摘要:
An optically powered MEMS gate driver includes a photovoltaic converter configured to receive a light signal from a light source and output a DC supply voltage for a MEMS gate driver in response thereto. The MEMS gate driver further includes a DC to DC converter electrically coupled to the photovoltaic converter and configured to output a line level DC voltage in response to the DC supply voltage. An electrical circuit, also included as a portion of the MEMS gate driver is electrically coupled to both the photovoltaic converter and the DC to DC converter is configured to receive the supply voltage and the line level voltage and to output a line level drive signal in response thereto. The optically powered MEMS gate driver is self-contained within a common EMI enclosure thus providing isolation between the gate driver and command signal electronics.
摘要:
A micro-electromechanical system (MEMS) switch array for power switching includes an input node, an output node, and a plurality of MEMS switches, wherein the input node and the output node are independently in electrical communication with a portion of the plurality of MEMS switches, and wherein a failure of any one of the plurality of MEMS switches does not render ineffective another MEMS switch within the MEMS switch array.
摘要:
A switching system is provided. The switching system includes electromechanical switching circuitry, such as a micro-electromechanical system switching circuitry. The system may further include solid state switching circuitry coupled in a parallel circuit with the electromechanical switching circuitry, and a controller coupled to the electromechanical switching circuitry and the solid state switching circuitry. The controller may be configured to perform selective switching of a load current between the electromechanical switching circuitry and the solid state switching circuitry in response to a load current condition appropriate to an operational capability of a respective one of the switching circuitries.
摘要:
Multi-level structures are formed in a semiconductor substrate by first forming a pattern of lines or structures of different widths. Width information on the pattern is decoded by processing steps into level information to form a MEMS structure. The pattern is etched to form structures having a first floor. The structures are oxidized until structures of thinner width are substantially fully oxidized. A portion of the oxide is then etched to expose the first floor. The first floor is then etched to form a second floor. The oxide is then optionally removed, leaving a multi-level structure. In one embodiment, high aspect ratio comb actuators are formed using the multi-level structure process.
摘要:
The present invention comprises a method for over-current protection. The method comprising monitoring a load current value of a load current passing through a plurality of micro-electromechanical switching system devices, determining if the monitored load current value varies from a predetermined load current value, and generating a fault signal in the event that the monitored load current value varies from the predetermined load current value. The method also comprises diverting the load current from the plurality of micro-electromechanical switching system, devices in response to the fault signal and determining if the variance in the load current value was due to a true fault trip or a false nuisance trip.
摘要:
A current control device is disclosed. The current control device includes control circuitry and a current path integrally arranged with the control circuitry. The current path includes a set of conduction interfaces and a micro electromechanical system (MEMS) switch disposed between the set of conduction interfaces. The set of conduction interfaces have geometry of a defined fuse terminal geometry and include a first interface disposed at one end of the current path and a second interface disposed at an opposite end of the current path. The MEMS switch is responsive to the control circuitry to facilitate the interruption of an electrical current passing through the current path.
摘要:
A gating voltage control system and method are provided for electrostatically actuating a micro-electromechanical systems (MEMS) device, e.g., a MEMS switch. The device may comprise an electrostatically responsive actuator movable through a gap for actuating the device to a respective actuating condition corresponding to one of a first actuating condition (e.g., a closed switching condition) and a second actuating condition (e.g., an open switching condition). The gating voltage control system may comprise a drive circuit electrically coupled to a gate terminal of the device to apply a gating voltage. The gating voltage control system may further comprise a controller electrically coupled to the drive circuit to control the gating voltage applied to the gating terminal in accordance with a gating voltage control sequence. The gating voltage control sequence may comprise a first interval for ramping up the gating voltage to a voltage level for producing an electrostatic force sufficient to accelerate the actuator through a portion of the gap to be traversed by the actuator to reach a respective actuating condition. The gating voltage control sequence may further comprise a second interval for ramping down the gating voltage to a level sufficient to reduce the electrostatic force acting on the movable actuator. This allows reducing the amount of force at which the actuator engages a contact for establishing the first actuating condition, or avoiding an overshoot position of the actuator while reaching the second actuating condition.
摘要:
According to some embodiments, an apparatus includes a substrate that defines a plane. The apparatus also includes a first conducting plate that is substantially normal to the substrate and a second conducting plate that is (i) substantially normal to the substrate and (ii) deformable in response to a pressure.
摘要:
According to some embodiments, an apparatus includes a substrate that defines a plane. The apparatus also includes a first conducting plate that is substantially normal to the substrate and a second conducting plate that is (i) substantially normal to the substrate and (ii) deformable in response to a pressure.
摘要:
According to some embodiments, a conducting layer is formed on a first wafer. An insulating layer is formed on a second wafer. The insulating layer includes a cavity and a conducting area may be formed in the second wafer proximate to the cavity. The side of the conducting layer opposite the first wafer is bonded to the side of the insulating layer opposite the second wafer. At least some of the first wafer is then removed, without removing at least some of the conducting layer, to form a conducting diaphragm that is substantially parallel to the second wafer. In this way, an amount of capacitance between the diaphragm and the conducting area may be measured to determine an amount of pressure being applied to the diaphragm.