公开(公告)号：US20050046920A1

公开(公告)日：2005-03-03

申请号：US10697766

申请日：2003-10-30

申请人： William Freeman ,  David Rosseinsky ,  Hong Jiang ,  Andrew Soutar

发明人： William Freeman ,  David Rosseinsky ,  Hong Jiang ,  Andrew Soutar

IPC分类号： G02F1/15 ,  G02F1/163

CPC分类号： G02F1/163 ,  G02F2201/58

摘要： A system and method for controlling an electrochromic device is provided. The system comprises a light source that produces an input light signal, and an electrochromic window configured to attenuate the input light signal by a certain amount and transmit a resulting attenuated light signal. An optical detector is configured to detect an optical property of the attenuated light signal, and a power module is connected to the electrochromic window and the detector. The power module generates a pulse-width modulated power signal and inputs the power signal to the electrochromic window. The power signal is modulated by an amount based on the detected optical property of the attenuated light signal. A control circuit for an electrochromic device is also disclosed.

公开(公告)号：US20050045702A1

公开(公告)日：2005-03-03

申请号：US10738695

申请日：2003-12-17

申请人： William Freeman ,  Hong Jiang

发明人： William Freeman ,  Hong Jiang

IPC分类号： B23K1/00 ,  B23K31/02 ,  H01L35/30 ,  H01L35/32

CPC分类号： H01L35/32 ,  B23K1/0016 ,  B23K31/02 ,  B23K2101/40 ,  H01L35/30 ,  H01L35/325

摘要： A method of and intermediate structures for manufacturing a thermoelectric module are disclosed. A first and second intermediate structure are each formed by providing a substrate, bonding a wafer to the substrate, and removing a portion of the wafer to leave behind a plurality of thermoelectric elements extending outwardly from the substrate. The portion of the wafer can be removed by precision cutting methods such as, but not limited to, slicing, dicing, laser ablation, and the like. The substrate has a metallized pattern formed thereon. The wafers of the first and second intermediate structures are formed from different conductive materials. N-type and P-type bismuth telluride are examples of thermoelectric materials having different conductivities. The first intermediate structure and second intermediate structure are aligned, brought adjacent each other, and bonded together such that the elements are in electrical communication appropriate to thermoelectric module function.

摘要翻译： 公开了一种用于制造热电模块的方法和中间结构。 第一和第二中间结构各自通过提供衬底，将晶片粘合到衬底上，以及去除晶片的一部分以留下从衬底向外延伸的多个热电元件来形成。 可以通过精密切割方法（例如但不限于切片，切割，激光烧蚀等）来去除晶片的部分。 衬底具有形成在其上的金属化图案。 第一和第二中间结构的晶片由不同的导电材料形成。 N型和P型碲化铋是具有不同电导率的热电材料的实例。 第一中间结构和第二中间结构对准，彼此相邻并且结合在一起，使得元件电连通以适合于热电模块功能。

公开(公告)号：US20050011669A1

公开(公告)日：2005-01-20

申请号：US10740241

申请日：2003-12-17

申请人： William Freeman ,  Hong Jiang

发明人： William Freeman ,  Hong Jiang

IPC分类号： H01L21/48 ,  H01L21/58 ,  H05K1/03 ,  H05K3/46

CPC分类号： H01L24/26 ,  H01L21/48 ,  H01L24/83 ,  H01L2224/8385 ,  H01L2224/83894 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/0306 ,  H05K3/4629 ,  H05K2201/0179 ,  H01L2924/00

摘要： Exemplary embodiments of the present invention are drawn to improved systems and process for anodically bonding multiple substrate wafers to each other at low temperatures. At least one circuit wafer having printed circuits thereon is bonded to an interposer wafer by applying an amorphous thin film between the wafers. A low voltage is applied across the wafers to heat the wafers and to cause bonding of the wafers. Multiple circuit and interposer wafers can be used. The bonding temperature is low enough that soldered connections on the circuit wafers will not flow or otherwise distort, thus maintaining electrical integrity.

摘要翻译： 本发明的示例性实施例涉及在低温下将多个衬底晶片彼此阳极结合的改进的系统和工艺。 其上具有印刷电路的至少一个电路晶片通过在晶片之间施加无定形薄膜而与内插器晶片接合。 跨晶片施加低电压以加热晶片并引起晶片的结合。 可以使用多电路和插入晶片。 接合温度足够低，电路晶片上的焊接连接不会流动或以其他方式扭曲，从而保持电气完整性。

公开(公告)号：US06715173B2

公开(公告)日：2004-04-06

申请号：US09792135

申请日：2001-02-22

申请人： Bruce G. Barman ,  William Freeman ,  David Crist

发明人： Bruce G. Barman ,  William Freeman ,  David Crist

IPC分类号： A47C2700

CPC分类号： A47C21/026 ,  A47C31/105 ,  Y10S5/925

摘要： A modular sleep system has a foundation unit, an support unit having an innerspring and a support surface covered with a friction material, and a comfort unit having compressible material encapsulated in a woven upholstery material which is engaged by the friction material on the support surface of the support unit to prevent lateral movement or sliding of the comfort unit relative to the support unit, without any fasteners between the support unit and the comfort unit. The comfort unit can be lifted vertically off of the support unit without release or use of any fasteners, to be turned over, fluffed or exchanged for a different comfort unit having different layers of internal materials, feature layers, and support characteristics.

摘要翻译： 模块化睡眠系统具有基础单元，支撑单元具有内挤压件和覆盖有摩擦材料的支撑表面，以及舒适单元，其具有封装在编织内饰材料中的可压缩材料，所述舒适单元由摩擦材料与支撑表面上的摩擦材料接合 所述支撑单元防止所述舒适单元相对于所述支撑单元的侧向移动或滑动，而在所述支撑单元和所述舒适单元之间没有任何紧固件。 舒适单元可以从支撑单元垂直地提升，而不会释放或使用任何紧固件，翻转，起毛或更换具有不同层内部材料，特征层和支撑特征的不同舒适单元。

公开(公告)号：US06263533B1

公开(公告)日：2001-07-24

申请号：US09586164

申请日：2000-06-02

申请人： Said Dimitry ,  William Freeman

发明人： Said Dimitry ,  William Freeman

IPC分类号： A47C2705

CPC分类号： A47C27/066

摘要： Extruded foam reinforcement pieces are described for assembly in connection with innerspring assemblies and mattresses. The pieces have optimized cross-sectional configurations which can be consistently extruded in continuous strands which are then cut to length according to the type and size of innerspring assembly. The pieces are configured to engage various components of the innerspring, including spring coils, spaces between spring coils, and framing borderwires. The foam reinforcement pieces facilitate attachment and alignment of overlying material such as padding and upholstery and function to improve the support characteristics of an innerspring. Various embodiments of extruded foam reinforcement pieces include a support element configured to attach about the exterior of a single coil at a corner of an innerspring; a relatively short span side wall support which engages vertically between coils adjacent a vertical side wall of the innerspring; and a tapered edge structure configured to fit over side edges of an innerspring, with padding and upholstery attachable over each of the various foam reinforcement structures to improve the form and strength of an innerspring assembly.

摘要翻译： 挤压泡沫增强件被描述为与内弹簧组件和床垫结合在一起。 这些部件具有优化的横截面构造，其可以连续地挤出在连续的股线中，然后根据内弹簧组件的类型和尺寸将其切割成长度。 这些部件构造成接合内弹簧的各种部件，包括弹簧线圈，弹簧线圈之间的空间和框架边框线。 泡沫增强件促进了覆盖材料（例如衬垫和内饰）的附接和对准，并且具有改善内弹簧支撑特性的功能。 挤出泡沫增强件的各种实施例包括支撑元件，该支撑元件构造成在内弹簧的角部处附接在单个线圈的外部; 相对短的侧壁支撑件，其垂直地接合在内弹簧的垂直侧壁之间的线圈之间; 以及锥形边缘结构，其构造成装配在内弹簧的侧边缘上，衬垫和装饰件可附接到每个各种泡沫增强结构上以改善内弹簧组件的形状和强度。