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公开(公告)号：US20200219420A1
公开(公告)日：2020-07-09
申请号：US16736875
申请日：2020-01-08
Applicant: CCL Label, Inc.
Inventor： Jay Sato
Abstract: Provided is a badge sheet assembly comprising a facestock layer having at least one cut line that defines at least one badge and a matrix portion. The assembly includes a liner sheet layer, an adhesive layer attached to the liner layer and positioned between the facestock layer and liner layer, and a patterned adhesive layer attached to a bottom surface of the at least one badge. The badge sheet assembly is configured to be fed through a printer device to receive printed indicia on a top surface of the at least one badge wherein the badge and patterned adhesive layer are configured to be removed from the matrix portion, the adhesive layer, and the liner layer after a portion of the badge sheet assembly received indicia thereon.
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公开(公告)号：US20200073223A1
公开(公告)日：2020-03-05
申请号：US16557185
申请日：2019-08-30
Applicant: CCL Label, Inc.
Inventor： Frank Y. Shih , Anahit Tataryan , William J. Buehne
Abstract: Provided is a printable coating, printable media and printable labels thereof, usable in both inkjet and direct thermal printing applications. The coating comprises leuco dye blended into an inkjet coating formulation, wherein the coating is applied on the first face of an appropriate paper or film to form the printable media. The coating may be applied as a single, homogenous topcoat thereby streamlining the manufacturing process and reducing potential printing errors. The coating may provide a printable area compatible for use with both direct thermal printers and inkjet printers. On the opposite face of the paper or film, an adhesive may be applied, in combination with an optional release liner, to form printable label stock. Each step of the process, e.g. application of the coating, application of the adhesive and liner, and die-cutting of labels, may occur in any order combination relative to one another. In addition, reverse printing may also be utilized to print and form the labels.
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公开(公告)号：US20190337320A1
公开(公告)日：2019-11-07
申请号：US16400064
申请日：2019-05-01
Applicant: CCL Label, Inc.
Inventor： Sriram Venkatasanthanam , Jay Sato
Abstract: A printable sheet assembly and method provide for feeding cardstock sheets through a printer. The printable sheet assembly may include a focal line formed in a body of the sheet. An adhesive adheres a spring strip to the body. The spring strip overlays the focal line. The spring strip is a rigid material that acts as a spring for the focal line
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公开(公告)号：US20190270329A1
公开(公告)日：2019-09-05
申请号：US16289761
申请日：2019-03-01
Applicant: CCL Label, Inc.
Inventor： Jay Sato
Abstract: A printable sheet assembly and method provide for feeding cardstock sheets through a printer. The printable sheet assembly may include a first fold region. The first fold region comprises a robust perforated line disposed horizontally across the sheet assembly. The printable sheet assembly may include a second fold region. The second fold region may comprise a second robust perforated line disposed horizontally across the sheet assembly. The sheet assembly may include a product such as a name tag, business card, label, or card formed into the sheet assembly and configured to be processed through a printer device to receive indicia thereon.
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公开(公告)号：US10356913B2
公开(公告)日：2019-07-16
申请号：US16045986
申请日：2018-07-26
Applicant: CCL Label, Inc.
Inventor： Jamie Rieg , Randal Taylor , Willie Fowlkes , John Walsh , Paul Janousek
Abstract: The present disclosure related to a flexible electronic substrate assembly and a method and system of processing solder paste onto an electrical substrate. The assembly includes a flexible substrate having a solderable medium provided along the flexible substrate. A pattern of solder paste may be cured to a portion of the solderable medium. The solderable medium may be a generally continuous construction or a patterned construction relative to the flexible substrate. The substrate may be unwound from a roll of substrate material before solder paste is deposited thereon. The flexible electric substrate assembly may be formed though a roll to roll process. Infrared heat may be applied to the substrate with the solder paste deposit as the substrate is traveling along the process direction to reflow the solder paste as the substrate is traveling along the process direction at a high rate of speed.
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Patent Agency Ranking
公开(公告)号：USD846645S1
公开(公告)日：2019-04-23
申请号：US29588305
申请日：2016-12-20
Applicant: CCL Label, Inc.
Designer： William Becker , Joseph Langan
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公开(公告)号：USD841087S1
公开(公告)日：2019-02-19
申请号：US29584761
申请日：2016-11-17
Applicant: CCL Label, Inc.
Designer： Alan Jameson , Eric Cushing , Le-Hoa Hong , Sriram Venkatasanthanam , Adam Bratter , Heba Armand , Ana Trinh
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公开(公告)号：US20190005851A1
公开(公告)日：2019-01-03
申请号：US15637565
申请日：2017-06-29
Applicant: CCL Label, Inc.
Inventor： Mary DeShea Morgan , Glen Edward Matheny , Charles G. Woods , James L. Lowry , John William Walton, III
CPC classification number: G09F3/0289 , G09F3/04 , G09F2003/0222 , G09F2003/0251 , G09F2003/0252 , G09F2003/0272
Abstract: A wrap-around expanded content label includes a base label free of adhesive, a booklet on the base label, and an overlaminate having a pressure sensitive adhesive layer on an underside thereof. The overlaminate overlies and adheres to the booklet, and opposite lateral portions of the overlaminate extend beyond the edges of the booklet to adhere to the base label. One lateral portion of the overlaminate is substantially permanently bonded to the base label adjacent a bound edge of the booklet. The other lateral portion of the overlaminate is resealably bonded to the base label adjacent a free lateral edge of the booklet.
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公开(公告)号：US20180322811A1
公开(公告)日：2018-11-08
申请号：US15968163
申请日：2018-05-01
Applicant: CCL LABEL, INC.
Inventor： Alan W. Maule , Brian R. McCarthy , Martin Utz , Andrew J. Conti , Linwood G. Koger , Kenneth J. Wolfe
CPC classification number: G09F3/02 , B32B7/12 , B32B29/00 , B32B2264/102 , B32B2264/108 , B32B2307/41 , B32B2307/416 , B32B2519/00 , G09F3/10 , Y10T428/14 , Y10T428/1467 , Y10T428/1476
Abstract: The present invention includes a label, a label sheet and a method for manufacturing the label. The label includes a paper facestock having first and second surfaces and a layer of pressure sensitive adhesive proximal to the second surface. The label can be adhered to a substrate having pre-applied indicia to cover the indicia and the label is opaque enough to prevent the viewing of the covered indicia while matching the color of the substrate.
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公开(公告)号：US10064289B2
公开(公告)日：2018-08-28
申请号：US15497309
申请日：2017-04-26
Applicant: CCL Label, Inc.
Inventor： Jamie Rieg , Randal Taylor , Willie Fowlkes , John Walsh , Paul Janousek
CPC classification number: H05K3/3494 , H05K1/028 , H05K1/0393 , H05K3/3484 , H05K13/0465 , H05K2203/1545
Abstract: The present disclosure related to a flexible electronic substrate assembly and a method and system of processing solder paste onto an electrical substrate. The assembly includes a flexible substrate having a solderable medium provided along the flexible substrate. A pattern of solder paste may be cured to a portion of the solderable medium. The solderable medium may be a generally continuous construction or a patterned construction relative to the flexible substrate. The substrate may be unwound from a roll of substrate material before solder paste is deposited thereon. The flexible electric substrate assembly may be formed though a roll to roll process. Infrared heat may be applied to the substrate with the solder paste deposit as the substrate is traveling along the process direction to reflow the solder paste as the substrate is traveling along the process direction at a high rate of speed.
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