PROGRAMMABLE ELECTRONIC FUSE
    41.
    发明申请
    PROGRAMMABLE ELECTRONIC FUSE 审中-公开
    可编程电子保险丝

    公开(公告)号:US20090179302A1

    公开(公告)日:2009-07-16

    申请号:US12355056

    申请日:2009-01-16

    IPC分类号: H01L23/525

    摘要: A programmable device (eFuse), includes: a substrate (10); an insulator (13) on the substrate; an elongated semiconductor material (12) on the insulator, the elongated semiconductor material having a first end (12a), a second end (12b), a fuse link (11) between the ends, and an upper surface S. The semiconductor material includes a dopant having a concentration of at least 10*17/cc. The first end (12a) is wider than the second end (12b), and a metallic material is disposed on the upper surface. The metallic material is physically migratable along the upper surface responsive to an electrical current I flowable through the semiconductor material and through the metallic material.

    摘要翻译: 一种可编程器件(eF​​use),包括:衬底(10); 绝缘体(13); 在绝缘体上的细长半导体材料(12),所述细长半导体材料具有第一端(12a),第二端(12b),端部之间的熔断体(11)和上表面S.半导体材料包括 浓度至少为10 * 17 / cc的掺杂剂。 第一端(12a)比第二端(12b)宽,并且金属材料设置在上表面上。 响应于可流过半导体材料和通过金属材料的电流I,金属材料可沿着上表面物理迁移。

    Electrical fuse with a thinned fuselink middle portion
    42.
    发明授权
    Electrical fuse with a thinned fuselink middle portion 失效
    电熔丝带有细长的中间部分

    公开(公告)号:US07550323B2

    公开(公告)日:2009-06-23

    申请号:US11835800

    申请日:2007-08-08

    IPC分类号: H01L21/82

    摘要: A metal layer is deposited on the patterned semiconductor material layer containing a cathode semiconductor portion, a fuselink semiconductor portion, and an anode semiconductor portion. The metal layer may be patterned so that a middle portion of the fuselink semiconductor portion has a thin metal layer, which upon annealing produces a thinner metal semiconductor alloy portion than surrounding metal semiconductor alloy portion on the fuselink semiconductor portion. Alternatively, a middle portion of the metal semiconductor alloy having a uniform thickness throughout the fuselink may be lithographically patterned and etched to form a thin metal semiconductor alloy portion in the middle of the fuselink, while thick metal semiconductor alloy portions are formed on the end portions of the fuselink. The resulting inventive electrical fuse has interfaces at which a thinner metal semiconductor alloy abuts a thicker metal semiconductor alloy in the fuselink to enhance the divergence of electrical current.

    摘要翻译: 在包含阴极半导体部分,熔丝半导体部分和阳极半导体部分的图案化的半导体材料层上沉积金属层。 可以对金属层进行图案化,使得熔融半导体部分的中间部分具有薄金属层,其在退火时产生比在熔融半导体部分上的周围金属半导体合金部分更薄的金属半导体合金部分。 或者,在整个整体中具有均匀厚度的金属半导体合金的中间部分可以被光刻图案化和蚀刻,以在熔丝中间形成薄金属半导体合金部分,同时在端部形成厚金属半导体合金部分 的fuselink。 所产生的本发明的电熔丝具有界面,在该界面上,较薄的金属半导体合金与所述富熔体中较厚的金属半导体合金相接触以增强电流的发散。

    ELECTRICAL FUSE WITH A THINNED FUSELINK MIDDLE PORTION
    45.
    发明申请
    ELECTRICAL FUSE WITH A THINNED FUSELINK MIDDLE PORTION 失效
    带有薄型熔断器中间部分的电气保险丝

    公开(公告)号:US20090042341A1

    公开(公告)日:2009-02-12

    申请号:US11835800

    申请日:2007-08-08

    IPC分类号: H01L21/82

    摘要: A metal layer is deposited on the patterned semiconductor material layer containing a cathode semiconductor portion, a fuselink semiconductor portion, and an anode semiconductor portion. The metal layer may be patterned so that a middle portion of the fuselink semiconductor portion has a thin metal layer, which upon annealing produces a thinner metal semiconductor alloy portion than surrounding metal semiconductor alloy portion on the fuselink semiconductor portion. Alternatively, a middle portion of the metal semiconductor alloy having a uniform thickness throughout the fuselink may be lithographically patterned and etched to form a thin metal semiconductor alloy portion in the middle of the fuselink, while thick metal semiconductor alloy portions are formed on the end portions of the fuselink. The resulting inventive electrical fuse has interfaces at which a thinner metal semiconductor alloy abuts a thicker metal semiconductor alloy in the fuselink to enhance the divergence of electrical current.

    摘要翻译: 在包含阴极半导体部分,熔丝半导体部分和阳极半导体部分的图案化的半导体材料层上沉积金属层。 可以对金属层进行图案化,使得熔融半导体部分的中间部分具有薄金属层,其在退火时产生比在熔融半导体部分上的周围金属半导体合金部分更薄的金属半导体合金部分。 或者,在整个整体中具有均匀厚度的金属半导体合金的中间部分可以被光刻图案化和蚀刻,以在熔丝中间形成薄金属半导体合金部分,同时在端部形成厚金属半导体合金部分 的fuselink。 所产生的本发明的电熔丝具有界面,在该界面上,较薄的金属半导体合金与所述富熔体中较厚的金属半导体合金相接触以增强电流的发散。

    Method and Structure for Implementing a Reprogrammable ROM
    46.
    发明申请
    Method and Structure for Implementing a Reprogrammable ROM 审中-公开
    实现可重编程ROM的方法和结构

    公开(公告)号:US20080232150A1

    公开(公告)日:2008-09-25

    申请号:US11689559

    申请日:2007-03-22

    IPC分类号: G11C17/00

    CPC分类号: G11C17/16 G11C17/18

    摘要: A method and structure implementing a reprogrammable read only memory (ROM) include a pair of fuse elements having different lengths and selectively arranged to define an initial bit state. A group of a plurality of the pairs of fuse elements defines a predetermined data pattern of ones and zeros, providing initial states stored in the reprogrammable ROM. The reprogrammable ROM is reprogrammed when needed by selectively blowing a selected fuse or selected fuses to change the data pattern stored in the ROM.

    摘要翻译: 实现可再编程只读存储器(ROM)的方法和结构包括具有不同长度的一对熔丝元件,并且选择性地布置以定义初始位状态。 一组多对熔丝元件定义了一个和零的预定数据模式,提供存储在可再编程ROM中的初始状态。 当需要时,通过选择性地吹送所选择的保险丝或选定的保险丝来改变存储在ROM中的数据模式,重编程ROM被重新编程。

    EFUSE CONTAINING SIGE STACK
    47.
    发明申请
    EFUSE CONTAINING SIGE STACK 有权
    EFUSE包含信号堆栈

    公开(公告)号:US20080169529A1

    公开(公告)日:2008-07-17

    申请号:US11622616

    申请日:2007-01-12

    IPC分类号: H01L23/525

    摘要: An eFuse, includes: a substrate and an insulating layer disposed on the substrate; a first layer including a single crystal or polycrystalline silicon disposed on the insulating layer; a second layer including a single crystal or polycrystalline silicon germanium disposed on the first layer, and a third layer including a silicide disposed on the second layer. The Ge has a final concentration in a range of approximately five percent to approximately twenty-five percent.

    摘要翻译: eFuse包括:衬底和设置在衬底上的绝缘层; 包括设置在所述绝缘层上的单晶或多晶硅的第一层; 包括设置在第一层上的单晶或多晶硅锗的第二层,以及包括设置在第二层上的硅化物的第三层。 Ge的终浓度范围约为百分之五至百分之二十五。

    FUSE STRUCTURE INCLUDING CAVITY AND METHODS FOR FABRICATION THEREOF
    49.
    发明申请
    FUSE STRUCTURE INCLUDING CAVITY AND METHODS FOR FABRICATION THEREOF 失效
    包括密封的保险丝结构及其制造方法

    公开(公告)号:US20080079113A1

    公开(公告)日:2008-04-03

    申请号:US11538170

    申请日:2006-10-03

    IPC分类号: H01L29/00

    摘要: A fuse structure comprises a cavity interposed between a substrate and a fuse material layer. The cavity is not formed at a sidewall of the fuse material layer, or at a surface of the fuse material layer opposite the substrate. A void may be formed interposed between the substrate and the fuse material layer while using a self-aligned etching method, when the fuse material layer comprises lobed ends and a narrower middle region. The void is separated by a pair of sacrificial layer pedestals that support the fuse material layer. The void is encapsulated to form the cavity by using an encapsulating dielectric layer. Alternatively, a block mask may be used when forming the void interposed between the substrate and the fuse material layer.

    摘要翻译: 熔丝结构包括插入在基板和熔丝材料层之间的空腔。 空腔不形成在熔丝材料层的侧壁处,或者在与衬底相对的熔丝材料层的表面处。 当熔丝材料层包括裂纹末端和较窄的中间区域时,可以在使用自对准蚀刻方法的同时在衬底和熔丝材料层之间形成空隙。 空隙由支撑熔丝材料层的一对牺牲层基座分开。 通过使用封装介电层将空隙封装以形成空腔。 或者,当形成插入在基板和熔丝材料层之间的空隙时,可以使用块掩模。