-
公开(公告)号：US20230199408A1
公开(公告)日：2023-06-22
申请号：US17739202
申请日：2022-05-09
发明人： Zhengyu Shi , Linlin Wang , Rui Zhang
CPC分类号： H04R19/04 , H04R7/04 , H04R7/18 , B81B3/0045 , H04R2201/003 , B81B2201/0257
摘要： The present invention discloses a MEMS chip including a substrate with a back cavity; a capacitance system disposed on the substrate including a back plate, a membrane opposite to the back plate forming an inner cavity; a protruding portion accommodated in the inner cavity, fixed on one of the back plate and the membrane and spaced apart from the other along a vibration direction; a support system configured to support the capacitance system, including a first fixation portion suspending the membrane on the substrate, and a second fixation portion suspending the back plate on the substrate; the protruding portion comprises an annular first protruding portion and an annular second protruding portion surrounding the first protruding portion. The MEMS chip has higher sensitivity, higher resonance frequency and higher low frequency property.
-
公开(公告)号：US20230097631A1
公开(公告)日：2023-03-30
申请号：US17584337
申请日：2022-01-25
发明人： Yuwei Liu , Rui Zhang , Zhenkui Meng
摘要： The invention provides a diaphragm and a preparation method thereof, and an MEMS microphone. The diaphragm includes a intermediate vibration part and a fixed part surrounding the vibration part. The vibration part includes multiple vibration sub-parts, which are distributed stepwise along the vibration direction of the diaphragm. Multiple vibration sub-parts are distributed stepwise along the vibration direction of diaphragm. The effective area of the diaphragm is increased, and the stress can be adjusted by the height of the ladder and its inclination angle. The mechanical sensitivity of the MEMS microphone containing this diaphragm is improved, resulting in a high-performance, small-sized MEMS microphone.
-
公开(公告)号：US20220205820A1
公开(公告)日：2022-06-30
申请号：US17563015
申请日：2021-12-27
发明人： Yang Bai , Yanxin Chen , Rui Zhang
摘要： The present disclosure provides a linear motor including: a housing body with a containment space; a vibrator assembly suspended in the containment space by an elastic member for vibrating along a vibration direction; a stator assembly fixedly connected to the housing body and having a magnetic axis along the vibration direction; and two magnets located on both sides of the magnetic axis and spaced from the stator assembly, including a first magnet section and a second magnet section located on both sides of the first magnet section. A magnetic field strength of the first magnet section along the magnetic axis is greater than a magnetic field strength of the second magnet section along the magnetic axis. The configuration of the invention can effectively reduce the static attraction force of the magnetic circuit, and increase the overall rigidity of the linear motor.
-
公开(公告)号：US11159894B2
公开(公告)日：2021-10-26
申请号：US16827673
申请日：2020-03-23
发明人： Linlin Wang , Xiaohui Zhong , Rui Zhang , Zhenkui Meng
摘要： The present invention provides a MEMS microphone, having a base and a capacitive system provided on the base. The capacitive system includes a diaphragm and a back plate. The MEMS microphone is further provided with a supporting frame located between the back plate and the diaphragm. One end of the supporting frame is connected with the back plate, and the other end is connected with the diaphragm. The supporting frame divides the cavity into a first cavity body and a second cavity body. The supporting frame is provided with a connection channel. During the production process of the MEMS microphone, the etchant enters the first cavity body, and then enters the second cavity body, which prevents oxides from remaining in the microphone product and affecting the use of MEMS microphone.
-
公开(公告)号：US20210204069A1
公开(公告)日：2021-07-01
申请号：US16827673
申请日：2020-03-23
发明人： Linlin Wang , Xiaohui Zhong , Rui Zhang , Zhenkui Meng
摘要： The present invention provides a MEMS microphone, having a base and a capacitive system provided on the base. The capacitive system includes a diaphragm and a back plate. The MEMS microphone is further provided with s a supporting frame located between the back plate and the diaphragm. One end of the supporting frame is connected with the back plate, and the other end is connected with the diaphragm. The supporting frame divides the cavity into a first cavity body and a second cavity body. The supporting frame is provided with a connection channel. During the production process of the lo MEMS microphone, the etchant enters the first cavity body, and then enters the second cavity body, which prevents oxides from remaining in the microphone product and affecting the use of MEMS microphone.
-
公开(公告)号：US11032651B2
公开(公告)日：2021-06-08
申请号：US16702598
申请日：2019-12-04
摘要： The present application provides a piezoelectric microphone, including a substrate having a back cavity and a piezoelectric cantilever diaphragm fixed to the substrate. The piezoelectric cantilever diaphragm includes a first diaphragm located at its center and suspended above the back cavity, and a second diaphragm fixed to the substrate and provided around the first diaphragm. The second diaphragm includes a fixed end fixed to one side of the substrate and a movable end close to the first diaphragm side and suspended above the back cavity. The piezoelectric microphone further includes one or more elastically stretchable members each connecting the first diaphragm with the movable end. The piezoelectric microphone of the present disclosure has better performance.
-
公开(公告)号：US20210051409A1
公开(公告)日：2021-02-18
申请号：US16988733
申请日：2020-08-10
发明人： Lian Duan , Rui Zhang , Zhiyuan Chen
摘要： The present invention provides a piezoelectric MEMS microphone having a base with a cavity, a piezoelectric diaphragm, and a restraining element. The base has a ring base circumferentially forming a cavity, a support column. The piezoelectric diaphragm includes diaphragm sheets each having a fixing end connected to a support column and a free end suspended over the cavity. The restraining element has one end fixedly connected to the free end, the other end connected to the part on the base that is not connected to the fixing end. The piezoelectric MEMS microphone of the invention can constrain the deformation of the diaphragm sheet, thereby improving the resonant frequency of the piezoelectric diaphragm, reducing the noise of the whole piezoelectric MEMS microphone.
-
公开(公告)号：US10582307B2
公开(公告)日：2020-03-03
申请号：US16234567
申请日：2018-12-28
摘要： The present disclosure provides an MEMS microphone, including a substrate having a back cavity and a capacitor system fixedly disposed on the substrate, where the capacitor system includes a backplane and a vibrating diaphragm that are spaced apart from each other, the backplane includes a backplane insulation layer and a backplane conducting layer disposed on the backplane insulation layer, an outer edge of the backplane conducting layer is provided with a notch, the backplane insulation layer is provided with a first through hole, the first through hole includes a first sound hole disposed in a location corresponding to the notch, and the notch is in communication with the first sound hole. The present disclosure reduces stress concentration of the backplane and reducing a risk of structural failure such as breaking of the backplane.
-
公开(公告)号：US20190246214A1
公开(公告)日：2019-08-08
申请号：US16234567
申请日：2018-12-28
摘要： The present disclosure provides an MEMS microphone, including a substrate having a back cavity and a capacitor system fixedly disposed on the substrate, where the capacitor system includes a backplane and a vibrating diaphragm that are spaced apart from each other, the backplane includes a backplane insulation layer and a backplane conducting layer disposed on the backplane insulation layer, an outer edge of the backplane conducting layer is provided with a notch, the backplane insulation layer is provided with a first through hole, the first through hole includes a first sound hole disposed in a location corresponding to the notch, and the notch is in communication with the first sound hole. The present disclosure reduces stress concentration of the backplane and reducing a risk of structural failure such as breaking of the backplane.
-
-
-
-
-
-
-
-
搜索结果
59 条记录 (耗时 0.021 秒)
