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    Method of fabricating an oscillating heat pipe
    51.
    发明授权
    Method of fabricating an oscillating heat pipe 有权

    公开(公告)号：US11045912B2

    公开(公告)日：2021-06-29

    申请号：US16444600

    申请日：2019-06-18

    Applicant: Hamilton Sundstrand Corporation

    Inventor： Abbas A. Alahyari ,  Ram Ranjan ,  Jinliang Wang

    IPC: B23P15/26 ,  B33Y80/00 ,  F28D15/02 ,  B33Y10/00 ,  B33Y50/00

    Abstract: A method of fabricating an oscillating heat pipe includes building the oscillating heat pipe with a layer-by-layer additive manufacturing process such that the oscillating heat pipe includes a body of solid material, an array of channels, an evaporator portion, and a condenser portion. The array of channels are disposed in the body and define a continuous loop through which a fluid flows. The array of channels is formed by cavities in the body as the body is formed with layer-by-layer additive manufacturing. An inner surface of a channel includes a flow directing feature that is configured to promote a first direction of flow and that is configured to provide resistance against a second direction of flow that is opposite the first direction of flow.

    HEAT EXCHANGER WITH INTEGRAL FEATURES
    52.
    发明申请
    HEAT EXCHANGER WITH INTEGRAL FEATURES 审中-公开

    公开(公告)号：US20190390916A1

    公开(公告)日：2019-12-26

    申请号：US16018782

    申请日：2018-06-26

    Applicant: Hamilton Sundstrand Corporation

    Inventor： Brian St. Rock ,  Ram Ranjan

    IPC: F28D7/00 ,  F28F17/00 ,  F28F21/06

    Abstract: A counterflow heat exchanger includes a first fluid inlet, a first fluid outlet fluidly coupled to the first fluid inlet via a core section, a second fluid inlet, and a second fluid outlet fluidly coupled to the second fluid inlet via the core section. The core section includes a plurality of first fluid passages configured to convey the first fluid flow from the first fluid inlet toward the first fluid outlet, and a plurality of second fluid passages configured to convey the second fluid flow from the second fluid inlet toward the second fluid outlet such that the first fluid flow exchanges thermal energy with the second fluid flow at the core section. One or more drains are operably connected to the plurality of first fluid passages configured to remove condensation from an interior of the first fluid passages prior to the condensation reaching the first fluid outlet.

    INLET HEADER DUCT DESIGN FEATURES
    53.
    发明申请
    INLET HEADER DUCT DESIGN FEATURES 审中-公开

    公开(公告)号：US20190285368A1

    公开(公告)日：2019-09-19

    申请号：US15923614

    申请日：2018-03-16

    Applicant: Hamilton Sundstrand Corporation

    Inventor： Ram Ranjan ,  Brian St. Rock

    IPC: F28F9/22 ,  B23P15/26

    Abstract: A header duct and method of forming a header duct includes an inlet portion having a planar inlet, an outlet portion have a plurality of planar outlets, and a transition portion extending continuously from the inlet portion to the outlet portion. The transition portion has a bend and internal topography defining a non-monotonic cross-sectional area distribution between the inlet and outlet portions. The transition portion can further include a bulbous region extending in a lateral direction of the duct and a protrusion located along an inside radius of the bend.

    Advanced cooling for power module switches
    56.
    发明授权
    Advanced cooling for power module switches 有权
    电源模块开关的先进制冷

    公开(公告)号：US09220184B2

    公开(公告)日：2015-12-22

    申请号：US13836395

    申请日：2013-03-15

    Applicant: Hamilton Sundstrand Corporation

    Inventor： Ram Ranjan ,  Matthew Robert Pearson ,  Shashank Krishnamurthy

    IPC: H05K7/20 ,  H01L23/427

    CPC classification number: H05K7/20336 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A system includes an electronic device, a heat spreader with a vapor chamber attached to a bottom end of the electronic device, so that heat flows from the electronic device to the heat spreader, and a heat sink with microchannels running through it attached to a bottom end of the heat spreader, so that heat from the heat spreader flows through the heat sink and to an ambient. A method for cooling a device includes transferring heat generated by a device through a conductivity layer, spreading the heat through a heat spreader, transferring the heat from the heat spreader to a heat sink that contains microchannels, and releasing the heat from the heat sink into an ambient.

    Abstract translation: 一种系统包括电子装置，具有连接到电子装置的底端的蒸气室的散热器，使得热量从电子装置流到散热器，以及具有微通道的散热器，其连接到底部 散热器的端部，使得来自散热器的热量流过散热器并流到环境中。 一种用于冷却装置的方法包括：通过传导层传递由装置产生的热量，通过散热器传播热量，将热量从散热器传递到包含微通道的散热器，并将热量从散热片释放出来 一个环境

    ADVANCED COOLING FOR POWER MODULE SWITCHES
    57.
    发明申请
    ADVANCED COOLING FOR POWER MODULE SWITCHES 有权
    电源模块开关的先进冷却

    公开(公告)号：US20140268572A1

    公开(公告)日：2014-09-18

    申请号：US13836395

    申请日：2013-03-15

    Applicant: HAMILTON SUNDSTRAND CORPORATION

    Inventor： Ram Ranjan ,  Matthew Robert Pearson ,  Shashank Krishnamurthy

    IPC: H05K7/20

    CPC classification number: H05K7/20336 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A system includes an electronic device, a heat spreader with a vapor chamber attached to a bottom end of the electronic device, so that heat flows from the electronic device to the heat spreader, and a heat sink with microchannels running through it attached to a bottom end of the heat spreader, so that heat from the heat spreader flows through the heat sink and to an ambient. A method for cooling a device includes transferring heat generated by a device through a conductivity layer, spreading the heat through a heat spreader, transferring the heat from the heat spreader to a heat sink that contains microchannels, and releasing the heat from the heat sink into an ambient.

    Abstract translation: 一种系统包括电子装置，具有连接到电子装置的底端的蒸气室的散热器，使得热量从电子装置流到散热器，以及具有微通道的散热器，其连接到底部 散热器的端部，使得来自散热器的热量流过散热器并流到环境中。 一种用于冷却装置的方法包括：通过传导层传递由装置产生的热量，通过散热器传播热量，将热量从散热器传递到包含微通道的散热器，并将热量从散热片释放出来 一个环境

    THERMAL MANAGEMENT SYSTEM FOR FUTURE VERTICAL LIFT AIRCRAFT
    58.
    发明申请
    THERMAL MANAGEMENT SYSTEM FOR FUTURE VERTICAL LIFT AIRCRAFT 有权

    公开(公告)号：US20250153852A1

    公开(公告)日：2025-05-15

    申请号：US18506775

    申请日：2023-11-10

    Applicant: Hamilton Sundstrand Corporation

    Inventor： Raphael Mandel ,  Joseph E. Turney ,  Ram Ranjan ,  Matthew L. Pess

    IPC: B64D13/06

    Abstract: A thermal management system for an aircraft includes a liquid loop, a vapor compression cycle loop, and an air loop. The liquid loop includes a pump to deliver a working fluid a cold sink for cooling a heat load with the working fluid. The vapor compression cycle loop is fluidly coupled to the liquid loop by a separator. The separator is configured to separate a two-phase form of the working fluid into a vapor form of the working fluid for delivery to a compressor of the vapor compression cycle loop and a liquid form of the working fluid for delivery to the liquid loop. The air loop in thermal communication with the working fluid and configured to provide a cooling or heating air for an aircraft cabin.

    Stable pumped two-phase cooling
    59.
    发明授权
    Stable pumped two-phase cooling 有权

    公开(公告)号：US12302541B2

    公开(公告)日：2025-05-13

    申请号：US17944641

    申请日：2022-09-14

    Applicant: Hamilton Sundstrand Corporation

    Inventor： Joseph E. Turney ,  Raphael Mandel ,  Ram Ranjan

    IPC: H05K7/20

    Abstract: Cooling systems include a cold sink having a number of heat load cooling paths and a heat load associated with each cooling path. An inlet is configured to supply a cooling fluid into the cold sink and an outlet is configured to receive the cooling fluid after passing through the plurality of heat load cooling paths of the cold sink. A pressure regulating element is arranged along each cooling path, each pressure regulating element arranged between the inlet and the heat load along each cooling path and configured to cause a pressure drop in the cooling fluid prior to passing the cooling fluid to each heat load. The pressure drop caused by each pressure regulating element is the same and is a pressure drop greater than a maximum pressure drop across each heat load of a system without such pressure regulating elements.

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