公开(公告)号：US10903151B2

公开(公告)日：2021-01-26

申请号：US15987622

申请日：2018-05-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wen-Long Lu

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00

Abstract: A semiconductor substrate includes a dielectric layer, a first conductive layer, a first barrier layer and a conductive post. The dielectric layer has a first surface and a second surface opposite to the first surface. The first conductive layer is disposed adjacent to the first surface of the dielectric layer. The first barrier layer is disposed on the first conductive layer. The conductive post is disposed on the first barrier layer. A width of the conductive post is equal to or less than a width of the first barrier layer.

公开(公告)号：US10886233B2

公开(公告)日：2021-01-05

申请号：US16264603

申请日：2019-01-31

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wen-Long Lu

IPC: H01L23/544 ,  H01L23/31 ,  H01L21/56

Abstract: A semiconductor device package is provided, which includes a substrate, a semiconductor device and an alignment structure. The semiconductor device and the alignment structure are disposed on the substrate. The alignment structure is in direct contact with the semiconductor device.

公开(公告)号：US10818636B2

公开(公告)日：2020-10-27

申请号：US16118235

申请日：2018-08-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wen-Long Lu ,  Jen-Kuang Fang

IPC: H01L21/762 ,  H01L23/00 ,  H01L23/28 ,  H01L23/498

Abstract: A substrate panel structure includes a plurality of sub-panels and a dielectric portion. Each of the sub-panels includes a plurality of substrate units. The dielectric portion is disposed between the sub-panels.

公开(公告)号：US10818586B1

公开(公告)日：2020-10-27

申请号：US16678784

申请日：2019-11-08

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wen-Long Lu

IPC: H05K1/14 ,  H05K3/40 ,  H01L23/498 ,  H01L21/48

Abstract: A substrate structure is provided. The substrate structure includes a substrate, a first redistribution structure, a first adhesive layer and a first connecting component. The substrate includes a first conductor on a first surface thereof. The first redistribution structure is disposed over the substrate. The first adhesive layer is disposed between the substrate and the first redistribution structure. The first connecting component is electrically connected with the first conductor, penetrates through the first adhesive layer into the first redistribution structure, and electrically connects the substrate to the first redistribution structure.

公开(公告)号：US10658280B2

公开(公告)日：2020-05-19

申请号：US15858723

申请日：2017-12-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wen-Long Lu

IPC: H01L23/498 ,  H01L25/065 ,  H01L27/12 ,  H01L21/768 ,  H01L23/48 ,  H01L21/48 ,  H01L23/373

Abstract: An electrical device includes a substrate and a via. The substrate has a first surface and defines a recess in the first surface. The via is disposed in the recess. The via includes an insulation layer, a first conductive layer and a second conductive layer. The insulation layer is disposed on the first surface of the substrate and extends at least to a sidewall of the recess. The first conductive layer is disposed adjacent to the insulation layer and extends over at least a portion of the first surface. The second conductive layer is disposed adjacent to the first conductive layer and extends over at least a portion of the first surface. The second conductive layer has a negative coefficient of thermal expansion (CTE).

公开(公告)号：US20200057201A1

公开(公告)日：2020-02-20

申请号：US15998408

申请日：2018-08-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Huang-Hsien Chang ,  Po Ju Wu ,  Yu Cheng Chen ,  Wen-Long Lu

IPC: G02B6/36 ,  G02B6/42 ,  G02B6/44

Abstract: An optical device package includes a semiconductor substrate, and an optical device. The semiconductor substrate has a first surface, a second surface different in elevation from the first surface, and a profile connecting the first surface to the second surface. A surface roughness of the profile is greater than a surface roughness of the second surface. The optical device is disposed on the second surface and surrounded by the profile.

公开(公告)号：US10269672B2

公开(公告)日：2019-04-23

申请号：US15685869

申请日：2017-08-24

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jen-Kuang Fang ,  Wen-Long Lu

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01R12/75 ,  H05K3/30 ,  H01L21/48 ,  H01L21/768 ,  H01L25/065 ,  H01L25/00 ,  B23K3/06

Abstract: A semiconductor package device comprises a first dielectric layer, a first conductive pad and a first conductive element. The first dielectric layer has a first surface and a second surface opposite to the first surface. The first dielectric layer defines a first opening tapered from the first surface toward the second surface. The first conductive pad is within the first opening and adjacent to the second surface of the first dielectric layer. At least a portion of the first conductive element is within the first opening. The first conductive element is engaged with (e.g., abuts) a sidewall of the first opening, the first conductive element having a first surface facing toward the first conductive pad, wherein the first surface of the first conductive element is spaced apart from the first conductive pad.

公开(公告)号：US12224219B2

公开(公告)日：2025-02-11

申请号：US17898299

申请日：2022-08-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wen-Long Lu

IPC: H01L23/31

Abstract: A package structure and a circuit layer structure are provided in the present disclosure. The package structure includes a wiring structure, a first electronic device, a second electronic device and at least one dummy trace. The wiring structure includes a plurality of interconnection traces. The first electronic device and the second electronic device are disposed on the wiring structure, and electrically connected to each other through the interconnection traces. The dummy trace is adjacent to the interconnection traces. A mechanical strength of the at least one dummy trace is less than a mechanical strength of one of the interconnection traces.

公开(公告)号：US12142584B2

公开(公告)日：2024-11-12

申请号：US18231774

申请日：2023-08-08

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wen-Long Lu

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H01L23/66 ,  H01Q1/38

Abstract: A semiconductor device package includes an electronic component and a substrate. The electronic component has a first surface and a second surface. The substrate is connected to the first surface of the electronic component through an adhesive layer. The substrate includes a first antenna disposed over the second surface of the electronic components through the adhesive layer.

公开(公告)号：US11856856B2

公开(公告)日：2023-12-26

申请号：US16588666

申请日：2019-09-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wen-Long Lu

IPC: H10N10/13 ,  H01L23/38 ,  H10N10/17 ,  G01N25/32 ,  H10N10/01 ,  H10N10/852 ,  H10N19/00

CPC classification number: H10N10/13 ,  H01L23/38 ,  H10N10/17 ,  G01N25/32 ,  H10N10/01 ,  H10N10/852 ,  H10N19/101

Abstract: A thermal conduction unit includes a conductive via, a periphery conductor and an isolation material. The conductive via includes a first thermoelectric material. The periphery conductor encloses the conductive via and includes a second thermoelectric material. An end of the periphery conductor is electrically connected to an end of the conductive via. The isolation material is interposed between the conductive via and the periphery conductor.