Abstract:
Custom antenna structures may be used to improve antenna performance and to compensate for manufacturing variations in electronic device antennas. An electronic device antenna may include an antenna tuning element and conductive structures formed from portions of a peripheral conductive housing member and other conductive antenna structures. The antenna tuning element may be connected across a gap in the peripheral conductive housing member. The custom antenna structures may be used to couple the antenna tuning element to a fixed custom location on the peripheral conductive housing member to help satisfy design criteria and to compensate for manufacturing variations in the conductive antenna structures that could potentially lead to undesired variations in antenna performance. Custom antenna structures may include springs and custom paths on dielectric supports.
Abstract:
An electronic device may be provided with peripheral conductive housing structures having first and second segments. The device may include an antenna having a resonating arm formed from the first segment, an antenna ground, and a tuning element. The tuning element may have first, second, and third terminals. The first terminal may be coupled to the second segment. The antenna may have a switchable loop path that includes a first path from the second terminal to the first segment, a second path from first segment to a first point on the antenna ground, a portion of the antenna ground from the first point to a second point, and a third path from the second point to the third terminal. The tuning element may selectively activate the switchable loop path to boost performance of the antenna in a frequency band between 3300 MHz and 5000 MHz when needed.
Abstract:
An electronic device may include first and second phased antenna arrays and a triplet of first, second, and third ultra-wideband antennas. An antenna module in the device may include a dielectric substrate. The first and second arrays and the triplet may be formed on the dielectric substrate. The third and second ultra-wideband antennas may be separated by a gap. The first array may be laterally interposed between the third and second ultra-wideband antennas within the gap. The third ultra-wideband antenna may be laterally interposed between the first phased antenna array and at least some of the second array. An integrated circuit may be mounted to the dielectric substrate using an interposer. The antenna module may occupy a minimal amount of space within the device and may be less expensive to manufacture relative to scenarios where the arrays and the ultra-wideband antennas are formed on separate substrates.
Abstract:
An electronic device may be provided with peripheral conductive housing structures having a first segment and a second segment. First and second antenna feeds may be coupled between the first segment and the ground structures. The first feed may convey signals in a first band and the second feed may convey signals in a second band. The first segment may be near-field coupled to a slot between the second segment and the ground structures. A first tuner may be coupled between the second segment and the ground structures and may adjust a resonance of the first segment in the first and second bands. A second tuner coupled to the first feed may perform impedance matching in the first band and aperture tuning in the second band. A third tuner coupled to the second feed may perform impedance matching in the second band and aperture tuning in the first band.
Abstract:
This disclosure is directed to filtering in a transceiver of an electronic device. In some instances, active analog filters may be deployed in the transceiver of the electronic device to achieve greater linearity and/or reduce noise in the transceiver. However, as signal bandwidth grows increasingly larger, an active analog filter may consume excessive power. To remedy the excessive power consumption, a passive ladder LC filter may be used. Some LC ladder filters may include a limited quality factor (Q), which may lead to undesirable effects in the transceiver (e.g., voltage droop). To address these undesirable effects, certain components in the LC ladder filter may be relocated from an input port to a feedback chain of an amplifier coupled to the LC ladder filter. The new structure may enable components in the LC ladder filter to be tuned without causing additional voltage droop across the LC ladder filter.
Abstract:
An electronic device may be provided with a conductive sidewall. An aperture may be formed in the sidewall. The sidewall may have a cavity that extends from the aperture towards the interior of the device. The cavity may be filled with an injection-molded plastic substrate. A dielectric block having a dielectric constant greater than that of the injection-molded plastic substrate and the antenna layers may be embedded in the injection-molded plastic substrate. The dielectric block may at least partially overlap an antenna. The antenna may convey radio-frequency signals at a frequency greater than 10 GHz through the cavity, the dielectric block, the injection-molded plastic substrate, and the aperture. The dielectric block may increase the effective dielectric constant of the cavity, allowing the antenna to cover relatively low frequencies without increasing the size of the aperture.
Abstract:
An electronic device may be provided with a conductive sidewall. An aperture may be formed in the sidewall. The sidewall may have a cavity that extends from the aperture towards the interior of the device. The cavity may be filled with an injection-molded plastic substrate. A dielectric block having a dielectric constant greater than that of the injection-molded plastic substrate and the antenna layers may be embedded in the injection-molded plastic substrate. The dielectric block may at least partially overlap an antenna. The antenna may convey radio-frequency signals at a frequency greater than 10 GHz through the cavity, the dielectric block, the injection-molded plastic substrate, and the aperture. The dielectric block may increase the effective dielectric constant of the cavity, allowing the antenna to cover relatively low frequencies without increasing the size of the aperture.
Abstract:
An electronic device may be provided with wireless circuitry and control circuitry. The wireless circuitry may include multiple antennas and transceiver circuitry. An antenna in the electronic device may have an inverted-F antenna resonating element formed from portions of a peripheral conductive electronic device housing structure and may have an antenna ground that is separated from the antenna resonating element by a gap. The antenna ground for the antenna may include a conductive frame for the display. The conductive frame may have a first portion that is separated from the antenna resonating element arm by a first distance and a second portion that is separated from the antenna resonating element arm by a second distance that is less than the first distance. The second portion may be configured to form a distributed impedance matching capacitance with the antenna resonating element arm.
Abstract:
An electronic device may be provided with a conductive sidewall. An aperture may be formed in the sidewall. The sidewall may have a cavity that extends from the aperture towards the interior of the device. The cavity may be filled with an injection-molded plastic substrate. A dielectric block having a dielectric constant greater than that of the injection-molded plastic substrate and the antenna layers may be embedded in the injection-molded plastic substrate. The dielectric block may at least partially overlap an antenna. The antenna may convey radio-frequency signals at a frequency greater than 10 GHz through the cavity, the dielectric block, the injection-molded plastic substrate, and the aperture. The dielectric block may increase the effective dielectric constant of the cavity, allowing the antenna to cover relatively low frequencies without increasing the size of the aperture.
Abstract:
An electronic device may include first and second phased antenna arrays and a triplet of first, second, and third ultra-wideband antennas. An antenna module in the device may include a dielectric substrate. The first and second arrays and the triplet may be formed on the dielectric substrate. The third and second ultra-wideband antennas may be separated by a gap. The first array may be laterally interposed between the third and second ultra-wideband antennas within the gap. The third ultra-wideband antenna may be laterally interposed between the first phased antenna array and at least some of the second array. An integrated circuit may be mounted to the dielectric substrate using an interposer. The antenna module may occupy a minimal amount of space within the device and may be less expensive to manufacture relative to scenarios where the arrays and the ultra-wideband antennas are formed on separate substrates.