公开(公告)号：US09692005B2

公开(公告)日：2017-06-27

申请号：US14443939

申请日：2013-11-19

Applicant: OSRAM OLED GmbH

Inventor： Thomas Wehlus

IPC: H01L51/52 ,  H01L51/56

CPC classification number: H01L51/5209 ,  H01L51/52 ,  H01L51/5212 ,  H01L51/5218 ,  H01L51/5221 ,  H01L51/5225 ,  H01L51/56 ,  H01L2251/5361

Abstract: An optoelectronic device is provided which comprises an organic active layer (5) provided for generating electromagnetic radiation and a first electrode (1) provided for electrical contacting of the active layer, wherein the first electrode comprises a first electrode layer (11) and a first connection layer (12) spaced at least in places from the first electrode layer, the active layer is arranged at least in places between the first electrode layer and the first connection layer, and the first electrode comprises at least one through via (13) which extends through the active layer and, in so doing, forms an electrical contact between the first electrode layer and the first connection layer. A method for producing such a device is furthermore provided.

公开(公告)号：US09685638B2

公开(公告)日：2017-06-20

申请号：US14917297

申请日：2014-09-02

Applicant: OSRAM OLED GmbH

Inventor： Arne Fleissner ,  Carola Diez ,  Nina Riegel ,  Thomas Wehlus ,  Daniel Riedel ,  Johannes Rosenberger ,  Silke Scharner

IPC: H01L51/56 ,  H01L51/00 ,  C23C14/04 ,  H01L27/32

CPC classification number: H01L51/56 ,  C23C14/042 ,  H01L27/3239 ,  H01L51/0011 ,  H01L2251/5361

Abstract: Various embodiments may relate to a method for producing an optoelectronic component, including forming a first electrode on a substrate, arranging a first mask structure on or above the substrate, wherein the first mask structure comprises a first structuring region including an opening and/or a region prepared for forming an opening, arranging a second mask structure on or above the first mask structure, forming a second structuring region in the first mask structure and in the second mask structure in such a way that at least one part of the first structuring region in the first mask structure is formed outside the second structuring region in the first mask structure.

公开(公告)号：US20170155096A1

公开(公告)日：2017-06-01

申请号：US15322738

申请日：2015-07-17

Applicant: Osram OLED GmbH

Inventor： Thomas Wehlus

IPC: H01L51/56 ,  H01L51/00

CPC classification number: H01L51/56 ,  H01L25/048 ,  H01L51/003 ,  H01L51/0097 ,  H01L51/504 ,  H01L51/5056 ,  H01L51/5072 ,  H01L51/5088 ,  H01L51/5092 ,  H01L51/5253 ,  H01L51/5268 ,  H01L2924/0002 ,  H01L2924/15788 ,  Y02E10/549 ,  Y02P70/521 ,  H01L2924/00

Abstract: In various exemplary embodiments, a method for producing an optoelectronic component is provided. In this case, a high temperature solid is provided which is stable at least up to a predefined first temperature. A liquid glass solder having a second temperature, which is lower than the first temperature, is applied to the high temperature solid in a structured fashion. The glass solder is solidified, as a result of which a glass solid is formed. An optoelectronic layer structure is formed above the glass solid. The glass solid and the optoelectronic layer structure form the optoelectronic component. The optoelectronic component is removed from the high temperature solid.

公开(公告)号：US20170005290A1

公开(公告)日：2017-01-05

申请号：US15113086

申请日：2015-01-20

Applicant: OSRAM OLED GMBH

Inventor： Thomas Wehlus

IPC: H01L51/52 ,  H01L51/56 ,  H01L51/44

CPC classification number: H01L51/5253 ,  H01L51/441 ,  H01L51/444 ,  H01L51/448 ,  H01L51/5206 ,  H01L51/5212 ,  H01L51/5221 ,  H01L51/56 ,  H01L2251/5369

Abstract: An optoelectronic component may include a first electrically conductively formed layer, including an electrically conductive substance in a matrix, a second electrically conductively formed layer, and an electrically conductively formed thin film encapsulation between the first electrically conductively formed layer and the second electrically conductively formed layer. The electrically conductively formed thin film encapsulation is formed in such a way that the second electrically conductively formed layer is electrically conductively connected to the first electrically conductively formed layer by the electrically conductively formed thin film encapsulation, and the electrically conductively formed thin film encapsulation is formed in a hermetically impermeable fashion with respect to a diffusion of water and/or oxygen from the first electrically conductively formed layer through the electrically conductively formed thin film encapsulation into the second electrically conductively formed layer.

Abstract translation: 光电子部件可以包括第一导电形成层，其包括基体中的导电物质，第二导电形成层，以及在第一导电形成层与第二导电形成层之间的导电形成的薄膜封装 。 导电形成的薄膜封装形成为使得第二导电形成层通过导电形成的薄膜封装与第一导电形成层导电连接，并且形成导电形成的薄膜封装 相对于水和/或氧从第一导电形成层通过导电形成的薄膜封装扩散到第二导电形成层中而以气密不透水的方式。

公开(公告)号：US20160365541A1

公开(公告)日：2016-12-15

申请号：US15118913

申请日：2015-02-12

Applicant: OSRAM OLED GMBH

Inventor： Thomas Wehlus

IPC: H01L51/52 ,  C03C14/00 ,  H01L51/56 ,  C03C13/04 ,  C03B5/173 ,  C09K11/02 ,  C03C11/00

CPC classification number: H01L51/5268 ,  C03B5/173 ,  C03C11/00 ,  C03C13/04 ,  C03C14/004 ,  C03C14/006 ,  C03C2213/00 ,  C03C2214/04 ,  C03C2214/16 ,  C03C2214/34 ,  C09K11/025 ,  H01L33/501 ,  H01L51/56

Abstract: In various embodiments, glassware is provided. The glassware may include a glass matrix having a surface, a first type of particles, and at least one second type of particles, wherein the particles of the second type have a higher refractive index than the particles of the first type, wherein the particles of the first type are completely surrounded by the glass matrix, such that the surface of the glass matrix is free of particles of the first type, and the particles of the second type are arranged above and/or between the particles of the first type at least partly in the glass matrix at the surface of the glass matrix in order to increase the refractive index of the glassware.

Abstract translation: 在各种实施例中，提供玻璃器皿。 玻璃器皿可以包括具有表面，第一类型的颗粒和至少一种第二类型的颗粒的玻璃基质，其中第二类型的颗粒具有比第一类型的颗粒更高的折射率，其中颗粒 第一类型被玻璃基体完全包围，使得玻璃基体的表面没有第一类型的颗粒，并且第二类型的颗粒至少布置在第一类型的颗粒之上和/或之间 部分地在玻璃基体的玻璃基体中，以增加玻璃器皿的折射率。

公开(公告)号：US20160164037A1

公开(公告)日：2016-06-09

申请号：US14907628

申请日：2014-07-17

Applicant: OSRAM OLED GMBH

Inventor： Thomas Wehlus ,  Johannes Rosenberger

IPC: H01L51/52

CPC classification number: H01L51/5268 ,  H01L51/5271 ,  H01L51/5275 ,  H01L2251/5323

Abstract: A radiation emitting apparatus including a substrate, at least one layer sequence arranged on the substrate and producing electromagnetic radiation in a wavelength range, having at least one first electrode surface, at least one second electrode surface, and at least one functional layer between the first electrode surface and the second electrode surface, wherein the functional layer produces electromagnetic radiation in the wavelength range in a switched-on operating state, and a scatter layer having a first region and a second region, wherein radiation produced by the functional layer is directly incident on the scatter layer only in the first region of the scatter layer, and the scatter layer at least partially scatters radiation incident upon the first region of the scatter layer so that said radiation enters the second region of the scatter layer.

Abstract translation: 一种辐射发射设备，包括衬底，布置在衬底上并产生波长范围内的电磁辐射的至少一层层序列，具有至少一个第一电极表面，至少一个第二电极表面和至少一个第一电极表面之间的功能层 电极表面和第二电极表面，其中功能层在接通操作状态下在波长范围内产生电磁辐射，以及具有第一区域和第二区域的散射层，其中由功能层产生的辐射直接入射 在散射层上仅在散射层的第一区域中，并且散射层至少部分地散射入射在散射层的第一区域上的辐射，使得所述辐射进入散射层的第二区域。

公开(公告)号：US20190173044A1

公开(公告)日：2019-06-06

申请号：US15776000

申请日：2017-08-25

Applicant: OSRAM OLED GmbH

Inventor： Erwin Lang ,  Thomas Wehlus ,  Arne Fleißner ,  Sebastian Wittmann

IPC: H01L51/52

Abstract: A method of producing a component module includes providing a component holder having a curved upper side and a radiation-emitting bendable component, and bending and fastening the component to the upper side so that the component has a curved shape.

公开(公告)号：US10082270B2

公开(公告)日：2018-09-25

申请号：US15513570

申请日：2015-09-22

Applicant: OSRAM OLED GmbH

Inventor： Thomas Wehlus ,  Daniel Riedel ,  Nina Riegel ,  Silke Scharner ,  Johannes Rosenberger ,  Arne Fleissner

IPC: F21V3/06 ,  F21V3/04 ,  F21V15/01 ,  F21V23/00 ,  F21V23/04 ,  F21Y115/10 ,  F21Y107/00

CPC classification number: F21V3/06 ,  F21V15/01 ,  F21V23/003 ,  F21V23/04 ,  F21Y2107/00 ,  F21Y2115/10 ,  H01L51/5036 ,  H01L51/5262 ,  H01L51/5268 ,  H01L2251/5338 ,  H01L2251/5361

Abstract: A light-emitting module including a light-emitting component and a resilient body is provided. The light-emitting component includes a light-emitting layer structure for generating light and includes a light-emitting main face through which the generated light leaves the light-emitting component. The resilient body, which is arranged over the light-emitting main face, is connected firmly to the light-emitting component, includes at least one light-deviating region, and includes a free-lying surface which includes at least one surface element, which lies at a distance greater than or equal to 4 mm from the light-emitting layer structure.

公开(公告)号：US09978996B2

公开(公告)日：2018-05-22

申请号：US15322738

申请日：2015-07-17

Applicant: Osram OLED GmbH

Inventor： Thomas Wehlus

IPC: H01L51/56 ,  H01L51/00 ,  H01L51/50 ,  H01L51/52

CPC classification number: H01L51/56 ,  H01L25/048 ,  H01L51/003 ,  H01L51/0097 ,  H01L51/504 ,  H01L51/5056 ,  H01L51/5072 ,  H01L51/5088 ,  H01L51/5092 ,  H01L51/5253 ,  H01L51/5268 ,  H01L2924/0002 ,  H01L2924/15788 ,  Y02E10/549 ,  Y02P70/521 ,  H01L2924/00

Abstract: In various exemplary embodiments, a method for producing an optoelectronic component is provided. In this case, a high temperature solid is provided which is stable at least up to a predefined first temperature. A liquid glass solder having a second temperature, which is lower than the first temperature, is applied to the high temperature solid in a structured fashion. The glass solder is solidified, as a result of which a glass solid is formed. An optoelectronic layer structure is formed above the glass solid. The glass solid and the optoelectronic layer structure form the optoelectronic component. The optoelectronic component is removed from the high temperature solid.

公开(公告)号：US20180013066A1

公开(公告)日：2018-01-11

申请号：US15549994

申请日：2016-02-05

Applicant: OSRAM OLED GmbH

Inventor： Silke Scharner ,  Thomas Wehlus ,  Nina Riegel ,  Arne Fleißner ,  Johannes Rosenberger ,  Daniel Riedel

IPC: H01L51/00 ,  H01L51/52 ,  H01L51/56

CPC classification number: H01L51/0023 ,  H01L51/5206 ,  H01L51/5268 ,  H01L51/56

Abstract: A method for producing an organic light-emitting diode and an organic light-emitting diode are disclosed. In an embodiment, the method includes providing a substrate with a continuous application surface, generating multiple adhesion regions on the application surface, the adhesion regions being completely surrounded by the application surface, applying metal nanowires over the entire surface of the application surface, removing the metal nanowires outside of the adhesion regions by a washing process using a solvent such that the remaining metal nanowires completely or partly form a light-permeable electrode of the organic light-emitting diode, and applying an organic layer sequence onto the light-permeable electrode.