CHIP PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME, AND MODULE

    公开(公告)号:US20220084923A1

    公开(公告)日:2022-03-17

    申请号:US17532248

    申请日:2021-11-22

    Abstract: A chip package structure, manufacturing method thereof, and module are described. In an embodiment, the chip package structure includes: a substrate, a wiring layer, a chip, and a second conductive bump, wherein, in an embodiment, the substrate includes a first region and a second region surrounding the first region, and the wiring layer is located on side of the substrate and includes metal wire, wherein at least part of a metal wire is in contact with the substrate in direction perpendicular to the substrate, and the metal wire overlaps with the second region, wherein the chip is located on side of the wiring layer facing away from the substrate, and the chip corresponds to the first region. In an embodiment, a first conductive bump is provided on side of the chip facing away from the substrate and is electrically connected to the metal wire.

    ELECTRONIC PAPER DISPLAY PANEL, DRIVING METHOD AND ELECTRONIC PAPER DISPLAY DEVICE

    公开(公告)号:US20180329268A1

    公开(公告)日:2018-11-15

    申请号:US15782438

    申请日:2017-10-12

    CPC classification number: G02F1/167 G02F1/1676 H01L27/14607 H01L27/156

    Abstract: An electronic paper display panel, including a first and second substrate; an electrophoresis layer arranged between the first and second substrates, the electrophoresis layer including black electrophoretic particle, white electrophoretic particle and at least one color electrophoretic particle; a first electrode layer arranged at a side of the first substrate facing the second substrate including multiple first electrodes; a second electrode layer arranged at a side of the second substrate facing the first substrate including multiple second electrodes; and a drive circuit; multiple pixel areas correspond multiple second electrodes; each first electrode includes a first sub-electrode and a second sub-electrode placed in same pixel area, which are insulated from each other, correspond to one second electrode and are connected with drive circuit, the first sub-electrode receives voltage signal different from voltage signal the second sub-electrode receives; the first electrode is common electrode and the second electrode is pixel electrode.

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