公开(公告)号：US20230164367A1

公开(公告)日：2023-05-25

申请号：US17533642

申请日：2021-11-23

Applicant: Applied Optoelectronics, Inc.

Inventor： William G. MAHONEY ,  Simon FARFOUD ,  Steve BLASHEWSKI

IPC: H04N21/226

CPC classification number: H04N21/226

Abstract: An aspect of the present disclosure includes a node housing for use in a broadband distribution network that includes coupling the amplifier to a lid portion and providing an interface plate in a base portion that allows for RF and power signals to be provided to the RF amplifier within the lid portion. The interface plate disposed within the base portion further preferably provides power pass-through to downstream nodes that remains electrically connected even when the amplifier is decoupled from the lid portion. Thus, the amplifier and/or lid portion may be decoupled from the base portion without disrupting power distribution to the down-stream nodes.

公开(公告)号：US20230112885A1

公开(公告)日：2023-04-13

申请号：US17500248

申请日：2021-10-13

Applicant: Applied Optoelectronics, Inc.

Inventor： Dapeng XU ,  Huanlin ZHANG

IPC: H01S5/042 ,  H01S5/343 ,  H01S5/22 ,  H01S5/40

Abstract: An aspect of the present disclosure includes a direct modulated laser (DML) with a dielectric current confinement ridge waveguide (RWG) structure. The DML comprises a substrate, one or more layers of material disposed on the substrate to provide a multi quantum well (MQW), first and second insulation/dielectric structures disposed on opposite sides of the MQW, and one or more layers of material disposed on the MQW to provide a mesa structure for receiving a driving current. The mesa structure is preferably disposed between the first and second insulation structures to provide a dielectric current confinement (RWG) structure. The mesa structure further preferably includes an overall width that is greater than the overall width than the active region of the DML that provides the MQW.

公开(公告)号：US20210211199A1

公开(公告)日：2021-07-08

申请号：US16737438

申请日：2020-01-08

Applicant: Applied Optoelectronics, Inc.

Inventor： Kai-Sheng LIN ,  Hang XIE ,  Yi WANG

IPC: H04B10/40 ,  H01L23/52 ,  H04B10/50 ,  H04B10/80

Abstract: The present disclosure is generally directed to a stepped profile for substrates that support “on board” optical subassembly arrangements. The stepped profile enables mounting TOSA modules to the substrate in a recessed orientation to reduce the overall distance between terminals of the substrate and associated components of the TOSA, e.g., RF terminals of the substrate and an LDD of the TOSA. In an embodiment, the stepped profile further simplifies mounting and optical alignment of TOSA modules by providing at least one mechanical stop to engage surfaces of the TOSA modules and limit travel by the same along one or more axis.

公开(公告)号：US11057112B1

公开(公告)日：2021-07-06

申请号：US16737414

申请日：2020-01-08

Applicant: Applied Optoelectronics, Inc.

Inventor： Kai-Sheng Lin ,  Hao-Chiang Cheng ,  Hang Xie

IPC: H04B10/00 ,  H04B10/40 ,  H04B10/50 ,  H04B10/67 ,  G02B6/42 ,  H01S5/026 ,  H04B10/69

Abstract: The present disclosure is generally directed to a monitor photodiode (MPD) submount for use in optical transceivers that includes a body with a conductive trace pattern disposed on multiple surfaces of the same to allow for vertical mounting of an associated MPD and simplified electrical interconnection with TOSA circuitry without the necessity of electrical interconnection. The MPD submount includes a body defined by a plurality of sidewalls. At least one surface of the body provides a mounting surface for coupling to and supporting an MPD. The MPD submount further includes a conductive trace pattern that provides at least one conductive path that is disposed on the mounting surface and on at least one adjoining sidewall. The portion of the at least one conductive path disposed on the adjoining sidewall extends substantially transverse relative to the surface defining the transceiver/transmitter substrate when the MPD submount is coupled to the same.

公开(公告)号：US20200373737A1

公开(公告)日：2020-11-26

申请号：US16419379

申请日：2019-05-22

Applicant: Applied Optoelectronics, Inc.

Inventor： Kai-Sheng LIN ,  Hsiu-Che WANG ,  Ziliang CAI

IPC: H01S5/0683 ,  H04B10/40 ,  H04B10/50 ,  H01S5/40 ,  H01S5/024

Abstract: A temperature controlled multi-channel transmitter optical subassembly (TOSA), consistent with embodiments described herein, may be used in a multi-channel optical transceiver. The temperature controlled multi-channel TOSA generally includes an array of lasers to emit a plurality of different channel wavelengths. The lasers may be thermally tuned to the channel wavelengths by establishing a global temperature for the array of lasers such that the amount of heat communicated to each laser is substantially the same. The global temperature may be established, at least in part, by monitoring the shortest channel wavelength and/or a temperature of the lasers. The temperature of the lasers may then get increased via a shared heating device in thermal communication with the lasers until the shortest monitored wavelength substantially reaches the nominal shortest wavelength or the measured temperature substantially equals the global temperature.

公开(公告)号：US10811839B1

公开(公告)日：2020-10-20

申请号：US16387805

申请日：2019-04-18

Applicant: Applied Optoelectronics, Inc.

Inventor： I-Lung Ho ,  Chong Wang ,  Shih-Chia Liu

IPC: G02B6/12 ,  H01S5/022 ,  H01S5/026 ,  H04B10/50 ,  H04B10/40

Abstract: The present disclosure is generally directed to a TO can laser package that includes an off-center focus lens integrated into a lens cap to compensate displacement of an associated laser diode. The TO can laser package includes a TO header with a mounting structure for directly electrically coupling an associated laser diode to electrical leads/pins without the use of an intermediate interconnect. The mounting structure displaces the laser diode such that an emission surface, and more particularly, an origin thereof, is displaced/offset relative to a center of the TO header. The integrated lens cap includes a focus lens with an optical center that is offset from a center of the TO header at a distance that is substantially equal to the displacement of the laser diode. Thus, the displacement of the laser diode is compensated for by the off-center focus lens to minimize or otherwise reduce optical misalignment.

公开(公告)号：US20200251879A1

公开(公告)日：2020-08-06

申请号：US16268765

申请日：2019-02-06

Applicant: Applied Optoelectronics, Inc.

Inventor： Kai-Sheng LIN ,  Hsiu-Che WANG ,  Kevin LIU

IPC: H01S5/022 ,  H01S5/024 ,  H01S5/00 ,  H01S5/40

Abstract: The present disclosure is generally directed to a multi-channel TOSA with vertically-mounted MPDs to reduce TOSA housing dimensions and improve RF driving signal quality. In more detail, a TOSA housing consistent with the present disclosure includes at least one vertical MPD mounting surface that extends substantially transverse relative to a LD mounting surface, with the result being that a MPD coupled to the vertical MPD mounting surface gets positioned above an associated LD coupled to the LD mounting surface. The vertically-mounted MPD thus makes regions adjacent an LD that would otherwise be utilized to mount an MPD available for patterning of conductive RF traces to provide an RF driving signal to the LD. The conductive RF traces may therefore extend below the vertically-mounted MPD to a location that is proximate the LD to allow for relatively short wire bonds therebetween.

公开(公告)号：US10230471B2

公开(公告)日：2019-03-12

申请号：US15576635

申请日：2016-05-23

Applicant: Applied Optoelectronics, Inc.

Inventor： I-Lung Ho ,  Chong Wang ,  Justin Lii ,  Zhengyu Miao

IPC: G02B6/42 ,  H04B10/40 ,  G02B6/43 ,  H04B10/50 ,  H04J14/02

Abstract: A coaxial transmitter optical subassembly (TOSA) including a cuboid type TO laser package may be used in an optical transceiver for transmitting an optical signal at a channel wavelength. The cuboid type TO laser package is made of a thermally conductive material and has substantially flat outer surfaces that may be thermally coupled to substantially flat outer surfaces on a transceiver housing and/or on other cuboid type TO laser packages. An optical transceiver may include multiple coaxial TOSAs with the cuboid type TO laser packages stacked in the transceiver housing. The cuboid type TO laser package may thus provide improved thermal characteristics and a reduced size within the optical transceiver.

公开(公告)号：US10193302B2

公开(公告)日：2019-01-29

申请号：US15591166

申请日：2017-05-10

Applicant: Applied Optoelectronics, Inc.

Inventor： Kai-Sheng Lin ,  Justin Lii ,  Ziliang Cai

IPC: G02B6/38 ,  G02B6/42 ,  H01S5/022 ,  H04B10/50 ,  H04B10/60

Abstract: A light engine is disclosed that includes an optical bench with a mirror etched therefrom to form a single, unitary structure. The integrated mirror may therefore be pre-aligned with an associated light path to reduce light path alignment errors. In an embodiment, the optical bench includes a first end extending to a second end along a longitudinal axis, a laser diode disposed on a mounting surface adjacent the first end of the optical bench and configured to output laser light along a first light path that extends substantially along the longitudinal axis, and an integrated mirror device disposed along the light path to receive and direct the laser light along a second light path to optically couple the laser light to a photonically-enabled complementary metal-oxide semiconductor (CMOS) die, the second light path being substantially orthogonal relative to the first light path.

公开(公告)号：US10098221B2

公开(公告)日：2018-10-09

申请号：US15275785

申请日：2016-09-26

Applicant: Applied Optoelectronics, Inc.

Inventor： Rafael Celedon ,  Mark Siejka ,  Michael Jones

IPC: H05K1/02 ,  H05K1/18 ,  G02B6/42

Abstract: A heat transfer assembly may be used to provide a thermal conduit from a module mounted on a circuit board through the circuit board, allowing a thermal path away from the module. The heat transfer assembly generally includes a thermally conductive base with at least one raised thermal pedestal accessible through at least one heat transfer aperture in the circuit board and in thermal contact with the module. In an embodiment, the heat transfer assembly is used in a remote PHY device (RPD) in an optical node, for example, in a CATV/HFC network. The RPD includes an enclosure having a base with at least one raised thermal pedestal in thermal contact with an optical module (e.g., an optical transmitter or transceiver) on a circuit board through at least one heat transfer aperture in the circuit board.