公开(公告)号：US11189460B1

公开(公告)日：2021-11-30

申请号：US17091504

申请日：2020-11-06

Applicant: Applied Materials, Inc.

Inventor： Charles T. Carlson ,  Paul J. Murphy ,  Frank Sinclair ,  William Davis Lee

IPC: H01J37/317 ,  H01J37/304

Abstract: An apparatus may include an RF power assembly, arranged to output an RF signal, and a drift tube assembly, arranged to transmit an ion beam, and coupled to the RF power assembly. The drift tube assembly may include a first ground electrode; an AC drift tube assembly, disposed downstream of the first ground electrode; and a second ground electrode, disposed downstream of the AC drift tube assembly, where the AC drift tube assembly comprises at least one variable length AC drift tube.

公开(公告)号：US11117265B2

公开(公告)日：2021-09-14

申请号：US16922805

申请日：2020-07-07

Applicant: Applied Materials, Inc.

Inventor： Paul Z. Wirth ,  Charles T. Carlson ,  Jason M. Schaller

IPC: H01L21/687 ,  B25J11/00 ,  B25J9/12 ,  B25J9/00 ,  B25J9/04 ,  H01L21/677 ,  B25J15/00

Abstract: Exemplary substrate processing systems may include a transfer region housing defining a transfer region fluidly coupled with a plurality of processing regions. A sidewall of the transfer region housing may define a sealable access for providing and receiving substrates. The systems may include a transfer apparatus having a central hub including a shaft extending at a distal end through the transfer region housing into the transfer region. The transfer apparatus may include a lateral translation apparatus coupled with an exterior surface of the transfer region housing, and configured to provide at least one direction of lateral movement of the shaft. The systems may also include an end effector coupled with the shaft within the transfer region. The end effector may include a plurality of arms having a number of arms equal to a number of substrate supports of the plurality of substrate supports in the transfer region.

公开(公告)号：US20210210308A1

公开(公告)日：2021-07-08

申请号：US17212307

申请日：2021-03-25

Applicant: APPLIED Materials, Inc.

Inventor： Morgan Evans ,  Charles T. Carlson ,  Rutger Meyer Timmerman Thijssen ,  Ross Bandy ,  Ryan Magee

IPC: H01J37/305 ,  G02B5/18 ,  H01L21/3065 ,  H01L21/308 ,  B81C1/00

Abstract: A carrier proximity mask and methods of assembling and using the carrier proximity mask may include providing a first carrier body, second carrier body, and set of one or more clamps. The first carrier body may have one or more openings formed as proximity masks to form structures on a first side of a substrate. The first and second carrier bodies may have one or more contact areas to align with one or more contact areas on a first and second sides of the substrate. The set of one or more clamps may clamp the substrate between the first carrier body and the second carrier body at contact areas to suspend work areas of the substrate between the first and second carrier bodies. The openings to define edges to convolve beams to form structures on the substrate.

公开(公告)号：US10969029B2

公开(公告)日：2021-04-06

申请号：US16341703

申请日：2017-12-01

Applicant: Applied Materials, Inc.

Inventor： Charles T. Carlson ,  Tammy Jo Pride ,  Benjamin B. Riordon ,  Aaron Webb

IPC: F16K27/02 ,  F16K1/20 ,  F16K11/10 ,  F16K1/22 ,  H01L21/67

Abstract: Embodiments of the disclosure generally relate to a flapper valve. The flapper valve may be used with processing chambers, such as semiconductor substrate processing chambers. In one embodiment, a flapper valve includes a housing having a first opening at a first end thereof and a second opening at a second end thereof, a first flapper pivotably disposed in the housing, and a second flapper pivotably disposed in the housing. The first and second flappers are movable to selectively open and close at least one of the first opening and the second opening.

公开(公告)号：US10957512B1

公开(公告)日：2021-03-23

申请号：US16582249

申请日：2019-09-25

Applicant: APPLIED Materials, Inc.

Inventor： Morgan Evans ,  Charles T. Carlson ,  Rutger Meyer Timmerman Thijssen ,  Ross Bandy

IPC: H01J37/09 ,  H01J37/305

Abstract: A carrier proximity mask and methods of assembling and using the carrier proximity mask may include providing a first carrier body, second carrier body, and set of one or more clamps. The first carrier body may have one or more openings formed as proximity masks to form structures on a first side of a substrate. The first and second carrier bodies may have one or more contact areas to align with one or more contact areas on a first and second sides of the substrate. The set of one or more clamps may clamp the substrate between the first carrier body and the second carrier body at contact areas to suspend work areas of the substrate between the first and second carrier bodies. The openings to define edges to convolve beams to form structures on the substrate.

公开(公告)号：US20210013055A1

公开(公告)日：2021-01-14

申请号：US16922874

申请日：2020-07-07

Applicant: Applied Materials, Inc.

Inventor： Jason M. Schaller ,  Steve Hongkham ,  Charles T. Carlson ,  Tuan A. Nguyen ,  Swaminathan T. Srinivasan ,  Khokan Chandra Paul

IPC: H01L21/67 ,  H01L21/687

Abstract: Exemplary substrate processing systems may include a factory interface and a load lock coupled with the factory interface. The systems may include a transfer chamber coupled with the load lock. The transfer chamber may include a robot configured to retrieve substrates from the load lock. The systems may include a chamber system positioned adjacent and coupled with the transfer chamber. The chamber system may include a transfer region laterally accessible to the robot. The transfer region may include a plurality of substrate supports disposed about the transfer region. Each substrate support of the plurality of substrate supports may be vertically translatable. The transfer region may also include a transfer apparatus rotatable about a central axis and configured to engage substrates and transfer substrates among the plurality of substrate supports. The chamber system may also include a plurality of processing regions vertically offset and axially aligned with an associated substrate support.