公开(公告)号：US20210257385A1

公开(公告)日：2021-08-19

申请号：US17215308

申请日：2021-03-29

Applicant: Micron Technology, Inc.

Inventor： Yi Hu ,  Merri L. Carlson ,  Anilkumar Chandolu ,  Indra V. Chary ,  David Daycock ,  Harsh Narendrakumar Jain ,  Matthew J. King ,  Jian Li ,  Brett D. Lowe ,  Prakash Rau Mokhna Rau ,  Lifang Xu

IPC: H01L27/11582 ,  H01L21/311 ,  H01L21/02 ,  H01L27/11526 ,  H01L27/11519 ,  H01L27/11565 ,  H01L27/11573 ,  H01L21/3213 ,  H01L27/11556

Abstract: A method used in forming a memory array comprising strings of memory cells and operative through-array-vias (TAVs) comprises forming a stack comprising vertically-alternating insulative tiers and conductive tiers. The stack comprises a TAV region and an operative memory-cell-string region. The TAV region comprises spaced operative TAV areas. Operative channel-material strings are formed in the stack in the operative memory-cell-string region and dummy channel-material strings are formed in the stack in the TAV region laterally outside of and not within the operative TAV areas. Operative TAVs are formed in individual of the spaced operative TAV areas in the TAV region. Other methods and structure independent of method are disclosed.

公开(公告)号：US20210125920A1

公开(公告)日：2021-04-29

申请号：US16664618

申请日：2019-10-25

Applicant: Micron Technology, Inc.

Inventor： Yi Hu ,  Harsh Narendrakumar Jain ,  Matthew J. King

IPC: H01L23/522 ,  H01L23/528 ,  H01L27/11524 ,  H01L27/11556 ,  H01L27/1157 ,  H01L27/11582

Abstract: A memory array comprising strings of memory cells comprises laterally-spaced memory blocks individually comprising a vertical stack comprising alternating insulative tiers and conductive tiers. Operative channel-material strings of memory cells extend through the insulative tiers and the conductive tiers. Intervening material is laterally-between and longitudinally-along immediately-laterally-adjacent of the memory blocks. The intervening material comprises longitudinally-alternating first and second regions that individually have a vertically-elongated seam therein. The vertically-elongated seam in the first regions has a higher top than in the second regions. The seam tops in the second regions are elevationally-coincident with or below a bottom of an uppermost of the conductive tiers. Methods are disclosed.