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公开(公告)号：US20090059485A1
公开(公告)日：2009-03-05
申请号：US12204610
申请日：2008-09-04
CPC分类号： H01H13/10 , H01H9/0207 , H01H13/50 , H01H15/10 , H01H2223/034 , H05K5/0013 , H05K5/0217 , H05K7/14 , Y10T29/49995
摘要： Several mechanical features of an electronic device are provided. In some embodiments, the electronic device may include a bezel coupled to a housing. The bezel may include one or more snaps extending into the electronic device which may be operative to engage a cantilever spring extending from the inner surface of the housing. In some embodiments, the electronic device may include a window that is formed by coupling an outer layer to an inner layer that is larger than the outer layer. In some embodiments, the electronic device may include a chassis for supporting the window. In some embodiments, the electronic device may include a grounding clip for simultaneously grounding the bezel, the housing and a circuit board. In some embodiments, the electronic device may include a switch that includes a button molded into a base using a double shot process. In some embodiments, the electronic device may include a switch supporting bracket that includes a slot operative to receive a pin of the bezel. In some embodiments, the housing of the electronic device may be manufactured using a forging process.
摘要翻译： 提供了电子设备的几个机械特性。 在一些实施例中，电子设备可以包括联接到壳体的边框。 挡板可以包括延伸到电子设备中的一个或多个卡扣，其可操作以接合从壳体的内表面延伸的悬臂弹簧。 在一些实施例中，电子设备可以包括通过将外层耦合到比外层大的内层形成的窗口。 在一些实施例中，电子设备可以包括用于支撑窗口的底盘。 在一些实施例中，电子设备可以包括接地夹，用于同时接地边框，壳体和电路板。 在一些实施例中，电子设备可以包括开关，其包括使用双重注射工艺模制成基座的按钮。 在一些实施例中，电子设备可以包括开关支撑支架，该开关支撑支架包括可操作地接收所述边框的销的槽。 在一些实施例中，可以使用锻造工艺来制造电子设备的壳体。
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42.发明授权Implantable electronic medical device having an encapsulated optical transducer 失效具有封装的光学换能器的可植入电子医疗装置公开(公告)号：US07447533B1
公开(公告)日：2008-11-04
申请号：US11090376
申请日：2005-03-24
IPC分类号： A61B5/00
CPC分类号： A61B5/0402 , A61N1/36557 , A61N1/375 , A61N1/3752 , A61N1/3754
摘要： An implantable electronic device has a main housing with a leak-proof-sealed housing chamber containing electronic circuitry. An optical module is connected to the main housing, and has a module housing with a leak-proof-sealed transducer chamber isolated from the main housing chamber. The module housing has an optically-transmissive optical element, and the transducer chamber contains an optical transducer connected to the circuitry. The module housing includes a number of signal conductors extending from the transducer chamber to a location external to the transducer chamber, and connected to circuitry in the main housing chamber.
摘要翻译： 可植入电子设备具有主壳体，其具有包含电子电路的防漏密封容纳室。 光学模块连接到主壳体，并且具有与主壳体隔离的具有防泄漏密封的换能器室的模块壳体。 模块壳体具有光学透射光学元件，并且换能器腔室包含连接到电路的光学换能器。 模块壳体包括从换能器室延伸到换能器室外部的位置的多个信号导体，并且连接到主壳体室中的电路。
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公开(公告)号：US20080064235A1
公开(公告)日：2008-03-13
申请号：US11519388
申请日：2006-09-11
IPC分类号： H05K1/00
CPC分类号： H05K1/147 , G06F1/186 , H05K1/189 , H05K2201/10189
摘要： The present invention can facilitate the coupling between electrical components and a circuit board after the circuit board is inserted into a housing of an electronic device. An electrical component can be integrated with a flexible circuit of another electrical component. The flexible circuit can be electrically and mechanically coupled to the circuit board after the circuit board is inserted into the housing. Alternatively, electrical contacts can be disposed on a body of the electrical component and a complementary set of electrical contacts can be disposed on the circuit board. When the circuit board is disposed within a receptacle of the electrical component, the electrical contacts on the electrical component are coupled directly to the electrical contacts on the circuit board.
摘要翻译： 在将电路板插入电子设备的壳体之后，本发明可以促进电气部件与电路板之间的耦合。 电气部件可以与另一个电气部件的柔性电路集成。 在将电路板插入壳体之后，柔性电路可电连接和机械耦合到电路板。 或者，可以将电触头设置在电气部件的主体上，并且可以在电路板上设置互补的一组电触点。 当电路板设置在电气部件的插座中时，电气部件上的电接触件直接连接到电路板上的电触头。
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公开(公告)号：US20080062660A1
公开(公告)日：2008-03-13
申请号：US11519387
申请日：2006-09-11
IPC分类号： H05K5/00
CPC分类号： H05K7/142 , G06F1/1613 , G06F1/1626 , G06F1/1662 , G06F1/184
摘要： The present invention can relate to an electronic device having one or more support tabs that protect a circuit board disposed inside the device from externally applied compressive forces. In particular, when a force is applied to a housing of the device, the support tabs can buttress the housing of the device, either directly or through other intervening components disposed within the device, to reduce the likelihood that the housing or intervening components will contact and damage the circuit board. The present invention also can relate to methods for manufacturing such an electronic device.
摘要翻译： 本发明可以涉及一种具有一个或多个支撑翼片的电子装置，其保护设置在装置内的电路板免受外部施加的压缩力的影响。 特别地，当力施加到装置的壳体时，支撑片可以直接地或通过设置在装置内的其它中间部件来支撑装置的壳体，以减少壳体或中间部件将接触的可能性 并损坏电路板。 本发明还可以涉及用于制造这种电子设备的方法。
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