公开(公告)号：US20230298923A1

公开(公告)日：2023-09-21

申请号：US18017229

申请日：2021-07-15

Applicant: NISSAN CHEMICAL CORPORATION

Inventor： Takahisa OKUNO ,  Hiroto OGATA ,  Masaki YANAI ,  Tetsuya SHINJO

IPC: H01L21/683 ,  H01L21/02 ,  C09J7/40 ,  C09J183/04

CPC classification number: H01L21/6835 ,  H01L21/02057 ,  C09J7/40 ,  C09J183/04 ,  H01L2221/68327 ,  H01L2221/6839 ,  C09J2301/502 ,  C09J2301/416

Abstract: A laminate having a semiconductor substrate, a support substrate, and an adhesive layer and a release layer disposed between the semiconductor substrate and the support substrate, wherein the release layer is a film formed from a releasing agent composition containing an organic resin, a branched-chain polysilane, and a solvent.

公开(公告)号：US20230151308A1

公开(公告)日：2023-05-18

申请号：US17913624

申请日：2021-03-22

Applicant: NISSAN CHEMICAL CORPORATION

Inventor： Takahisa OKUNO ,  Masaki YANAI ,  Takuya FUKUDA ,  Hiroto OGATA ,  Shunsuke MORIYA ,  Hiroshi OGINO ,  Tetsuya SHINJO

IPC: C11D11/00 ,  C11D7/50 ,  C09J5/00 ,  H01L21/02 ,  B08B3/08

CPC classification number: C11D11/0047 ,  C11D7/5022 ,  C11D7/5013 ,  C11D7/5009 ,  C09J5/00 ,  H01L21/02079 ,  B08B3/08 ,  C09J2483/00 ,  B08B2220/01

Abstract: The present invention provides a semiconductor substrate cleaning method including a step of removing an adhesive layer provided on a semiconductor substrate by use of a remover composition, wherein the remover composition contains a solvent but no salt; and the solvent includes an organic solvent represented by formula (L) (wherein each of L1 and L2 represents a C2 to C4 alkyl group, and L3 represents O or S) in an amount of 80 mass % or more.


L1-L3-L2(L)

公开(公告)号：US20230143007A1

公开(公告)日：2023-05-11

申请号：US17801016

申请日：2021-02-16

Applicant: NISSAN CHEMICAL CORPORATION

Inventor： Hiroto OGATA ,  Tetsuya SHINJO

IPC: C09J7/40 ,  C09J183/04 ,  C09J7/38 ,  B32B7/12

CPC classification number: C09J7/401 ,  B32B7/12 ,  C09J7/38 ,  C09J183/04 ,  C09J2203/326 ,  H01L21/6836

Abstract: The invention provides a laminate having a first substrate formed of a semiconductor substrate; a second substrate formed of a light-transmissive support substrate; and an adhesive layer and a release layer disposed between the first substrate and the second substrate, characterized in that the release layer is a film formed from a releasing agent composition containing a polynuclear phenol derivative represented by formula (P) (wherein Ar represents an arylene group), a cross-linking agent, and at least one of an acid generator and an acid.

公开(公告)号：US20220411684A1

公开(公告)日：2022-12-29

申请号：US17787663

申请日：2020-12-15

Applicant: NISSAN CHEMICAL CORPORATION

Inventor： Hiroto OGATA ,  Tetsuya SHINJO ,  Hiroshi OGINO ,  Shunsuke MORIYA ,  Takahisa OKUNO ,  Takuya FUKUDA ,  Masaki YANAI

IPC: C09J183/04 ,  B32B7/12 ,  B32B37/12 ,  B32B43/00 ,  B32B17/06 ,  B32B7/06 ,  B32B38/00 ,  B32B9/04 ,  H01L21/683

Abstract: The invention provides an adhesive composition containing an adhesive component (S) and a release component (H) formed of a polyorganosiloxane having a complex viscosity of 3,400 (Pa·S) or higher.

公开(公告)号：US20240222180A1

公开(公告)日：2024-07-04

申请号：US18283987

申请日：2022-02-21

Applicant: NISSAN CHEMICAL CORPORATION

Inventor： Masafumi YAGYU ,  Hiroto OGATA ,  Takahisa OKUNO

IPC: H01L21/683 ,  C09J11/08 ,  C09J183/06 ,  H01L21/304 ,  H01L21/56

CPC classification number: H01L21/6835 ,  C09J11/08 ,  C09J183/06 ,  H01L21/304 ,  H01L21/56 ,  H01L2221/68318 ,  H01L2221/68386

Abstract: Provided are a laminate including an adhesive layer that can implement easy peeling when a semiconductor substrate and a support substrate are separated after processing of the semiconductor substrate and can suppress deformation of a bump, and the like.
A laminate includes a semiconductor substrate with a bump; a support substrate; a protective adhesive layer formed so as to be in contact with the semiconductor substrate with a bump; and a peeling adhesive layer formed between the protective adhesive layer and the support substrate,



in which the protective adhesive layer is formed of a protective adhesive composition, and the protective adhesive composition contains a component (A) which is cured by a hydrosilylation reaction and does not contain a peeling agent component (B) which does not cause a curing reaction, and
the peeling adhesive layer is formed of a peeling adhesive composition, and the peeling adhesive composition contains a component (A) which is cured by a hydrosilylation reaction and a peeling agent component (B) which does not cause a curing reaction.

公开(公告)号：US20230265325A1

公开(公告)日：2023-08-24

申请号：US18010094

申请日：2021-06-10

Applicant: NISSAN CHEMICAL CORPORATION

Inventor： Masaki YANAI ,  Takahisa OKUNO ,  Hiroto OGATA ,  Shunsuke MORIYA

IPC: C09J183/04 ,  C08K5/56 ,  C09J7/40 ,  B32B7/12 ,  B32B37/12 ,  B32B7/06 ,  B32B43/00 ,  B32B37/26

CPC classification number: C09J183/04 ,  C08K5/56 ,  C09J7/401 ,  B32B7/12 ,  B32B37/1284 ,  B32B7/06 ,  B32B43/006 ,  B32B37/26 ,  B32B2255/26 ,  B32B2315/08 ,  B32B17/06

Abstract: A laminate having a semiconductor substrate, a UV-ray-transmissive support substrate, and an adhesive layer and a release layer disposed between the semiconductor substrate and the support substrate. The release layer is a film formed from a releasing agent composition containing a polymer of an ethylenic unsaturated monomer having a tert-butoxycarbonyl group, a photoacid generator, and a solvent.

公开(公告)号：US20230125907A1

公开(公告)日：2023-04-27

申请号：US17913314

申请日：2021-03-22

Applicant: NISSAN CHEMICAL CORPORATION

Inventor： Takahisa OKUNO ,  Masaki YANAI ,  Takuya FUKUDA ,  Hiroto OGATA ,  Shunsuke MORIYA ,  Hiroshi OGINO ,  Tetsuya SHINJO

IPC: C11D7/50 ,  C11D7/24 ,  C11D7/32 ,  C11D11/00 ,  H01L21/02 ,  B08B3/08

Abstract: A semiconductor substrate cleaning method including removing an adhesive layer provided on a semiconductor substrate by use of a remover composition, wherein the remover composition contains a solvent but no salt; and the solvent includes an organic solvent represented by any of formulae (L0) to (L4).

公开(公告)号：US20220334483A1

公开(公告)日：2022-10-20

申请号：US17641852

申请日：2020-10-05

Applicant: NISSAN CHEMICAL CORPORATION

Inventor： Hiroto OGATA ,  Hirokazu NISHIMAKI ,  Makoto NAKAJIMA

IPC: G03F7/11 ,  C08G61/02 ,  H01L21/027 ,  H01L21/3065

Abstract: A composition for forming a resist underlayer film exhibits strong etching resistance, has a good dry etching rate ratio and a good optical constant, and is capable of forming a film that provides good coverage over a so-called multilevel substrate and that is flat with reduced difference in thickness after embedding. A resist underlayer film uses said composition for forming a resist underlayer film; and a method for producing a semiconductor device. The composition for forming a resist underlayer film contains: a polymer having the partial structure represented by formula (1); and a solvent. (In the formula, Ar represents an optionally substituted C6-20 aromatic group.)

公开(公告)号：US20200209753A1

公开(公告)日：2020-07-02

申请号：US16646987

申请日：2018-09-19

Applicant: NISSAN CHEMICAL CORPORATION

Inventor： Mamoru TAMURA ,  Hiroto OGATA ,  Takahiro KISHIOKA

IPC: G03F7/11 ,  C09D163/04 ,  C08G59/14 ,  G03F7/16 ,  G03F7/20 ,  G03F7/38 ,  G03F7/32 ,  H01L21/027

Abstract: A resist underlayer film forming composition contains a resin containing a unit structure represented by formula (1): [in formula (1), R1 represents a thiadiazole group which is optionally substituted with a C1-6 alkyl group optionally interrupted by a carboxy group, a C1-6 alkyl group optionally substituted with a hydroxyl group, or a C1-4 alkylthio group, and R2 represents a hydrogen atom or formula (2): (in formula (2), R1 is the same as defined above, and * represents a binding moiety)]. The resist underlayer film forming composition provides a resist underlayer film which has excellent solvent resistance, excellent optical parameters, an excellent dry etching rate, and excellent embeddability.

公开(公告)号：US20200183282A1

公开(公告)日：2020-06-11

申请号：US16333551

申请日：2017-09-15

Applicant: NISSAN CHEMICAL CORPORATION

Inventor： Yuto HASHIMOTO ,  Hikaru TOKUNAGA ,  Hiroto OGATA ,  Tomoya OHASHI ,  Yasushi SAKAIDA ,  Takahiro KISHIOKA

IPC: G03F7/11 ,  H01L21/027 ,  C08F220/14 ,  C09D133/12 ,  C08G59/62 ,  C09D163/06 ,  C08G59/32

Abstract: A composition for forming protective films against aqueous hydrogen peroxide solutions, including: a compound of the following formula (1a) or formula (1b) or a compound having a substituent of the following formula (2) and having a molecular weight of 300 or more and less than 800 or a weight-average molecular weight of 300 or more and less than 800; and a solvent, the composition containing the compound of the formula (1a) or formula (1b) of 0.1% by mass to 60% by mass or the compound having the substituent of the formula (2) of 10% by mass to 100% by mass, relative to solids excluding the solvent: (wherein R1 is a C1-4 alkylene or alkenylene group or a direct bond, k is 0 or 1, m is an integer of 1 to 3, and n is an integer of 2 to 4.)