Microfluidic hydrodynamic shuttling chip device for highthroughput multiple single cells capture

    公开(公告)号:US10946381B2

    公开(公告)日:2021-03-16

    申请号:US15753907

    申请日:2016-08-13

    发明人: Chia-Hsien Hsu

    IPC分类号: B01L3/00 C12M1/00 C12M3/06

    摘要: A hydrodynamic shuttling chip device comprising an array of single-cell trapping units is disclosed. Each unit comprises: (a) an incoming channel with a cell capture site; (b) a cell culture chamber located posterior to the cell capture site, having a receiving site spaced apart from the cell capture site at a distance of g; (c) a trapping channel located between the cell capture site and the receiving site; (d) a chamber channel located posterior to and in fluidic connection with the cell culture chamber; and (e) a by-pass channel, located lateral to the incoming channel, chamber and chamber channel and having a first end and a second end opposite to the first end, the first end branching out from the incoming channel immediately prior to the cell capture site and the second end joining the chamber channel. A method of capturing single cells of more than one type is also disclosed.

    Molding system for preparing molding article

    公开(公告)号:US10940623B1

    公开(公告)日:2021-03-09

    申请号:US17033114

    申请日:2020-09-25

    IPC分类号: B29C45/77 G06F30/28 B29C45/00

    摘要: The present disclosure provides a molding system for preparing molding articles. The molding system includes a molding machine; a mold disposed on the molding machine and having a mold cavity for being filled with a molding resin; a processing module configured to generate a mechanical pressure distribution of the molding resin in the mold cavity based on a molding condition for the molding machine, wherein the mechanical pressure distribution of the molding resin is generated based in part on a bulk viscosity effect of the molding resin; and a controller operably communicating with the processing module and configured to operate the molding machine for transferring the fluid molding material into the mold cavity with the molding condition using the generated pressure distribution of the molding resin to perform an actual molding process for preparing the molding article.

    Detachment puller
    53.
    发明授权

    公开(公告)号:US10894306B2

    公开(公告)日:2021-01-19

    申请号:US16172058

    申请日:2018-10-26

    发明人: Ming-Yu Wang

    IPC分类号: B25B5/10 B23P19/04

    摘要: A detachment puller is provided, including a main body, having a threaded hole and a plurality of pivoting portions circumferentially disposed around the threaded hole; a screw rod, screwed with the threaded hole; a plurality of jaws, respectively pivoted to the plurality of pivoting portions, each of the plurality of jaws including an abutted portion; an adjustment mechanism, elastically and movably disposed on the main body, the adjustment mechanism including a plurality of engaging portions, each of the plurality of engaging portions including a first abutting portion and a second abutting portion, the abutted portion being located between the first and second abutting portions, the first abutting portion being movable toward a first direction to press the abutted portion, the second abutting portion being movable toward a second direction to press the abutted portion, the first and second directions being opposite to each other.

    Package structures
    54.
    发明授权

    公开(公告)号:US10892210B2

    公开(公告)日:2021-01-12

    申请号:US15283963

    申请日:2016-10-03

    摘要: A package structure is provided. The package structure includes a leadframe including a plurality of connection portions; a device including a substrate, an active layer disposed on the substrate and a plurality of electrodes disposed on the active layer, wherein the electrodes of the device are connected to the connection portions of the leadframe; a conductive unit having a first side and a second side, wherein the first side of the conductive unit connects to the substrate of the device and the conductive unit connects to at least one of the connection portions of the leadframe; and an encapsulation material covering the device and the leadframe, wherein the second side of the conductive unit is exposed from the encapsulation material.

    Motor sleeve and motor device
    57.
    发明授权

    公开(公告)号:US10826347B2

    公开(公告)日:2020-11-03

    申请号:US16103221

    申请日:2018-08-14

    摘要: A motor sleeve is applied to a motor housing and a motor driver housing. The motor sleeve includes a sleeve base, a second fixing structure, a second coupling structure and a plurality of base fins. The sleeve base includes an outer surface and an inner surface. The second fixing structure is disposed on the inner surface and located corresponding to a first fixing structure of the motor housing. The sleeve base is fixed to the motor housing by the first and second fixing structures. The sleeve base is installed on a side portion of the motor housing. The second coupling structure is disposed on the outer surface. The base fins are separately disposed on the outer surface and located corresponding to a first coupling structure of the motor driver housing. The motor driver housing is coupled to the sleeve base by the first and second coupling structures.

    Bus system and detection method thereof

    公开(公告)号:US10817452B2

    公开(公告)日:2020-10-27

    申请号:US16398653

    申请日:2019-04-30

    IPC分类号: G06F13/40 G06F13/42

    摘要: A bus system is provided. The bus system includes a master device, an enhanced serial peripheral interface (eSPI) bus, a plurality of slave devices electrically connected to the master device via the eSPI bus, and a first resistor. Each slave device has an alert handshake pin. The alert handshake pins of the slave devices are electrically connected together via an alert handshake control line. The first resistor is coupled between the alert handshake control line and a power supply. Each slave device obtains the number of slave devices according to a first voltage of the alert handshake control line.

    Photopolymer composition and application thereof

    公开(公告)号:US10808063B2

    公开(公告)日:2020-10-20

    申请号:US15829437

    申请日:2017-12-01

    摘要: The present disclosure provides a photopolymer composition and the applications thereof. The photopolymer composition comprises: 5 weight percent to 15 weight percent of gelatin methacrylate (GelMA), 0.1 weight percent to 5 weight percent of silanized biologically active additive, 0.1 weight percent to 5 weight percent of photoinitiator, and 75 weight percent to 95 weight percent of a solvent. Compared to a conventional hydrogel, the hydrogel prepared from the photopolymer composition of the present disclosure has improved compressive strength, mechanical strength and stability. Accordingly, the hydrogel is applicable to biomedical research and tissue repair.