METHODS OF DETERMINING SCATTERING OF RADIATION BY STRUCTURES OF FINITE THICKNESSES ON A PATTERNING DEVICE

    公开(公告)号:US20200073260A1

    公开(公告)日:2020-03-05

    申请号:US16467124

    申请日:2017-12-06

    Abstract: A method including: obtaining a thin-mask transmission function of a patterning device and a M3D model for a lithographic process, wherein the thin-mask transmission function represents a continuous transmission mask and the M3D model at least represents a portion of M3D attributable to multiple edges of structures on the patterning device; determining a M3D mask transmission function of the patterning device by using the thin-mask transmission function and the M3D model; and determining an aerial image produced by the patterning device and the lithographic process, by using the M3D mask transmission function.

    Support apparatus, lithographic apparatus and device manufacturing method

    公开(公告)号:US10578959B2

    公开(公告)日:2020-03-03

    申请号:US15567279

    申请日:2016-03-22

    Abstract: A support apparatus for a lithographic apparatus has an object holder and an extraction body radially outward of the object holder. The object holder is configured to support an object. The extraction body includes an extraction opening configured to extract fluid from a top surface of the support apparatus. The extraction body is spaced from the object holder such that the extraction body is substantially decoupled from the object holder. The extraction body includes a projection configured such that it surrounds the object holder and such that, in use, a layer of immersion liquid is retained on the projection and in contact with an object supported on the object holder.

    Method and system to monitor a process apparatus

    公开(公告)号:US10571806B2

    公开(公告)日:2020-02-25

    申请号:US16327363

    申请日:2017-08-03

    Abstract: A method involving determining a contribution that one or more process apparatuses make to a characteristic of a substrate after the substrate has been processed according to a patterning process by the one or more process apparatuses by removing from values of the characteristic of the substrate a contribution of a lithography apparatus to the characteristic and a contribution of one or more pre-lithography process apparatuses to the characteristic.

    LITHOGRAPHIC APPARATUS, LITHOGRAPHIC PROJECTION APPARATUS AND DEVICE MANUFACTURING METHOD

    公开(公告)号:US20200057379A1

    公开(公告)日:2020-02-20

    申请号:US16485681

    申请日:2018-01-30

    Abstract: The present invention relates to a lithographic apparatus, comprising: a primary frame (10) which is provided with a functional unit (11, 12, 14), a secondary frame (20), a primary frame support (30), which is adapted to support the primary frame onto the secondary frame, a flexible utility connection (40), adapted to connect the functional unit to an auxiliary system (51, 52, 53), a vibration isolation body (60) having a body mass, which is moveably connected to the secondary frame by a flexible passive body support (61) having a body support stiffness, wherein the flexible utility connection is fixed to the vibration isolation body at a distance from the primary frame.

    Lithographic apparatus and method
    508.
    发明授权

    公开(公告)号:US10558126B2

    公开(公告)日:2020-02-11

    申请号:US15120093

    申请日:2015-02-10

    Abstract: A lithographic apparatus including a support structure constructed to support a mask having a patterned area which is capable of imparting an EUV radiation beam with a pattern in its cross-section to form a patterned radiation beam, wherein the support structure is movable in a scanning direction, a substrate table constructed to hold a substrate, wherein the substrate table is movable in the scanning direction, and a projection system configured to project the patterned radiation beam onto an exposure region of the substrate, wherein the projection system has a demagnification in the scanning direction which is greater than a demagnification in a second direction which is perpendicular to the scanning direction and wherein the demagnification in the second direction is greater than 4×.

    Metrology method, apparatus and computer program

    公开(公告)号:US10551172B2

    公开(公告)日:2020-02-04

    申请号:US15873880

    申请日:2018-01-17

    Inventor: Samee Ur Rehman

    Abstract: Disclosed herein is a metrology method, and an associated metrology apparatus, the metrology method includes measuring a target formed in at least two layers on a substrate by a lithographic process and capturing at least one corresponding pair of non-zeroth diffraction orders, for example in an image field, to obtain measurement data. A simulation of a measurement of the target as defined in terms of geometric parameters of the target, the geometric parameters including one or more variable geometric parameters, is performed and a difference between the measurement data and simulation data is minimized, so as to directly reconstruct a value for each of the one or more variable geometric parameters.

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