公开(公告)号：US11380663B2

公开(公告)日：2022-07-05

申请号：US17006092

申请日：2020-08-28

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Romain Coffy ,  Remi Brechignac ,  Jean-Michel Riviere

IPC: H01L25/16 ,  H01L31/02 ,  H01L31/0203 ,  H01L33/52 ,  H01L33/62

Abstract: An opaque dielectric carrier and confinement substrate is formed by a stack of layers laminated on each other. The stack includes a solid back layer and a front frame having a peripheral wall and an intermediate partition which delimits two cavities located on top of the solid back layer and on either side of the intermediate partition. Electronic integrated circuit (IC) chips are located inside the cavities and mounted on top of the solid back layer. Each IC chip includes an integrated optical element. Electrical connections are provided between the IC chips and back electrical contacts of the solid back layer. Transparent encapsulation blocks are molded in the cavities to embed the IC chips.

公开(公告)号：US20220196938A1

公开(公告)日：2022-06-23

申请号：US17546314

申请日：2021-12-09

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Romain COFFY ,  Jean-Michel RIVIERE

IPC: G02B6/42

Abstract: An optoelectronic element is located in a package. The package includes a first optical block and a second optical block that are attached to each other by a bonding layer. One of the first and second optical blocks is attached to lateral walls of the package by glue. The material of the bonding layer is configured to induce less stress to the first and second optical blocks than the glue.

公开(公告)号：US20220187123A1

公开(公告)日：2022-06-16

申请号：US17545369

申请日：2021-12-08

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Romain COFFY ,  Younes BOUTALEB

IPC: G01J1/42 ,  H01L31/18

Abstract: An electronic chip supports an optical device and electric connection zones. An insulating coating coats the electronic chip, covers the electric connection zones and exposes the optical device. An optical plugging element is at least partly fastened onto a first face of the insulating coating and is optically coupled to the optical device. Vias pass through the insulating coating from its first face to a second face opposite to the first face. Inner walls of the vias support electrically conductive paths connected to the electric connection zones of the electronic chip by electrically conductive tracks arranged on the first face of the insulating coating. The electrically conductive paths of the vias further have ends protruding onto the second face of the insulating coating.

公开(公告)号：US20220179659A1

公开(公告)日：2022-06-09

申请号：US17540041

申请日：2021-12-01

Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics (Grand Ouest) SAS

Inventor： Loic Pallardy ,  Michael Soulie

IPC: G06F9/4401 ,  G06F13/40

Abstract: The method for resetting a master device, configured to initiate transactions on a bus of a system on a chip, includes monitoring a completed or not state of the transactions initiated by the master device. In the case of reception of a command to reset the master device, the method includes a transmission of an effective reset command to the master device when the transactions initiated by the master device are in the completed state.

公开(公告)号：US11354251B2

公开(公告)日：2022-06-07

申请号：US17220252

申请日：2021-04-01

Applicant: STMicroelectronics (Grenoble 2) SAS ,  TECHNOLOGICAL EDUCATIONAL INSTITUTE OF CRETE

Inventor： Antonio-Marcello Coppola ,  Georgios Kornaros ,  Miltos Grammatikakis

IPC: G06F12/1009 ,  G06F12/1036 ,  G06F9/4401 ,  G06F9/445 ,  G06F9/54 ,  G06F15/167

Abstract: A method of offloading a computing kernel from a host central processing unit (CPU) to a co-processor includes obtaining, by an application running on the host CPU, a virtual address of a packet in a user level queue of a general packet processing unit (GPPU) and initializing, by the application, the packet referenced by the virtual address using an application programming interface of a user level device driver (ULDD). The packet includes a plurality of handles corresponding to the computing kernel. The method further includes finalizing, by the ULDD, the packet by including a list of bootstrap translation addresses comprising a physical address and a virtual address for each of the plurality of handles and output by a kernel level device driver (KLDD) of an operating system running on the host CPU, and accessing, by the application using the virtual address, results obtained from the co-processor processing the computing kernel.

公开(公告)号：US11353591B2

公开(公告)日：2022-06-07

申请号：US17024418

申请日：2020-09-17

Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED

Inventor： Christopher Townsend ,  Pascal Mellot

IPC: G01S17/89 ,  G01S7/481 ,  G01S17/10

Abstract: The present disclosure relates to a method of laser safety verification for a depth map sensor, comprising illuminating, during a first illumination phase, using a laser illumination system, a first cluster of one or more first pixels of a pixel array of the depth map sensor, while not illuminating a second cluster, different from the first cluster, of one or more second pixels of the pixel array of the depth map sensor; and detecting, during the first illumination phase, a level of illumination of the second cluster.

公开(公告)号：US11353499B2

公开(公告)日：2022-06-07

申请号：US16557365

申请日：2019-08-30

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Stéphane Ducrey ,  Pascal Raga

IPC: G01R31/28

Abstract: An electronic chip includes an analog input connection pad and an analog output connection pad. A switch is coupled between the analog input connection pad and the analog output connection pad. In one embodiment, the chip operates in a self-test mode and in an active mode. The switch is closed only in the self-test mode.

公开(公告)号：US20220174234A1

公开(公告)日：2022-06-02

申请号：US17456846

申请日：2021-11-29

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Gregory Roffet ,  Pascal Mellot

IPC: H04N5/376 ,  H04N5/355 ,  H04N5/347

Abstract: The image sensor includes an array of photosensitive pixels comprising at least two sets of at least one pixel, control circuit configured to generate at least two different timing signals and adapted to control an acquisition of an incident optical signal by the pixels of the array, and distribution circuit configured to respectively distribute said at least two different timing signals in said at least two sets of at least one sensor, during the same acquisition of the incident optical signal.

公开(公告)号：US20220155143A1

公开(公告)日：2022-05-19

申请号：US17500432

申请日：2021-10-13

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Nicolas Moeneclaey

IPC: G01J1/42 ,  G01J1/44

Abstract: In an embodiment a method for measuring ambient light includes successively synchronizing optical signal acquisition phases with extinction phases of a disruptive light source, wherein the disruptive light source periodically provides illumination phases and the extinction phases, accumulating, in each acquisition phase, photo-generated charges by at least one photosensitive pixel comprising a pinned photodiode, transferring the accumulated photo-generated charges to an integration node and integrating, for each pixel, the transferred charges on the integration node during a series of the successive acquisition phases.

公开(公告)号：US11336076B2

公开(公告)日：2022-05-17

申请号：US16743856

申请日：2020-01-15

Applicant: STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED ,  STMICROELECTRONICS (GRENOBLE 2) SAS

Inventor： Denise Lee ,  Neale Dutton ,  Nicolas Moeneclaey ,  Jerome Andriot-Ballet

IPC: H01S5/026 ,  H01S5/042 ,  H01S5/183

Abstract: A laser diode driver circuit includes a first pair of contacts and connectors coupled to an anode of the laser diode. An inductance of each of the first pair of contacts and connectors is the same. A second pair of contacts and connectors are coupled to a cathode of the laser diode. An inductance of each of the second pair of contacts and connectors is the same. The laser diode driver circuit also includes current driving circuitry.