公开(公告)号：US08680689B1

公开(公告)日：2014-03-25

申请号：US13644269

申请日：2012-10-04

Applicant: International Business Machines Corporation

Inventor： Timothy H. Daubenspeck ,  Hanyi Ding ,  Wolfgang Sauter ,  Guoan Wang ,  Wayne H. Woods, Jr.

IPC: H01L21/31

CPC classification number: H01P3/003 ,  H01L23/66 ,  H01L25/0657 ,  H01L2223/6627 ,  H01L2224/16225 ,  H01L2225/06513 ,  H01P5/028

Abstract: An approach for a coplanar waveguide structure in stacked multi-chip systems is provided. A method of manufacturing a semiconductor structure includes forming a first coplanar waveguide in a first chip. The method also includes forming a second coplanar waveguide in a second chip. The method further includes directly connecting the first coplanar waveguide to the second coplanar waveguide using a plurality of chip-to-chip connections.

Abstract translation: 提供了一种叠层多芯片系统中共面波导结构的方法。 制造半导体结构的方法包括在第一芯片中形成第一共面波导。 该方法还包括在第二芯片中形成第二共面波导。 该方法还包括使用多个芯片至芯片连接将第一共面波导直接连接到第二共面波导。

公开(公告)号：US20140049325A1

公开(公告)日：2014-02-20

申请号：US14067122

申请日：2013-10-30

Applicant: International Business Machines Corporation

Inventor： Hanyi Ding ,  Kwan Him Lam

IPC: H03F3/68

CPC classification number: H03F3/68 ,  H01P5/186 ,  H03D3/007 ,  H03F3/602

Abstract: A Lange coupler having a first plurality of lines on a first level and a second plurality of lines on a second level. At least one line on the first level is cross-coupled to a respective line on the second level via electromagnetic waves traveling through the first and second plurality of lines. The first and second plurality of lines may be made of metal, and the first level may be higher than the second level. A substrate may be provided into which the first and second plurality of lines are etched so as to define an on-chip Lange coupler.

Abstract translation: Lange耦合器，其具有在第一电平上的第一多个线，而在第二电平上具有第二多个线。 在第一级上的至少一条线通过在第一和第二条线上行进的电磁波交叉耦合到第二电平上的相应线。 第一和第二多个线可以由金属制成，并且第一电平可以高于第二电平。 可以提供衬底，其中蚀刻第一和第二多条线以便限定片上朗格耦合器。