公开(公告)号：US09220184B2

公开(公告)日：2015-12-22

申请号：US13836395

申请日：2013-03-15

Applicant: Hamilton Sundstrand Corporation

Inventor： Ram Ranjan ,  Matthew Robert Pearson ,  Shashank Krishnamurthy

IPC: H05K7/20 ,  H01L23/427

CPC classification number: H05K7/20336 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A system includes an electronic device, a heat spreader with a vapor chamber attached to a bottom end of the electronic device, so that heat flows from the electronic device to the heat spreader, and a heat sink with microchannels running through it attached to a bottom end of the heat spreader, so that heat from the heat spreader flows through the heat sink and to an ambient. A method for cooling a device includes transferring heat generated by a device through a conductivity layer, spreading the heat through a heat spreader, transferring the heat from the heat spreader to a heat sink that contains microchannels, and releasing the heat from the heat sink into an ambient.

Abstract translation: 一种系统包括电子装置，具有连接到电子装置的底端的蒸气室的散热器，使得热量从电子装置流到散热器，以及具有微通道的散热器，其连接到底部 散热器的端部，使得来自散热器的热量流过散热器并流到环境中。 一种用于冷却装置的方法包括：通过传导层传递由装置产生的热量，通过散热器传播热量，将热量从散热器传递到包含微通道的散热器，并将热量从散热片释放出来 一个环境

公开(公告)号：US20140268572A1

公开(公告)日：2014-09-18

申请号：US13836395

申请日：2013-03-15

Applicant: HAMILTON SUNDSTRAND CORPORATION

Inventor： Ram Ranjan ,  Matthew Robert Pearson ,  Shashank Krishnamurthy

IPC: H05K7/20

CPC classification number: H05K7/20336 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A system includes an electronic device, a heat spreader with a vapor chamber attached to a bottom end of the electronic device, so that heat flows from the electronic device to the heat spreader, and a heat sink with microchannels running through it attached to a bottom end of the heat spreader, so that heat from the heat spreader flows through the heat sink and to an ambient. A method for cooling a device includes transferring heat generated by a device through a conductivity layer, spreading the heat through a heat spreader, transferring the heat from the heat spreader to a heat sink that contains microchannels, and releasing the heat from the heat sink into an ambient.

Abstract translation: 一种系统包括电子装置，具有连接到电子装置的底端的蒸气室的散热器，使得热量从电子装置流到散热器，以及具有微通道的散热器，其连接到底部 散热器的端部，使得来自散热器的热量流过散热器并流到环境中。 一种用于冷却装置的方法包括：通过传导层传递由装置产生的热量，通过散热器传播热量，将热量从散热器传递到包含微通道的散热器，并将热量从散热片释放出来 一个环境

公开(公告)号：US20170294397A1

公开(公告)日：2017-10-12

申请号：US15093886

申请日：2016-04-08

Applicant: Hamilton Sundstrand Corporation

Inventor： Paul F. Croteau ,  Sergei F. Burlatsky ,  Shashank Krishnamurthy

IPC: H01L23/00

CPC classification number: H01L24/32 ,  H01L24/03 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/03505 ,  H01L2224/2731 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/2741 ,  H01L2224/27505 ,  H01L2224/29005 ,  H01L2224/29017 ,  H01L2224/2908 ,  H01L2224/29082 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29164 ,  H01L2224/29294 ,  H01L2224/29311 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/2938 ,  H01L2224/29384 ,  H01L2224/2939 ,  H01L2224/29393 ,  H01L2224/29439 ,  H01L2224/2949 ,  H01L2224/3201 ,  H01L2224/32053 ,  H01L2224/32054 ,  H01L2224/32055 ,  H01L2224/32058 ,  H01L2224/32225 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/32501 ,  H01L2224/83055 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/8384 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/00012

Abstract: A die and substrate assembly is disclosed for a die with electronic circuitry and a substrate. A sintered bonding layer of sintered metal is disposed between the die and the substrate. The sintered bonding layer includes a plurality of zones having different sintered metal densities. The plurality of zones are distributed along one or more horizontal axes of the sintered bonding layer, along one or more vertical axes of the sintered bonding layer or along both one or more horizontal and one or more vertical axes of the sintered bonding layer.