于蒸发的沸腾流体混合物的冷凝。 冷却结构设置在隔室内，并且包括冷凝区域和副冷却区域，其中冷凝区域与冷凝流体接触，并且副冷却区域与沸腾流体混合物接触。 冷却结构便于从流体密封隔室中的热量去除。

公开(公告)号：US08322029B2

公开(公告)日：2012-12-04

申请号：US13087678

申请日：2011-04-15

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Keith F. Fogel ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Keith F. Fogel ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K3/20 ,  F28F7/00

CPC分类号： H01L23/3677 ,  H01L2224/78301 ,  Y10T29/49128 ,  Y10T29/4935 ,  H01L2924/00014

摘要： A composite interface and methods of fabrication are provided for coupling a cooling assembly to an electronic device. The interface includes a plurality of thermally conductive wires formed of a first material having a first thermal conductivity, and a thermal interface material at least partially surrounding the wires. The interface material, which thermally interfaces the cooling assembly to a surface to be cooled of the electronic device, is a second material having a second thermal conductivity, wherein the first thermal conductivity is greater than the second thermal conductivity. At least some wires reside partially over a first region of higher heat flux and extend partially over a second region of lower heat flux, wherein the first and second regions are different regions of the surface to he cooled. These wires function as thermal spreaders facilitating heat transfer from the surface to be cooled to the cooling assembly.

摘要翻译： 提供了复合界面和制造方法，用于将冷却组件连接到电子设备。 界面包括由具有第一导热性的第一材料形成的多个导热丝，以及至少部分地围绕线的热界面材料。 将冷却组件与待冷却的电子设备的表面热接合的界面材料是具有第二导热性的第二材料，其中第一热导率大于第二导热系数。 至少一些线部分地位于较高热通量的第一区域上，并且部分地延伸在较低热通量的第二区域上，其中第一和第二区域是要冷却的表面的不同区域。 这些电线作为热扩散器起促进从待冷却表面到冷却组件的热传递。

公开(公告)号：US08230906B2

公开(公告)日：2012-07-31

申请号：US12850104

申请日：2010-08-04

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： F28D15/00 ,  H05K7/20

CPC分类号： H05K7/20218

摘要： A dual-chamber fluid pump is provided for a multi-fluid electronics cooling system and method. The pump has a first fluid path for pumping a first fluid coolant and a second fluid path for pumping a second fluid coolant, with the first fluid path including a first pumping chamber and the second fluid path including a second pumping chamber. The first and second pumping chambers are separated by at least one diaphragm, and an actuator is coupled to the diaphragm for transitioning the diaphragm between a first position and a second position. Transitioning of the diaphragm to the first position pumps first fluid coolant from the first pumping chamber while concurrently drawing second fluid coolant into the second pumping chamber, and transitioning of the diaphragm to the second position pumps second fluid coolant from the second pumping chamber while concurrently drawing first fluid coolant into the first pumping chamber.

摘要翻译： 为多流体电子冷却系统和方法提供双室流体泵。 泵具有用于泵送第一流体冷却剂的第一流体路径和用于泵送第二流体冷却剂的第二流体路径，其中第一流体路径包括第一泵送室，第二流体路径包括第二泵送室。 第一和第二泵送室由至少一个隔膜隔开，并且致动器联接到隔膜，用于在第一位置和第二位置之间转换隔膜。 将隔膜转换到第一位置将第一流体冷却剂从第一泵送室抽出，同时将第二流体冷却剂拉入第二泵送室，并且将膜片转移到第二位置，从第二泵送室泵送第二流体冷却剂，同时拉伸 第一流体冷却剂进入第一泵送室。

公开(公告)号：US08094453B2

公开(公告)日：2012-01-10

申请号：US12570215

申请日：2009-09-30

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC分类号： H05K7/20

CPC分类号： H05K7/20772 ,  F28F2013/008 ,  H05K7/20781

摘要： Compliant conduction rail assembly and method are provided for facilitating cooling of an electronics structure. The rail assembly includes a first thermally conductive rail mounted to a surface of the electronics structure, a second thermally conductive rail thermally conductively interfaced to the first rail, and a biasing mechanism biasing the second rail away from the first rail. The first and second rails and the biasing mechanism are configured for slidable insertion into a housing with the electronics structure, the housing containing a liquid-cooled cold plate(s). With insertion of the electronics structure into the housing, the second rail engages the liquid-cooled cold plate and is forced by the biasing mechanism into thermal contact with the cold plate, and is forced by the cold plate towards the first rail, which results in a compliant thermal interface between the electronics structure and the liquid-cooled cold plate of the housing.

摘要翻译： 提供符合导轨组件和方法以便于电子结构的冷却。 轨道组件包括安装到电子结构的表面的第一导热轨道，与第一轨道热传导地接合的第二导热轨道，以及将第二轨道偏离第一轨道的偏置机构。 第一和第二轨道和偏置机构构造成可滑动地插入到具有电子结构的壳体中，壳体包含液冷冷板。 通过将电子结构插入壳体中，第二轨道接合液冷冷板，并被偏置机构强制与冷板热接触，并被冷板朝向第一轨道迫使，这导致 在电子结构和壳体的液冷冷板之间的柔性热界面。

公开(公告)号：US08059405B2

公开(公告)日：2011-11-15

申请号：US12491293

申请日：2009-06-25

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC分类号： H05K7/20 ,  F28F3/08 ,  F28D15/00

CPC分类号： F28D15/0266 ,  F28F3/02 ,  F28F3/12 ,  H05K7/20318 ,  H05K7/20809

摘要： Condenser structures and cooling apparatuses are provided which facilitate vapor condensation heat transfer of a coolant employed in cooling an electronic device. The condenser structure includes a thermally conductive condenser block with multiple exposed cavities therein extending from a first main surface towards a second main surface. The condenser block is a monolithic structure, and the first main surface is a coolant vapor condensate formation surface when the condenser structure is operationally facilitating cooling of an electronic device. The exposed cavities extend from the first main surface into the condenser block to increase a condensation surface area of the condenser block, thereby facilitating coolant vapor condensate formation on the condenser block, and thus cooling of the electronic device using a two-phase coolant. The condenser structure also includes coolant-carrying channels for facilitating cooling of the condenser block, and thus vapor condensate formation on the condenser block.

摘要翻译： 提供冷凝器结构和冷却装置，其有利于用于冷却电子设备的冷却剂的蒸气冷凝传热。 冷凝器结构包括其中从第一主表面朝向第二主表面延伸的多个暴露空腔的导热冷凝器块。 冷凝器块是整体结构，并且当冷凝器结构在操作上有助于电子设备的冷却时，第一主表面是冷却剂蒸气冷凝物形成表面。 暴露的空腔从第一主表面延伸到冷凝器块中以增加冷凝器块的冷凝表面积，从而有助于在冷凝器块上形成冷凝剂蒸气冷凝物，从而使得使用两相冷却剂冷却电子设备。 冷凝器结构还包括用于促进冷凝器块的冷却的冷却剂输送通道，并且因此在冷凝器块上形成蒸汽冷凝物。

公开(公告)号：US08051897B2

公开(公告)日：2011-11-08

申请号：US11290899

申请日：2005-11-30

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： F28F7/00 ,  H05K7/20 ,  H05K5/00

CPC分类号： H05K7/20772

摘要： A redundant assembly for an air and liquid cooled module is provided. The redundant cooling assembly comprises an air and liquid cooled module having a cold plate in thermal communication with a side attached auxiliary drawer. The auxiliary drawer houses a heat exchanger, a liquid pump with piping such that the heat exchanger, the liquid pump with piping and the cold plate form a closed liquid cooling loop. The auxillary drawer also housing an air moving device such that air can readily pass through the air moving device and the heat exchanger in order to provide air cooling. In one embodiment of the invention, fins are disposed on the cold plate to provide cooling in case the pump or the air moving device or both encounter a failure. In alternate embodiments, multiple pumps and/or multiple air moving devices can be used with or without the cold plate fins to provide redundancies.

摘要翻译： 提供了一种用于空气和液体冷却模块的冗余组件。 冗余冷却组件包括空气和液体冷却模块，其具有与附接辅助抽屉热连通的冷板。 辅助抽屉装有一个热交换器，一个带有管道的液体泵，使得热交换器，带管道的液体泵和冷板形成一个封闭的液体冷却回路。 辅助抽屉还容纳空气移动装置，使得空气可以容易地通过空气移动装置和热交换器以提供空气冷却。 在本发明的一个实施例中，在泵或空气移动装置或两者都遇到故障的情况下，翅片设置在冷板上以提供冷却。 在替代实施例中，多个泵和/或多个空气移动装置可以使用或不使用冷板翅片来提供冗余。

公开(公告)号：US07978472B2

公开(公告)日：2011-07-12

申请号：US12481824

申请日：2009-06-10

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC分类号： H05K7/20 ,  F28F7/00 ,  H01L23/34

CPC分类号： H05K7/20809 ,  H05K7/20781 ,  Y10T29/49359

摘要： Liquid-cooled electronics racks and methods of fabrication are provided wherein a liquid-based cooling apparatus facilitates cooling of electronic subsystems when docked within the electronics rack. The cooling apparatus includes a liquid-cooled cooling structure mounted to a front of the rack, and a plurality of heat transfer elements. The cooling structure is a thermally conductive material which has a coolant-carrying channel for facilitating coolant flow through the structure. Each heat transfer element couples to one or more heat-generating components of a respective electronic subsystem, physically contacts the cooling structure when that electronic subsystem is docked within the rack, and provides a thermal transport path from the heat-generating components of the electronic subsystem to the liquid-cooled cooling structure. Advantageously, electronic subsystems may be docked within or undocked from the electronics rack without affecting flow of coolant through the liquid-cooled cooling structure.

摘要翻译： 提供液冷电子机架和制造方法，其中基于液体的冷却装置便于当对接在电子机架内时电子子系统的冷却。 冷却装置包括安装在机架前部的液冷式冷却结构和多个传热元件。 冷却结构是导热材料，其具有用于促进冷却剂流过结构的冷却剂输送通道。 每个传热元件连接到相应电子子系统的一个或多个发热部件，当该电子子系统对接在机架内时，物理地接触冷却结构，并且提供从电子子系统的发热部件的热传输路径 到液冷的冷却结构。 有利地，电子子系统可以对准在电子机架内或从电子机架排出，而不会影响冷却剂通过液冷式冷却结构的流动。