Abstract:
To protect the structural layers from being eroded in the etching process, a protection layer is deposited on the exposed structural layers of the micromirror. The protection layer is deposited before etching and removed after etching.
Abstract:
A projection system is disclosed herein. The projection system employs a spatial light modulator comprising an array of individually addressable pixels for modulating the incident light based on image data. The modulated light is projected on a screen for viewing.
Abstract:
A microelectromechanical device having a movable element with low mass inertia is disclosed herein. The movable element is held on a substrate such that the element is capable of rotating relative to the substrate; and the element has a mass inertia of 1.2×10−24 kg·m2 or less.
Abstract:
A method and apparatus for operating spatial light modulator have been disclosed herein. The spatial light modulator comprises an array of micromirror devices, each of which further comprises a reflective deflectable mirror plate attached to a deformable hinge, and an addressing electrode for addressing and deflecting the mirror plate.
Abstract:
A microelectromechanical device having a movable element with low mass inertia is disclosed herein. The movable element is held on a substrate such that the element is capable of rotating relative to the substrate; and the element has a mass inertia of 1.2×10−24 kg.m2 or less.
Abstract:
The present invention provides a microstructure device comprising multiple substrates with the components of the device formed on the substrates. In order to maintain uniformity of the gap between the substrates, a plurality of pillars is provided and distributed in the gap so as to prevent decrease of the gap size. The increase of the gap size can be prevented by bonding the pillars to the components of the microstructure. Alternatively, the increase of the gap size can be prevented by maintaining the pressure inside the gap below the pressure under which the microstructure will be in operation. Electrical contact of the substrates on which the micromirrors and electrodes are formed can be made through many ways, such as electrical contact areas, electrical contact pads and electrical contact springs.
Abstract:
The present invention provides a microstructure device comprising multiple substrates with the components of the device formed on the substrates. In order to maintain uniformity of the gap between the substrates, a plurality of pillars is provided and distributed in the gap so as to prevent decrease of the gap size. The increase of the gap size can be prevented by bonding the pillars to the components of the microstructure. Alternatively, the increase of the gap size can be prevented by maintaining the pressure inside the gap below the pressure under which the microstructure will be in operation. Electrical contact of the substrates on which the micromirrors and electrodes are formed can be made through many ways, such as electrical contact areas, electrical contact pads and electrical contact springs.
Abstract:
Disclosed herein is method of operating a device that comprises an array of micromirrors. The method comprises a process usable for repairing stuck micromirrors of the micromirror array during the operation. The reparation process applies, at the ON state, two consecutive refresh voltages to the mirror plates of the micromirrors in the array with the pulses being separated in time longer than the characteristic oscillation time of the micromirrors. The reparation process can be applied independently to the micromirrors. Alternatively, the reparation process can be incorporated with a bias inversion process.
Abstract:
Disclosed herein a microelectromechanical device having first and second substrates that are bonded together with a gap formed therebetween. A plurality of functional members is disposed within the gap. The two substrates are bonded with a bonding agent that comprises an electrically conductive adhesive material.
Abstract:
Disclosed herein is method of operating a device that comprises an array of micromirrors. The method comprises a process usable for repairing stuck micromirrors of the micromirror array during the operation. The reparation process applies, at the ON state, two consecutive refresh voltages to the mirror plates of the micromirrors in the array with the pulses being separated in time longer than the characteristic oscillation time of the micromirrors. The reparation process can be applied independently to the micromirrors. Alternatively, the reparation process can be incorporated with a bias inversion process.