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公开(公告)号：US20230249181A1
公开(公告)日：2023-08-10
申请号：US17730035
申请日：2022-04-26
Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.
Inventor： Kaidi ZHANG , Wei LI , Baiquan LIN , Yunfei BAI , Kerui XI , Feng QIN
IPC: B01L3/00
CPC classification number: B01L3/50273 , B01L3/502792 , B01L2300/0816
Abstract: A microfluidic apparatus, a driving method, and a formation method are provided in the present disclosure. The apparatus includes a first substrate and a second substrate. The first substrate and the second substrate are both smooth substrates. An electrode array layer is on a side of the first substrate; and a second electrode layer is on a side of the second substrate. The electrode array layer at least includes a plurality of first electrodes and a plurality of second electrodes. The first substrate includes a first region and a second region; the plurality of first electrodes is in the first region; and the plurality of second electrode is in the second region. A distance between the first substrate and the second substrate in the first region is D1 is greater than a distance between the first substrate and the second substrate in the second region is D2.
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公开(公告)号：US20220102406A1
公开(公告)日：2022-03-31
申请号：US17546740
申请日：2021-12-09
Inventor： Kerui XI , Xuhui PENG , Feng QIN , Tingting CUI , Zhenyu JIA
IPC: H01L27/146 , H01L25/16
Abstract: The present disclosure provides chip package structure, packaging method, camera module and electronic equipment. The package structure includes chip package module, which includes light-transmitting substrate, wiring layer located on side of light-transmitting substrate and including first metal wire, conductor located on side of wiring layer facing away from light-transmitting substrate, photosensitive chip located on side of wiring layer facing away from the light-transmitting substrate, active chip located on side of wiring layer facing away from light-transmitting substrate, and plastic encapsulation layer encapsulating photosensitive chip and active chip. The conductor includes first end electrically connected to first metal wire, and second end. The photosensitive chip includes pin electrically connected to first metal wire and has photosensitive surface facing towards light-transmitting substrate. The photosensitive surface includes photosensitive region that is not overlapping first metal wire. The active chip includes pin electrically connected to first metal wire.
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3.发明申请公开(公告)号：US20200319449A1
公开(公告)日：2020-10-08
申请号：US16458054
申请日：2019-06-29
Applicant: SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
Inventor： Baiquan LIN , Kerui XI , Feng QIN , Yian ZHOU , Xiangjian KONG , Jine LIU
Abstract: A driving circuit includes a first signal-input terminal, a second signal-input terminal, a third signal-input terminal, a fourth signal-input terminal, a signal-output terminal, and a voltage-boosting unit including a first module, a second module, a third module, and a first capacitor. The first module transmits the signal at the third signal-input terminal to a first terminal of the first capacitor during a first time period, and blocks signal transmission during a second time period. During the first time period and the second time period, the second module transmits the signal at the third signal-input terminal to the third module to allow the signal at the fourth signal-input terminal to be transmitted to a second terminal of the first capacitor. During a third time period, the second module and the third module both block signal transmission. The first terminal of the first capacitor is connected to the signal-output terminal for output.
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公开(公告)号：US20230393437A1
公开(公告)日：2023-12-07
申请号：US17880994
申请日：2022-08-04
Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.
Inventor： Zhenyu JIA , Kerui XI , Ping SU , Baiquan LIN , Linzhi WANG , Qingsan ZHU , Xiaonan HAN , Yifan XING , Xin LI , Feng QIN
IPC: G02F1/1345 , H01Q1/38 , H01Q3/36
CPC classification number: G02F1/1345 , H01Q1/38 , H01Q3/36 , G06F1/1698
Abstract: A substrate module, a display apparatus, and a liquid crystal antenna are provided in the present disclosure. The substrate module includes a first substrate. The first substrate includes a first sub-region and a second sub-region; the second sub-region includes a binding region; and the binding region includes first pins. The first sub-region includes first loads, and a first sub-pin is electrically connected to the first load. The second sub-region includes at least one second load, and a second sub-pin is electrically connected to the second load. The second load includes a capacitor including a first capacitor. The first substrate includes a first base substrate, a first electrode layer, a first insulating layer and a second electrode layer. Along a direction perpendicular to a plane of the base substrate, an overlapping portion of a first electrode portion and a second electrode portion forms the first capacitor.
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公开(公告)号：US20220320731A1
公开(公告)日：2022-10-06
申请号：US17425572
申请日：2020-08-24
Inventor： Kerui XI , Xuhui PENG , Feng QIN , Tingting CUI , Qinyi DUAN , Qiongqin MAO
IPC: H01Q3/36
Abstract: A phase shifter, a fabrication method thereof, and an antenna are provided. The phase shifter includes a first substrate, a second substrate, a ground electrode disposed on a side of the first substrate facing towards the second substrate, a transmission electrode disposed on a side of the second substrate facing towards the first substrate, and liquid crystals filled between the first substrate and the second substrate. In a direction perpendicular to a plane of the second substrate, the transmission electrode overlaps with the ground electrode. The ground electrode is provided with a detection hollow part, and in the direction perpendicular to the plane of the second substrate, at least a part of the detection hollow part does not overlap with the transmission electrode.
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Patent Agency Ranking
公开(公告)号：US20220293544A1
公开(公告)日：2022-09-15
申请号：US17829619
申请日：2022-06-01
Inventor： Feng QIN , Kerui XI , Tingting CUI , Jie ZHANG , Xuhui PENG
Abstract: Provided are a semiconductor package and a method for fabricating the semiconductor package. The method includes the followings steps: a first workpiece is provided, where the first workpiece includes a first substrate and multiple first rewiring structures arranged on the first substrate at intervals, and each first rewiring structure includes at least two first rewiring layers; an encapsulation layer is formed on the first rewiring structures, where the encapsulation layer is provided with multiple first through holes, and the first through holes expose one first rewiring layer; at least two second rewiring layers are disposed on a side of the encapsulation layer facing away from the first rewiring layer; multiple semiconductor elements are provided, where the semiconductor elements are arranged on a side of the first rewiring structures facing away from the encapsulation layer, where the first rewiring layers are electrically connected to pins of the semiconductor elements.
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7.发明申请公开(公告)号：US20220131264A1
公开(公告)日：2022-04-28
申请号：US17125682
申请日：2020-12-17
Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.
Inventor： Zhenyu JIA , Kerui XI , Baiquan LIN , Qinyi DUAN , Feng QIN
Abstract: Provided are a liquid crystal phase shifter, a manufacturing method thereof, and a liquid crystal antenna. The liquid crystal phase shifter includes a first substrate, a second substrate, microstrips, a ground electrode, and liquid crystals located between the at least one microstrip and the ground electrode. The microstrip line is disposed on a side of the second substrate facing towards the first substrate and includes a first transmission line and a second transmission line that are each a coil and are nested with each other in a direction perpendicular to a plane of the second substrate. The coiling transmission directions of radio frequency signals transmitted on the first and second transmission lines are opposite. The ground electrode overlaps both the first transmission line and the second transmission line in the direction perpendicular to the plane of the second substrate.
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公开(公告)号：US20200174178A1
公开(公告)日：2020-06-04
申请号：US16295191
申请日：2019-03-07
Applicant: SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
Inventor： Feng QIN , Wanchun DU , Lu YAO
IPC: F21V8/00
Abstract: Backlight module and display device are provided. The backlight module includes an accommodation frame including a base and an extending part, a first light guide plate, a second light guide plate; a first reflector, a first light source, and a second light source. The first light guide plate and the second light guide plate are disposed sequentially along a direction perpendicular to a plane of the base in an accommodation space formed by the base and the extending part, and are controlled independently. The first light source has a wavelength λ1 of 780 nm
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公开(公告)号：US20190086701A1
公开(公告)日：2019-03-21
申请号：US16050022
申请日：2018-07-31
Applicant: SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
Inventor： Ming XIE , Qiang JIA , Mingwei ZHANG , Xiangjian KONG , Jine LIU , Feng QIN
IPC: G02F1/1368 , H01L27/12 , G02F1/1362 , G02F1/1335 , G02F1/1343
Abstract: An array substrate and a display panel are provided. The array substrate includes a base layer, a first metal layer, a first insulating layer, a second metal layer, a second insulating layer, a first electrode layer, and a reflective layer successively stacked along a direction perpendicular to a plane in which the base layer is located. The second metal layer is used to form a source and a drain of a thin film transistor. The first electrode layer is used to form a pixel electrode. The second insulating layer is provided with a through-hole. The pixel electrode is connected to the drain of the thin film transistor through the through-hole. The reflective layer is provided with a first through-hole, and an orthographic projection of the first through-hole onto the base layer covers an orthographic projection of the through-hole onto the base layer.
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公开(公告)号：US20240353525A1
公开(公告)日：2024-10-24
申请号：US18224786
申请日：2023-07-21
Applicant: Shanghai Tianma Micro-electronics Co., Ltd.
Inventor： Yifan XING , Feng QIN , Baiquan LIN , Xiaonan HAN , Yifan BAO , Ping SU , Shengwei DAI , Zhenyu JIA , Zhen LIU , Xiaojun CHEN
Abstract: A sensor and its fabrication method are provided. The sensor includes a first glass substrate, a circuit layer on a side of the first glass substrate, and a radio frequency processing chip on a side of the circuit layer away from the first glass substrate.
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