公开(公告)号：US20190331798A1

公开(公告)日：2019-10-31

申请号：US16374541

申请日：2019-04-03

Applicant: STMicroelectronics SA ,  STMicroelectronics (Grenoble 2) SAS

Inventor： Giovanni Scozzola ,  Olivier Pothier

IPC: G01S17/58 ,  G01S17/10

Abstract: A method includes emitting, by a single sensor of a device, a signal into a region; receiving, by the single sensor, a reflected signal; and detecting motion in a detection cone comprising a central axis based on the reflected signal, wherein detecting motion comprises detecting a first type of motion from a first position to a second position, and detecting a second type of motion from the second position to the first position.

公开(公告)号：US20190319160A1

公开(公告)日：2019-10-17

申请号：US16377379

申请日：2019-04-08

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Jean-Michel RIVIERE

IPC: H01L31/167 ,  H01L31/02 ,  H01L23/00 ,  H01L31/0203 ,  H01L31/0232 ,  G01V8/20

Abstract: A main carrier wafer includes a first integrated network of electronic connections between front and back faces. A first electronic chip is mounted to the front face of the main carrier wafer and connected to the network of electronic connections of the main carrier wafer. A secondary carrier wafer includes a platform that extends over the first chip and a base the protrudes backwards with respect to the platform to a back end face facing the main wafer. A second integrated network of electronic connections is provided within the secondary carrier wafer. A second electronic chip is mounted on top of the platform and connected to the second integrated network. The second integrated network is further connected to the main carrier wafer at the back end face.

公开(公告)号：US20190312442A1

公开(公告)日：2019-10-10

申请号：US16371996

申请日：2019-04-01

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Jean Camiolo ,  Christophe Lorin

IPC: H02J7/00 ,  G01R19/25

Abstract: A method selects one or a plurality of sets of values characterizing an electric power of a power source capable of powering a device coupled to the power source via a connection interface. The selection is carried out according to values, characterizing the power supplied by the power source, measured at the connection interface.

公开(公告)号：US20190287874A1

公开(公告)日：2019-09-19

申请号：US16295132

申请日：2019-03-07

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Didier CAMPOS

IPC: H01L23/31 ,  H01L23/00 ,  H01L21/56

Abstract: An electronic device includes a carrier wafer having a front side and a back side, with an electrical connection network configured to connect the front side to the back side. An electronic chip is mounted on the front side of the carrier wafer and electrically connected to front pads of the electrical connection network. A sheet of a thermally conductive graphite or a pyrolytic graphite is added to the back side of the carrier wafer. The sheet includes apertures which leave back pads of the electrical connection network uncovered.

公开(公告)号：US10419432B2

公开(公告)日：2019-09-17

申请号：US15026588

申请日：2014-10-17

Applicant: STMICROELECTRONICS SA ,  STMICROELECTRONICS (GRENOBLE 2) SAS ,  STMICROELECTRONICS S.R.L.

Inventor： Michael Soulie ,  Riccardo Locatelli ,  Valerio Catalano ,  Hajer Ferjani ,  Giuseppe Maruccia ,  Raffaele Guarrasi ,  Giuseppe Guarnaccia

IPC: H04L29/06 ,  G06F12/08 ,  G06F12/06

Abstract: An apparatus has a data store configured to store access activity information. The access activity information indicates which one or more of a plurality of different access parameter sets is active. The data store is also configured to store access defining information, which defines, at least for each active access parameter set, a number of channels, location information of said channels, and interleaving information associated with said channels.

公开(公告)号：US20190268040A1

公开(公告)日：2019-08-29

申请号：US16277678

申请日：2019-02-15

Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics (Rousset) SAS

Inventor： Gwenael Maillet ,  Jean-Louis Labyre ,  Gilles Bas

IPC: H04B5/00 ,  H03K7/08

Abstract: A circuit includes a near-field communication circuit configured to receive a radio frequency control signal transmitted in a near-field regime, a pulse width modulation signal generation circuit coupled to the near-field communication circuit circuit and configured to generate a pulse width modulation signal according to the radio frequency control signal, and a non-volatile memory coupled to both the near-field communication circuit circuit and the pulse width modulation signal generation circuit, the non-volatile memory comprising digital words for configuring the pulse width modulation signal.

公开(公告)号：US10396736B2

公开(公告)日：2019-08-27

申请号：US15609736

申请日：2017-05-31

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Michel Ayraud ,  Serge Ramet ,  Serge Pontarollo

IPC: H03F3/04 ,  H03G3/30 ,  H01P1/22 ,  H03F1/56 ,  H03F3/191

Abstract: The transmission device comprising a transmit stage configured to deliver a transmission signal on an input-output node of an antenna and comprising a power transistor coupled to the input-output node and configured to amplify a signal to be transmitted. The device comprises a receive stage configured to receive a reception signal on the input-output node and comprising an attenuator circuit configured to attenuate the reception signal. The attenuator circuit comprising the power transistor and a control circuit able to place the power transistor in a triode mode.

公开(公告)号：US10388686B2

公开(公告)日：2019-08-20

申请号：US15357493

申请日：2016-11-21

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Flavien Hirigoyen

IPC: H01L27/146

Abstract: A image sensor includes a semiconductor substrate with a photosensitive region. Metallization layers are stacked over the semiconductor substrate. Each metallization layer includes an etch stop layer and a dielectric layer on the etch stop layer. At least one metallization layer includes one or more microlenses positioned over the photosensitive region. The one or more microlenses are integrally formed by the etch stop layer.

公开(公告)号：US10386414B2

公开(公告)日：2019-08-20

申请号：US15324851

申请日：2015-05-28

Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS ,  STMICROELECTRONICS (CROLLES 2) SAS

Inventor： Jean-Marc Daveau ,  Philippe Roche ,  Didier Fuin

IPC: G01R31/3185 ,  G01R31/3177 ,  G01R31/317

Abstract: A device may include a control circuit configured to place, after a normal mode operation of N flip-flops, the N flip-flops in a test mode in which the test input of the first flip-flop of the chain is intended to receive a first sequence of test bits A memory may be configured to store a sequence of N values delivered by the test output of the last flip-flop of the chain. The control circuit may be configured to deliver, at the test input of the first flip-flop of the chain, the sequence of N stored values to restore the state of the N flip-flops before their placement in the test mode.

公开(公告)号：US20190222263A1

公开(公告)日：2019-07-18

申请号：US16239666

申请日：2019-01-04

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Philippe Graffouliere ,  Bruno Paille

IPC: H04B5/00 ,  H04L27/148 ,  H04W4/80 ,  H04L7/02

CPC classification number: H04B5/0031 ,  H04L7/0012 ,  H04L7/033

Abstract: A contactless communication device is capable of communicating in a contactless way with a reader by using active load modulation. Each frame is preceded by a reception period. An antenna is configured to receive a reader signal during each reception period, and to receive a reader carrier signal and transmit a modulated device carrier signal to the reader during each frame. A processor is configured to carry out, in each reception period, a first synchronization between a signal originating from the reader signal received at the antenna and a device carrier clock signal device generated in the device. The processor is also configured to carry out, within each frame, a modulated device carrier signal suppression process in order to obtain a processed signal, and a second synchronization between the processed signal and the device carrier clock signal.