公开(公告)号：US20110079349A1

公开(公告)日：2011-04-07

申请号：US12654360

申请日：2009-12-17

申请人： Suk Hyeon Cho ,  Chang Sup Ryu ,  Jin Yong An ,  Soon Oh Jung ,  Sung Won Jeong ,  Byung Moon Kim ,  Dong Ju Jeon ,  Seok Kyu Lee ,  Jin Ho Kim

发明人： Suk Hyeon Cho ,  Chang Sup Ryu ,  Jin Yong An ,  Soon Oh Jung ,  Sung Won Jeong ,  Byung Moon Kim ,  Dong Ju Jeon ,  Seok Kyu Lee ,  Jin Ho Kim

IPC分类号： B32B38/10 ,  B32B38/04

CPC分类号： H05K3/4682 ,  H05K3/0035 ,  H05K3/0052 ,  H05K3/007 ,  H05K3/0097 ,  H05K3/28 ,  H05K2203/066 ,  H05K2203/1536

摘要： The present invention provides a method of manufacturing a printed circuit board including the steps of: preparing a pair of raw materials, each formed by sequentially stacking a release film and a first insulating layer, and an adhesive layer, respectively; embedding the pair of raw materials, which are opposed to each other, in the adhesive layer while disposing the release films toward an inner layer; forming a second insulating layer, which has a via formed therethrough and a circuit pattern formed on an upper surface to be connected to the via, on the first insulating layer; cutting edge portions of the second and first insulating layers, the release film, and the adhesive layer; and removing the release film from the first insulating layer.

摘要翻译： 本发明提供一种制造印刷电路板的方法，包括以下步骤：制备分别通过依次堆叠隔离膜和第一绝缘层而形成的一对原材料和粘合剂层; 在粘合剂层中嵌入彼此相对的一对原料，同时将释放膜设置在内层上; 在所述第一绝缘层上形成第二绝缘层，所述第二绝缘层具有穿过其形成的通孔和形成在与所述通孔连接的上表面上的电路图案; 第二和第一绝缘层，剥离膜和粘合剂层的切割边缘部分; 以及从所述第一绝缘层移除所述脱模膜。

公开(公告)号：US07328504B2

公开(公告)日：2008-02-12

申请号：US11453790

申请日：2006-06-15

申请人： Seung Gu Kim ,  Chang Sup Ryu ,  Han Seo Cho ,  Doo Hwan Lee ,  Hwa Sun Park

发明人： Seung Gu Kim ,  Chang Sup Ryu ,  Han Seo Cho ,  Doo Hwan Lee ,  Hwa Sun Park

IPC分类号： H05K3/30 ,  H05K3/34 ,  H01K3/10

CPC分类号： H05K1/188 ,  H05K1/185 ,  H05K2201/0355 ,  H05K2201/10674 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165

摘要： Disclosed is a method for manufacturing a circuit board, comprising step for preparing an insulating member and an electronic component having position-setting means on the lower surface thereof (S110), step for forming mounting holes in the insulating member (S120), step for mounting the electronic component on the insulating member to meet the position-setting means and the mounting holes (S130), step for forming copper cladding coated with an adhesive on the insulating member (S140), step for applying heat and/or pressure to the copper cladding (S150), and step for forming a via-hole in the copper cladding to be electrically connected to the electronic component, and step for forming a circuit pattern in the copper cladding (S160). The step (S150) can comprise a step (S240) for applying inter-adhesive on respective surfaces of the insulating member, and a step (S250) for applying copper cladding on respective surfaces of the inter-adhesive.

摘要翻译： 公开了一种制造电路板的方法，包括在其下表面上制备绝缘构件和具有位置设定装置的电子部件的步骤（S110），用于在绝缘构件中形成安装孔的步骤（S120）， 步骤，用于将所述电子部件安装在所述绝缘部件上以满足所述位置设定装置和所述安装孔（S130），用于在所述绝缘部件上形成涂覆有粘合剂的铜包层的步骤（S140），用于施加热和/ 或对铜包层的压力（S150），以及用于在铜包层中形成电气连接到电子部件的通孔的步骤，以及用于在铜包层中形成电路图案的步骤（S160）。 步骤（S150）可以包括用于在绝缘构件的相应表面上施加粘合剂的步骤（S 240），以及用于在粘合剂的各个表面上施加铜包层的台阶（S 250）。