公开(公告)号：US08970037B2

公开(公告)日：2015-03-03

申请号：US13960291

申请日：2013-08-06

Applicant: TDK Corporation

Inventor： Kenichi Yoshida ,  Makoto Orikasa ,  Hideyuki Seike ,  Yuhei Horikawa ,  Hisayuki Abe

IPC: H01L23/485 ,  H01L23/492 ,  H01L23/00

CPC classification number: H01L24/13 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L2224/03462 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05571 ,  H01L2224/05655 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/13006 ,  H01L2224/13017 ,  H01L2224/13022 ,  H01L2224/13111 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2224/05552

Abstract: A preferred terminal structure comprises a base material; an electrode formed on the base material; an insulating covering layer formed on the base material and on the electrode and having an opening exposing at least part of the electrode; an under bump metal layer containing Ni, filling the opening on the electrode; and a dome-shaped bump containing Sn and Ti, covering the under bump metal layer, wherein at least part of the under bump metal layer has a portion sandwiched between the external electrode and the insulating covering layer.

Abstract translation: 优选的端子结构包括基材; 形成在基材上的电极; 绝缘覆盖层，形成在所述基底材料上和所述电极上，并且具有暴露所述电极的至少一部分的开口; 含有Ni的下凸块金属层，填充电极上的开口; 以及包含Sn和Ti的圆顶状凸起，覆盖下凸块状金属层，其中至少部分下凸块金属层具有夹在外部电极和绝缘覆盖层之间的部分。

公开(公告)号：US08933336B2

公开(公告)日：2015-01-13

申请号：US13678033

申请日：2012-11-15

Applicant: TDK Corporation

Inventor： Kenichi Yoshida ,  Yuhei Horikawa ,  Makoto Orikasa ,  Hideyuki Seike

IPC: H01B1/00 ,  H01B1/02

CPC classification number: H01B1/02 ,  H01L2224/85444

Abstract: A coating having a layered structure including a palladium layer is provided to a conductor. The highly stable palladium layer is amorphous and contains phosphorus in a concentration ranging from 7.3% by mass to 11.0% by mass. An electronic component may include the conductor coated with the coating. The conductor coated with the coating has superior corrosion resistance and superior reliability in electrical connection with external apparatuses.

Abstract translation: 具有包括钯层的层状结构的涂层被提供给导体。 高度稳定的钯层为无定形，含有浓度为7.3质量％〜11.0质量％的磷。 电子部件可以包括涂覆有涂层的导体。 涂覆有涂层的导体具有优异的耐腐蚀性和与外部设备电连接的优异的可靠性。