公开(公告)号：US09284412B2

公开(公告)日：2016-03-15

申请号：US14726885

申请日：2015-06-01

Applicant: ASPEN AEROGELS, INC.

Inventor： Wenting Dong ,  Wendell E Rhine ,  Decio Coutinho

IPC: C08G73/10 ,  B01J13/00 ,  C08G77/54 ,  C08K3/20 ,  F16L59/02 ,  E04B1/78

CPC classification number: C08J9/286 ,  B01J13/0091 ,  C08G73/106 ,  C08G77/54 ,  C08G2220/00 ,  C08J9/0066 ,  C08J9/0085 ,  C08J2201/0502 ,  C08J2205/026 ,  C08J2379/08 ,  C08K3/20 ,  E04B1/78 ,  F16L59/028

Abstract: Disclosed and claimed herein are hybrid aerogels which are compositions of tetraalkoxysilanes and bis-(trialkoxysilyl) imides that exhibit low thermal conductivities and high compressive strengths. Methods for their preparation are also provided.

Abstract translation: 本文公开和要求保护的是混合气凝胶，其是表现出低导热性和高抗压强度的四烷氧基硅烷和双 - （三烷氧基甲硅烷基）酰亚胺的组合物。 还提供了其制备方法。

公开(公告)号：US20150259476A1

公开(公告)日：2015-09-17

申请号：US14726885

申请日：2015-06-01

Applicant: ASPEN AEROGELS,INC.

Inventor： Wenting Dong ,  Wendell E Rhine ,  Decio Coutinho

IPC: C08G73/10

CPC classification number: C08J9/286 ,  B01J13/0091 ,  C08G73/106 ,  C08G77/54 ,  C08G2220/00 ,  C08J9/0066 ,  C08J9/0085 ,  C08J2201/0502 ,  C08J2205/026 ,  C08J2379/08 ,  C08K3/20 ,  E04B1/78 ,  F16L59/028

Abstract: Disclosed and claimed herein are hybrid aerogels which are compositions of tetraalkoxysilanes and bis-(trialkoxysilyl) imides that exhibit low thermal conductivities and high compressive strengths. Methods for their preparation are also provided.

公开(公告)号：US20150145106A1

公开(公告)日：2015-05-28

申请号：US14571968

申请日：2014-12-16

Applicant: Aspen Aerogels, Inc.

Inventor： Nicholas Anthony Zafiropoulos ,  Paul Nahass ,  Roxana Trifu ,  Redouane Begag ,  Wendell E. Rhine ,  Wenting Dong ,  Shannon Olga White ,  George L. Gould ,  Alaric Naiman ,  Roger Sinta

IPC: H01L23/532

CPC classification number: H01L23/5329 ,  C08L79/08 ,  H01L21/02118 ,  H01L21/02126 ,  H01L21/02203 ,  H01L21/02282 ,  H01L21/31058 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Materials and methods for manufacturing electronic devices and semiconductor components using low dielectric materials comprising polyimide based aerogels are described. Additional methods for manipulating the properties of the dielectric materials and affecting the overall dielectric property of the system are also provided.

Abstract translation: 描述了使用包含聚酰亚胺基气凝胶的低介电材料制造电子器件和半导体部件的材料和方法。 还提供了用于操纵介电材料的性质并影响系统的整体介电性能的附加方法。