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公开(公告)号：US20220096978A1
公开(公告)日：2022-03-31
申请号：US17429989
申请日：2020-03-03
发明人： Tomoya OHASHI , Toyoshiro YOSHIDA , Suguru SASSA
摘要： A production method for an organic solvent that contains less metal impurities which when manufacturing a semiconductor device. This production method passes a liquid through a filter cartridge, wherein the filter cartridge is obtained by layering types of base cloths for filtration, wherein the base cloths for filtration are nonwoven fabric obtained by chemically bonding a metal adsorption group to polyolefin fibers, the base cloths for filtration include nonwoven fabric layer A and nonwoven fabric layer B, the nonwoven fabric layer A includes polyolefin fibers to which a sulfonate group is chemically bonded as a metal adsorption group, the nonwoven fabric layer B includes polyolefin fibers bonded thereto as a metal adsorption group at least one selected from the group consisting of an amino group, an N-methyl-D-glucamine group, an iminodiacetate group, an iminodiethanol group, an amidoxime group, a phosphate group, a carboxylate group, and an ethylene diamine triacetate group.
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公开(公告)号：US20220071956A1
公开(公告)日：2022-03-10
申请号：US17418686
申请日：2019-12-26
IPC分类号： A61K31/409 , A61P35/00 , A61K31/404
摘要： The invention provides a composition for suppressing secretion of extracellular vesicle, which comprises a compound having a structure of the formula II (wherein, each substituent is as defined in the specification), or a pharmaceutically acceptable salt thereof, or a compound having a structure of the formula I (wherein, each substituent is as defined in the specification), or a metal complex thereof, or a pharmaceutically acceptable salt thereof.
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公开(公告)号：US20220010176A1
公开(公告)日：2022-01-13
申请号：US17295546
申请日：2019-11-01
发明人： Masahiro HIDA , Shuhei YAMADA , Masashi ABE
摘要： A reactive silicone composition including component (S) and component (T) below, the component (S): a reactive silicone compound including a condensation product of a diaryl silicate compound represented by Formula [1] and a silicon compound represented by Formula [2], (wherein Ar1 and Ar2 each independently represent a phenyl group optionally substituted by a C1-6 alkyl group and X represents a hydrolyzable reactive group), the component (T): modified titanium oxide-containing oxide colloidal particles produced by bonding an organosilicon compound to surfaces of titanium oxide-containing oxide colloidal particles (C) having an average particle diameter of from 2 to 100 nm and including, as a core, titanium oxide-containing metal oxide colloidal particles (A), surfaces of which are coated with a coating including silicon dioxide- and tin oxide-containing composite oxide colloidal particles (B).
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公开(公告)号：US20210397091A1
公开(公告)日：2021-12-23
申请号：US17296408
申请日：2019-12-18
发明人： Tomoya OHASHI , Toyoshiro YOSHIDA , Suguru SASSA
IPC分类号： G03F7/11 , C09D181/04 , B01J20/26 , B01J20/28 , B01D39/16
摘要： A method for producing a coating film-forming composition for lithography, including a step for passing a liquid through a filter cartridge. The filter cartridge is obtained by layering more than one type of filtration base fabrics or winding same around a hollow inner tube, wherein: the fabrics are non-woven fabrics in which metal-adsorbing groups are chemically bonded to polyolefin fibers; the fabrics contain non-woven fabric layers A and B; layer A is configured from polyolefin fibers to which sulfonic acid groups are chemically bonded as metal-adsorbing groups; and layer B is configured from polyolefin fibers to which at least one type selected from among amino groups, N-methyl-D-glucamine groups, iminodiacetic acid groups, iminodiethanol groups, amidoxime groups, phosphoric acid groups, carboxylic acid groups and ethylenediamine triacetic acid groups chemically bonded as metal-adsorbing groups. Thus, the amount of metal impurities that are the cause of minute defects on a wafer can be reduced.
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公开(公告)号：US20210395462A1
公开(公告)日：2021-12-23
申请号：US17288665
申请日：2019-10-25
发明人： Wataru SHIBAYAMA , Yuichi GOTO , Shun KUBODERA , Satoshi TAKEDA , Ken ISHIBASHI , Makoto NAKAJIMA
IPC分类号： C08G77/26 , H01L21/027 , H01L21/308
摘要： A film-forming composition suitable as a resist underlayer film-forming composition from which a resist underlayer film having not only a good EUV resist adhesivity but also a good etching processability due to a high fluorine-based etching rate.
For example, a film-forming composition includes a polymer represented by Formula (E1) and a solvent.-
公开(公告)号：US11199775B2
公开(公告)日：2021-12-14
申请号：US16094609
申请日：2017-04-17
发明人： Ryo Karasawa , Keisuke Hashimoto
IPC分类号： G03F7/031 , G03F7/11 , G03F7/16 , G03F7/20 , H01L21/027 , H01L21/266 , H01L21/308 , G03F7/038 , G03F7/26
摘要： A resist underlayer film not undergoing intermixing with a resist layer, having high dry etching and heat resistance, exhibiting high temperature low mass loss, and exhibiting even stepped substrate coatability, includes a polymer containing a unit structure of the formula (1): The unit structure of formula (1) is a unit structure of the formula (2): A method for producing a semiconductor device, includes forming, on a semiconductor substrate, a resist underlayer film using a resist underlayer film-forming composition, forming a hard mask on the resist underlayer film, a resist film on the hard mask, a resist pattern by irradiation with light or an electron beam and development of the resist film, a pattern by etching the hard mask using the resist pattern, a pattern by etching the underlayer film using the patterned hard mask, and processing the substrate using the patterned resist underlayer film.
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公开(公告)号：US11183415B2
公开(公告)日：2021-11-23
申请号：US16313370
申请日：2017-06-13
IPC分类号： H01L21/683 , C09J5/06 , C09J183/04 , H01L21/304 , H01L21/768 , C09J11/06
摘要： An adhesive can be easily peeled off after polishing the back face of a wafer, which has heat resistance and can be easily washed off. An adhesive for peelably adhering between a support and a circuit-bearing face of a wafer and thereby processing a back face of the wafer, a peeling face upon peeling becomes selectable according to heating from the support side or wafer side when the adhesive is cured. The adhesive includes a component (A) curing by hydrosilylation reaction and a component (B) containing a polydimethylsiloxane. A peeling method including forming an adhesion layer by applying the adhesive to a surface of a first substrate, bonding a surface of a second substrate to the adhesion layer, curing the adhesion layer by heating from the first substrate side to form a laminate, processing the laminate, and peeling off between the first substrate and the adhesion layer.
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公开(公告)号：US11168201B2
公开(公告)日：2021-11-09
申请号：US17270926
申请日：2020-05-13
IPC分类号： C08K9/04 , C01B33/146 , C01B33/145 , C09C1/30 , C08K3/36
摘要： A silica-blended resin varnish contains a silica sol with a high dispersibility that is dispersed in a ketone organic solvent, in a nitrogen atom-containing polymer. The particles have an average size of 5 to 100 nm and have a carbon-carbon unsaturated bond-containing organic group and an alkoxy group bonded to surfaces thereof. The carbon-carbon unsaturated bond-containing organic group is bonded at 0.5 to 2.0 groups per unit area (nm2) of the particle surfaces. The alkoxy group is bonded at 0.1 to 2.0 groups per unit area (nm2) of the particle surfaces. The molar ratio of {(the carbon-carbon unsaturated bond-containing organic group)/(the alkoxy group)} is 0.5 to 5.0. The carbon-carbon unsaturated bond-containing organic group may be a phenyl group-containing organic group or a (meth)acryloyl group-containing organic group. An insulating resin composition contains the silica sol and a nitrogen-containing polymer, which may be polyimide, polyamide, polyamic acid, polyamide-imide, polyetherimide, or polyesterimide.
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公开(公告)号：US20210336271A1
公开(公告)日：2021-10-28
申请号：US17270210
申请日：2019-08-19
发明人： Mari YAJIMA , Tatsuya HATANAKA , Yasushi SAKAIDA
摘要： Provided is a composition for forming a thin film for an energy storage device that contains a cationic polymer, and does not contain an electrically conductive carbon material.
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公开(公告)号：US20210311396A1
公开(公告)日：2021-10-07
申请号：US17264542
申请日：2019-07-18
IPC分类号： G03F7/11 , C08G59/42 , C08G59/24 , C08G59/68 , C09D163/00
摘要： A resist underlayer film-forming composition including: a resin having a repeating structural unit including at least one —C(═O)—O— group in a main chain and a repeating structural unit including at least one hydroxy group in a side chain, or including at least one —C(═O)—O— group in a main chain and at least one hydroxy group in a side chain, wherein none of these units have an organic group containing an epoxy or oxetane ring; an acid catalyst or salt thereof in an amount of 0.1 to 10 parts by mass relative to 100 parts by mass of the resin, when the catalyst is a monovalent acid, an acid dissociation constant pKa is −0.5 or less in 25° C. water, or when a multivalent acid, an acid dissociation constant pKa1 is −0.5 or less in 25° C. water; and a solvent, wherein the composition does not include a monomer crosslinking agent.
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